prEN IEC 63551-6:2026
(Main)Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 6: Visual imaging devices
General Information
- Abstract
- Status
- Not Published
- Publication Date
- 07-Feb-2028
- Technical Committee
- CLC/TC 47X - Semiconductor devices and trusted chips
- Current Stage
- 4020 - Enquiry circulated - Enquiry
- Start Date
- 17-Jul-2026
- Due Date
- 30-Jun-2025
- Completion Date
- 17-Jul-2026
Overview
prEN IEC 63551-6:2026 defines standardized testing conditions and methods for evaluating the performance of visual imaging devices used in semiconductor devices for autonomous vehicles. Developed by the International Electrotechnical Commission (IEC) Technical Committee 47 (Semiconductor Devices) and circulated for parallel voting through CLC, this part of the standard focuses specifically on chip-scale testing methodologies for image sensors, including CMOS and CCD arrays integrated with lens systems. These visual imaging devices are essential for the environmental perception systems of autonomous vehicles, converting visible-light signals into digital image data.
The standard establishes requirements for test equipment, environmental conditions, and detailed methods to ensure the reliable and repeatable measurement of key imaging characteristics crucial to autonomous driving applications.
Key Topics
Scope of Standardization:
The document applies to performance testing of visual imaging devices in autonomous vehicles, covering the procedures necessary to measure image quality and sensor behavior under various operating conditions.Standard Testing Equipment:
Required equipment includes:- Goniometers for precise angular measurements (360° rotation).
- Uniform surface and collimated D65 light sources.
- LED light sources with specified PWM frequencies and duty cycles.
- Spectral tunable light sources (300 nm-1700 nm).
- Environmental control for temperature, humidity, and pressure.
Controlled Testing Environment:
- Standard test labs must maintain controlled temperature (25°C ± 2°C), humidity (40%-70%), pressure (86-106 kPa), and low ambient light (≤0.01 lux).
Defined Device Under Test (DUT) Conditions:
- Nominal operating voltages with ±5% tolerance.
- Proper alignment and distance to light sources for consistent field of view coverage.
Essential Test Methods:
The standard details measurement procedures for:- Frame rate and effective pixel count (resolution, fps)
- Photo response and dynamic range (grey scale vs. irradiance)
- Visual noise (temporal variance)
- Response non-linearity
- Photo response non-uniformity (PRNU)
- Signal-to-noise ratio (SNR)
- LED flicker mitigation techniques
- Angular and spectral response (performance at different incident angles and wavelengths)
- Additional parameters: field of view, distortion, ghost image, motion blur, spatial frequency response
Applications
prEN IEC 63551-6:2026 supports the design, evaluation, and quality assurance of image sensors in the rapidly advancing autonomous vehicle sector. By employing standardized chip-scale testing methods, automotive manufacturers and suppliers can:
- Ensure consistent and objective comparisons of visual imaging device performance.
- Validate sensor compliance with critical safety, image quality, and perception requirements for self-driving cars.
- Streamline R&D and manufacturing quality control for camera modules and integrated sensor systems.
- Facilitate market acceptance and regulatory approval by relying on internationally recognized testing protocols.
Adoption of these testing procedures helps in identifying and mitigating risks such as image noise, flicker artifacts from LED lighting, limitations in dynamic range, and angular response issues, all of which are crucial for reliable ADAS (Advanced Driver Assistance Systems) and full autonomous vehicle operation.
Related Standards
- ISO 12233:2023
Photography – Electronic still picture imaging – Resolution and spatial frequency responses - ISO 15739:2013
Photography – Electronic still-picture imaging – Noise measurements
These documents provide complementary measurement techniques for digital imaging performance and are referenced throughout prEN IEC 63551-6:2026.
Keywords: chip-scale testing, visual imaging devices, semiconductor devices, autonomous vehicles, image sensor testing, IEC 63551-6, quality assurance, image quality, automotive camera sensors, perception systems, dynamic range, signal-to-noise ratio, LED flicker, PRNU, ISO 12233, ISO 15739.
Frequently Asked Questions
prEN IEC 63551-6:2026 is a draft published by CLC. Its full title is "Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 6: Visual imaging devices". This standard covers: Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 6: Visual imaging devices
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 6: Visual imaging devices
prEN IEC 63551-6:2026 is classified under the following ICS (International Classification for Standards) categories: 31.080.99 - Other semiconductor devices. The ICS classification helps identify the subject area and facilitates finding related standards.
prEN IEC 63551-6:2026 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2026
Polprevodniški elementi - Preskušanje na ravni čipa za avtonomna vozila - 6. del:
Naprave za vizualno slikanje
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 6: Visual
imaging devices
Ta slovenski standard je istoveten z: prEN IEC 63551-6:2026
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
47/3021/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 63551-6 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2026-07-17 2026-10-09
SUPERSEDES DOCUMENTS:
47/2978/CD, 47/3004/CC
IEC TC 47 : SEMICONDUCTOR DEVICES
SECRETARIAT: SECRETARY:
Korea, Republic of Mr Cheolung Cha
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of
which they are aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some
Countries” clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is
the final stage for submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 6: Visual
Imaging devices
PROPOSED STABILITY DATE: 2032
NOTE FROM TC/SC OFFICERS:
download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National
Committee positions. You may not copy or "mirror" the file or printed version of the document, o r any part of it,
for any other purpose without permission in writing from IEC.
IEC CDV 63551-6 © IEC 2026
2 CONTENTS
4 FOREWORD . 4
5 1 Scope . 6
6 2 Normative references . 6
7 3 Terms, definitions and abbreviations . 6
8 3.1 Terms and definitions. 6
9 3.2 Abbreviations . 7
10 4 Standard testing equipment . 7
11 5 Standard testing conditions . 8
12 5.1 Standard testing environmental conditions . 8
13 5.2 Standard testing room conditions . 8
14 5.3 Standard DUT conditions . 8
15 5.4 Standard setup conditions . 8
16 5.4.1 Standard setup conditions with a surface light source . 8
17 5.4.2 Standard setup conditions for angular response testing . 9
18 6 Testing methods . 9
19 6.1 Frame rate and effective pixel . 9
20 6.1.1 Purpose . 9
21 6.1.2 Testing conditions . 9
22 6.1.3 Testing method . 10
23 6.1.4 Report . 10
24 6.2 Photo response and dynamic range (DR) . 10
25 6.2.1 Purpose . 10
26 6.2.2 Testing conditions . 10
27 6.2.3 Testing method . 10
28 6.2.4 Report . 11
29 6.3 Visual noise . 11
30 6.3.1 Purpose . 11
31 6.3.2 Testing conditions . 12
32 6.3.3 Testing method . 12
33 6.3.4 Report . 12
34 6.4 Response non-linearity . 12
35 6.4.1 Purpose . 12
36 6.4.2 Testing conditions . 12
37 6.4.3 Testing method . 13
38 6.4.4 Report . 13
39 6.5 Photo response non-uniformity (PRNU) . 13
40 6.5.1 Purpose . 13
41 6.5.2 Testing conditions . 13
42 6.5.3 Testing method . 13
43 6.5.4 Report . 14
44 6.6 Photo response defects . 14
45 6.6.1 Purpose . 14
46 6.6.2 Testing conditions . 14
IEC CDV 63551-6 © IEC 2026
47 6.6.3 Testing method . 14
48 6.6.4 Report . 15
49 6.7 Signal-to-noise ratio (SNR) . 15
50 6.7.1 Purpose . 15
51 6.7.2 Testing conditions . 15
52 6.7.3 Testing method . 15
53 6.7.4 Report . 15
54 6.8 LED flicker mitigation . 16
55 6.8.1 Purpose . 16
56 6.8.2 Testing conditions . 16
57 6.8.3 Testing method . 16
58 6.8.4 Report . 17
59 6.9 Angular response . 17
60 6.9.1 Purpose . 17
61 6.9.2 Testing conditions . 17
62 6.9.3 Testing method . 18
63 6.9.4 Report . 18
64 6.10 Spectral response . 19
65 6.10.1 Purpose . 19
66 6.10.2 Testing conditions . 19
67 6.10.3 Testing method . 19
68 6.10.4 Report . 20
69 Annex A (informative) . 21
70 A.1 Standard testing equipment . 21
71 A.2 Standard setup conditions . 21
72 A.2.1 Standard setup conditions with a test chart . 21
73 A.2.2 Standard setup conditions for ghost image testing . 21
74 A.3 Testing methods . 22
75 A.3.1 Field of view (FOV) . 22
76 A.3.2 Distortion . 23
77 A.3.3 Ghost image . 24
78 Annex B (informative) . 25
79 B.1 Standard setup conditions . 25
80 B.1.1 Standard setup conditions for motion blur testing . 25
81 B.2 Testing methods . 25
82 B.2.1 Spatial frequency response (SFR) . 25
83 B.2.2 Motion blur . 26
84 B.2.3 Low-illuminance resolution . 26
85 Bibliography . 28
87 Figure 1 – Standard setup with a light source . 10
88 Figure 2 – Standard setup for angular response testing . 10
89 Figure 3 – The curve of photo response . 12
90 Figure 4 – The curve of photo response and response non-linearity . 14
91 Figure 5 – The curve of angular response . 19
92 Figure 6 – Spectral response curve of the black-and-white image sensor . 20
IEC CDV 63551-6 © IEC 2026
93 Figure 7 – Spectral response curve of the color image sensor . 21
94 Figure A.1 – Standard setup with a test chart . 22
95 Figure A.2 – Standard setup for ghost image testing . 23
96 Figure A.3 – An example of a grid test chart . 24
97 Figure A.4 – Grid dimensions in undistorted and distorted images . 24
98 Figure B.1 – Standard setup for motion blur testing . 26
100 Table 1 – PWM frequency and duty cycle of LED light sources . 9
IEC CDV 63551-6 © IEC 2026
103 INTERNATIONAL ELECTROTECHNICAL COMMISSION
104 ____________
106 Semiconductor devices – Chip-scale testing for autonomous vehicles -
107 Part 6: Visual imaging devices
110 FOREWORD
111 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
112 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
113 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
114 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
115 Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
116 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
117 may participate in this preparatory work. International, governmental and non-governmental organizations liaising
118 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
119 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
120 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
121 consensus of opinion on the relevant subjects since each technical committee has representation from all
122 interested IEC National Committees.
123 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
124 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
125 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
126 misinterpretation by any end user.
127 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
128 transparently to the maximum extent possible in their national and regional publications. Any divergence between
129 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
130 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
131 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
132 services carried out by independent certification bodies.
133 6) All users should ensure that they have the latest edition of this publication.
134 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
135 members of its technical committees and IEC National Committees for any personal injury, property damage or
136 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
137 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
138 Publications.
139 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
140 indispensable for the correct application of this publication.
141 9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
142 patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
143 respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
144 may be required to implement this document. However, implementers are cautioned that this may not represent
145 the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
146 shall not be held responsible for identifying any or all such patent rights.
147 IEC 63551-6 has been prepared by IEC technical committee TC47: Semiconductor devices. It
148 is an International Standard.
149 The text of this International Standard is based on the following documents:
Draft Report on voting
XX/XX/FDIS XX/XX/RVD
151 Full information on the voting for its approval can be found in the report on voting indicated in
152 the above table.
153 The language used for the development of this International Standard is English.
154 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
155 accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
IEC CDV 63551-6 © IEC 2026
156 at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
157 described in greater detail at www.iec.ch/publications.
158 The committee has decided that the contents of this document will remain unchanged until the
159 stability date indicated on the IEC website under webstore.iec.ch in the data related to the
160 specific document. At this date, the document will be
161 • reconfirmed,
162 • withdrawn,
163 • replaced by a revised edition, or
164 • amended.
IEC CDV 63551-6 © IEC 2026
168 Semiconductor devices – Chip-scale testing for autonomous vehicles
169 Part 6: Visual imaging devices
173 1 Scope
174 This part of IEC 63551 specifies the standard testing conditions and testing methods that can
175 be used to evaluate and determine the performance of visual imaging devices used in
176 autonomous vehicles. This document applies to the performance testing for visual imaging
177 devices used in autonomous vehicles.
178 2 Normative references
179 The following documents are referred to in the text in such a way that some or all of their content
180 constitutes requirements of this document. For dated references, only the edition cited applies.
181 For undated references, the latest edition of the referenced document (including any
182 amendments) applies.
183 ISO 12233:2023, Photography – Electronic still picture imaging – Resolution and spatial
184 frequency responses
185 ISO 15739:2013, Photography – Electronic still-picture imaging – Noise measurements
186 3 Terms, definitions and abbreviations
187 For the purposes of this document, the following terms and definitions apply.
188 ISO and IEC maintain terminology databases for use in standardization at the following
189 addresses:
190 • IEC Electropedia: available at https://www.electropedia.org/
191 • ISO Online browsing platform: available at https://www.iso.org/obp
192 3.1 Terms and definitions
193 3.1.1
194 visual imaging devices
195 essential photoelectric conversion components in autonomous vehicles, transforming
196 environmental visible - light signals into digital image data. As fundamental sensing units, they
197 provide raw visual inputs for environmental perception systems and are typically implemented
198 through visible - light - sensitive CMOS or CCD sensor arrays. With the advancement of
199 packaging technology, devices that integrate lenses with CMOS or CCD sensor arrays in a
200 single package are also considered as visual imaging devices.
201 3.1.2
202 effective pixel
203 pixel that captures image data
204 3.1.3
205 signal-to-noise ratio
206 SNR
207 ratio of the output signal to the mean noise level, at a particular signal level
208 3.1.4
209 LED flicker
210 flicker in the image of a pulsed light source or objects illuminated by a pulsed light source
211 because the exposure time of the visual imaging module does not coincide with the pulses of
212 the light source
IEC CDV 63551-6 © IEC 2026
213 Note 1 to entry: Although the term “LED flicker” is used conventionally, the phenomenon of flicker is not confined
214 to LED light sources but any pulsed light source.
215 3.1.5
216 spatial frequency response
217 SFR
218 relative amplitude response of an imaging system as a function of input spatial frequency
219 Note 1 to entry: The SFR is normally represented by a curve of the output response to an input sinusoidal spatial
220 luminance distribution of unit amplitude, over a range of spatial frequencies. The SFR is divided by its value at the
221 spatial frequency of 0 as normalization to yield a value of 1,0 at a spatial frequency of 0.
222 [SOURCE: ISO 12233:2023]
223 3.1.6
224 ghost image
225 undesired extra image formed by light reflected inside the module from a high-luminance source
226 3.2 Abbreviations
227 DR dynamic range
228 DUT device under test
229 FDI Flicker Detection Index
230 FMC Flicker Michelson Contrast
231 FOV field of view
232 LED light-emitting diode
233 LRI Luminance Retention Index
234 PRNU photo response non-uniformity
235 PWM pulse width modulation
236 RPS round per second
237 SFR spatial frequency response
238 SNR signal-to-noise ratio
240 4 Standard testing equipment
241 The standard testing equipment are as the followings:
242 a) goniometer: The goniometer shall independently rotate around horizontal and vertical axes,
243 enabling adjustment of the yaw angle (horizontal rotation) or pitch angle (vertical rotation)
244 of the DUT relative to its initial position. The goniometer shall achieve full 360° rotation
245 around each axis. The available angular speed for rotation around both axes should be up
246 to 2 RPS.
247 b) surface light sources: The surface light source shall be a uniform surface light source. The
248 spectral distribution characteristics of the light source shall conform to the standard D65
249 illuminant. It shall have continuously tunable luminance. The light source shall emit light
250 uniformly across the surface. The spatial variance in illuminance shall be less than 2%.
251 c) LED light sources: The LED light sources shall be PWM lights with colour temperature
252 6000K. They shall emit light uniformly throughout the surface and the spatial variance in
253 illuminance shall be less than 2%. The PWM frequencies and duty cycles are listed in Table
254 1.
255 Table 1 – PWM frequency and duty cycle of LED light sources
Light source name PWM frequency Duty cycle Note
IEC CDV 63551-6 © IEC 2026
Approximate threshold for
Light source 1 30 Hz 20%
human vision.
Light source 2 60 Hz 20% Typical for traffic lights.
Typical for signal lights and
Light source 3 90 Hz 20%
traffic signage.
Typical for tail lights on
Light source 4 200 Hz 20%
vehicles.
Light source 5 400 Hz 20% Typical for tail lights on cars.
257 d) collimated light source: The collimated light sources shall be able to offer a beam of light
258 with a relatively constant cross-section along its path. The spectral distribution
259 characteristics of the light source shall conform to the standard D65 illuminant. The
260 divergence angle of the emitted light shall be less than 2°.
261 e) spectral tunable light source: The spectral tunable light source shall be capable of emitting
262 light with a continuously adjustable spectrum spanning from 300 nm to 1700 nm. The
263 spectral tuning shall operate with a step size no greater than 5 nm, a full width at half
264 maximum of ≤5 nm, and a wavelength accuracy of ±1 nm.
265 5 Standard testing conditions
266 5.1 Standard testing environmental conditions
267 The standard testing environmental conditions are as the following:
268 – Environment temperature: 25 ºC ± 2 ºC;
269 – Relative humidity: 40 % to 70 %;
270 – Atmospheric pressure: 86 kPa to 106 kPa.
271 5.2 Standard testing room conditions
272 The tests should be carried out in a dark room where environmental illuminance at any position
273 is no greater than 0.01 lux, unless otherwise specified.
274 5.3 Standard DUT conditions
275 The testing voltage provided for DUT shall be the nominal voltage of the DUT with a tolerance
276 of ±5%.
277 5.4 Standard setup conditions
278 5.4.1 Standard setup conditions with a surface light source
279 The standard setup with a light source is as illustrated in Figure 1. The light source shall be a
280 light source which meets the specifications in Section 4 unless otherwise specified. The DUT
281 and the light source are positioned in a way such that the centre of the photosensitive target
282 surface on the DUT is aligned with that of the luminous area of the surface light source. The
283 distance between the DUT and the surface light source shall be set in a way such that the image
284 of the light source occupies the whole FOV of the DUT. The surface light source, LED light
285 source and the spectral tuneable light source shall be interchangeable in this setup.
∘
286 Note 1 to entry: For DUTs with extremely wide fields of view (e.g., approaching 180 ), where a standard planar
287 surface light source cannot fill the FOV, alternative setups such as integrating spheres or curved sources may be
288 used, or the test may be restricted to a specified central FOV.
IEC CDV 63551-6 © IEC 2026
291 Figure 1 – Standard setup with a light source
292 5.4.2 Standard setup conditions for angular response testing
293 The standard setup for angular response testing is as shown in Figure 2. The DUT is placed on
294 a goniometer. The light source should be a collimated light source that meets the specifications
295 in section 4. The light from the light source should evenly illuminate the photosensitive target
296 surface of the DUT. When the DUT's photosensitive target surface is perpendicular to the light
297 source's optical axis, this position is defined as the initial reference position, where both the
298 yaw angle and pitch angle are 0°. When DUT rotates clockwise around one axes, the
299 corresponding angle (yaw for the horizontal axis or pitch for the vertical axis) shall range from
300 0° to +90°; when it rotates counterclockwise, the range shall be from 0° to - 90°.
302 Figure 2 – Standard setup for angular response testing
304 6 Testing methods
305 6.1 Frame rate and effective pixel
306 6.1.1 Purpose
307 The purpose of this method is to test the frame rate and the number of effective pixels of the
308 DUT.
309 6.1.2 Testing conditions
310 The testing conditions shall be as follows:
311 a) Apparatus: No apparatus to be specified for this method;
312 b) Environmental conditions: Standard testing environmental conditions in Section 5.1;
313 c) Room conditions: Standard testing room conditions in Section 5.2;
IEC CDV 63551-6 © IEC 2026
314 d) DUT conditions: Standard DUT conditions in Section 5.3;
315 e) Setup: No setup to be specified for this method.
316 6.1.3 Testing method
317 The testing shall be as follows;
318 a) Set the DUT into the working mode with maximum frame rate and maximum resolution;
319 b) Find the frame rate of the DUT as the number of output images in unit time;
320 c) Find the numbers of effective pixels in horizontal and vertical directions.
321 6.1.4 Report
322 a) Report the frame rate of the DUT in units of fps (frame per second);
323 b) Report the number of effective pixels of the DUT in the form of 𝑝 × 𝑝 , where 𝑝 and 𝑝 are
ℎ 𝑣 ℎ 𝑣
324 the numbers of effective pixels in horizontal and vertical directions, respectively.
325 6.2 Photo response and dynamic range (DR)
326 6.2.1 Purpose
327 The purpose of this method is to test the photo response curve of the DUT, a curve of image
328 grey scale versus the irradiance, and DR of the DUT.
329 6.2.2 Testing conditions
330 The testing conditions shall be as follows:
331 a) Apparatus: surface light source, irradiance meter;
332 b) Environmental conditions: Standard testing environmental conditions in Section 5.1;
333 c) Room conditions: Standard testing room conditions in Section 5.2;
334 d) DUT conditions: Standard DUT conditions in Section 5.3;
335 e) Setup: The system shall be set up as described in Section 5.4.1.
336 6.2.3 Testing method
337 The testing shall be as follows:
338 a) Tune the luminance of the surface light source to control the irradiance on the DUT surface,
339 starting from 0 W/m (dark field);
340 b) For each irradiance:
341 1) Capture images of the light source with the DUT for a total of 𝐹 frames and record the
342 irradiance on the DUT surface using the irradiance meter;
343 2) Choose a region of interest of 𝑀 × 𝑁 pixels and calculate the average grey scale in the
344 region using Formula (1);
𝐹−1 𝑀−1 𝑁−1
𝐷 = ∑ ∑ ∑ 𝐷 (1)
𝑇,𝑓,𝑚,𝑛 𝑓,𝑚,𝑛
𝐹𝑀𝑁
𝑓=0 𝑚=0 𝑛=0
345 where
th th th
346 𝐷 is the grey scale of the pixel in the m row and n column in the f frame;
𝑓,𝑚,𝑛
347 3) Cover the DUT and capture dark field images for a total of 𝐹 frames;
348 4) For the same region of interest in
...



