EN IEC 61189-2-501:2022
(Main)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-501: Prüfverfahren für Materialien für Verbindungsstrukturen – Messung der Belastbarkeit und Belastbarkeit Rückhaltefaktor flexibler dielektrischer Materialien
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion - Mesure de la puissance élastique et du facteur de rétention de la puissance élastique des matériaux diélectriques flexibles
L’IEC 61189-2-501:2022 établit une méthode mettant à l’essai la souplesse d’un stratifié flexible recouvert de cuivre (FCCL, Flexible Copper Clad Laminate) et des matériaux apparentés. Cette méthode détermine l’élasticité dans des conditions spécifiées. L’essai est effectué sur un échantillon tel que fabriqué et sans conditionnement. L’essai ne s’applique pas à une force élastique inférieure à 10 mN.
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-501. del: Preskusne metode za materiale, namenjene za medvezalne strukture - Merjenje elastične trdnosti in faktor zadrževanja elastične trdnosti upogljivih dielektričnih materialov
Ta del standarda IEC 61189 določa metodo, primerno za preskušanje mehkosti upogljivih z bakrom prevlečenih laminatov (FCCL) in sorodnih materialov. Ta dokument določa odpornost pod določenimi pogoji. Preskus se opravi na izdelanem vzorcu brez kondicioniranja. Preskus se ne uporablja za silo prožnosti, manjšo od 10 mN.
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2022
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-501. del: Preskusne metode za materiale, namenjene za
medvezalne strukture - Merjenje elastične trdnosti in faktor zadrževanja elastične
trdnosti upogljivih dielektričnih materialov
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-501: Test methods for materials for interconnection structures -
Measurement of Resilience strength and Resilience strength Retention Factor of Flexible
Dielectric Materials
Ta slovenski standard je istoveten z: EN IEC 61189-2-501:2022
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 61189-2-501
NORME EUROPÉENNE
EUROPÄISCHE NORM March 2022
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-501: Test
methods for materials for interconnection structures -
Measurement of resilience strength and resilience strength
retention factor of flexible dielectric materials
(IEC 61189-2-501:2022)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-501: Méthodes d'essai des matériaux 501: Prüfverfahren für Materialien für
pour structures d'interconnexion - Mesure de la puissance Verbindungsstrukturen - Messung der Belastbarkeit und
élastique et du facteur de rétention de la puissance Belastbarkeit Rückhaltefaktor flexibler dielektrischer
élastique des matériaux diélectriques flexibles Materialien
(IEC 61189-2-501:2022) (IEC 61189-2-501:2022)
This European Standard was approved by CENELEC on 2022-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
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same status as the official versions.
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European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-501:2022 E
European foreword
The text of document 91/1765/FDIS, future edition 1 of IEC 61189-2-501, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-501:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-03-10
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-501:2022 was approved by CENELEC as a
European Standard without any modification.
IEC 61189-2-501 ®
Edition 1.0 2022-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention factor of
flexible dielectric materials
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion –
Mesure de la puissance élastique et du facteur de rétention de la puissance
élastique des matériaux diélectriques flexibles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-1071-7
– 2 – IEC 61189-2-501:2022 IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test apparatus and materials . 8
5 Test specimens . 8
6 Procedure . 8
7 Calculation . 10
8 Report . 11
Annex A (informative) Example of test fixture . 12
Figure 1 – Test specimen . 8
Figure 2 – Schematic of compression jig with test specimen . 9
Figure 3 – Force curve . 10
Figure A.1 – A test fixture and a fixture with a sample . 12
Figure A.2 – General assembly drawing . 13
Figure A.3 – A detailed dimensional drawing for each part of an example test fixture . 15
Figure A.4 – Construction of a test fixture is using the parts shown in Figure A.3 . 16
Figure A.5 – Connector attachments . 16
Table 1 – Settings of distance between the clamps after compression . 9
Table A.1 – Parts list . 13
IEC 61189-2-501:2022 IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention
factor of flexible dielectric materials
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
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preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
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6) All users should ensure that they have the latest edition of this publication.
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members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-501 has been prepared by IEC technical committee TC 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1765/FDIS 91/1774/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
– 4 – IEC 61189-2-501:2022 IEC 2022
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.
IEC 61189-2-501:2022 IEC 2022 – 5 –
INTRODUCTION
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed
that compliance with this document may involve the use of a patent. IEC takes
...
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