HD 307.3.2 S2:1997

Specification for solventless polymerisable resinous compounds used for electrical insulation - Part 3: Specifications for individual materials - Sheet 2: Quartz filled epoxy resinous compounds

Contains the requirements for quartz filled epoxy resinous compounds in the cured form.

Bestimmung für lösemittelfreie härtbare Reaktionsharzmassen für die Elektroisolierung - Teil 3: Anforderungen an einzelne Werkstoffe - Blatt 2: Mit Quarzmehl gefüllte Epoxidharzwerkstoffe

Spécification relative aux composés résineux polymérisables sans solvant utilisés comme isolants électriques - Partie 3: Spécifications pour les matériaux particuliers - Feuille 2: Composés résineux époxydes chargés de silice

Contient les prescriptions applicables aux composés résineux époxydes chargés de silice à l'état durci.

Specification for solventless polymerisable resinous compounds used for electrical insulation - Part 3: Specifications for individual materials - Sheet 2: Quartz filled epoxy resinous compounds (IEC 60455-3-2:1987 + IEC 60455-3-2:1987/A1:1994)

General Information

• Status: Withdrawn
• Publication Date: 15-May-1997
• ICS: 29.040.20 - Insulating gases
• Technical Committee: CLC/SR 15 - Insulating materials
• Drafting Committee: IEC/TC 15 - IEC_TC_15
• Parallel Committee: IEC/SC 15C - IEC_SC_15C
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Completion Date: 01-Jun-2006
• Ref Project: SIST HD 307.3.2 S2:1998 - Specification for solventless polymerisable resinous compounds used for electrical insulation -- Part 3: Specifications for individual materials -- Sheet 2: Quartz filled epoxy resinous compounds

Relations

• Replaced By: EN 60455-3-2:2003 - Resin based reactive compounds used for electrical insulation - Part 3: Specifications for individual materials - Sheet 2: Quartz filled epoxy resinous compounds
• Effective Date: 29-Jan-2023