SIST EN IEC 61189-2-501:2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials

This part of IEC 61189 establishes a method suitable for testing the softness of FCCL (Flexible
Copper Clad Laminate) products and related materials. This method determines the resilience
under specified conditions. The test is performed on the sample as manufactured and without
conditioning. The test does not apply to the resilience force lower than 10 mN.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-501: Prüfverfahren für Materialien für Verbindungsstrukturen – Messung der Belastbarkeit und Belastbarkeit Rückhaltefaktor flexibler dielektrischer Materialien

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion - Mesure de la puissance élastique et du facteur de rétention de la puissance élastique des matériaux diélectriques flexibles

L’IEC 61189-2-501:2022 établit une méthode mettant à l’essai la souplesse d’un stratifié flexible recouvert de cuivre (FCCL, Flexible Copper Clad Laminate) et des matériaux apparentés. Cette méthode détermine l’élasticité dans des conditions spécifiées. L’essai est effectué sur un échantillon tel que fabriqué et sans conditionnement. L’essai ne s’applique pas à une force élastique inférieure à 10 mN.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-501. del: Preskusne metode za materiale, namenjene za medvezalne strukture - Merjenje elastične trdnosti in faktor zadrževanja elastične trdnosti upogljivih dielektričnih materialov

Ta del standarda IEC 61189 določa metodo, primerno za preskušanje mehkosti upogljivih z bakrom prevlečenih laminatov (FCCL) in sorodnih materialov. Ta dokument določa odpornost pod določenimi pogoji. Preskus se opravi na izdelanem vzorcu brez kondicioniranja. Preskus se ne uporablja za silo prožnosti, manjšo od 10 mN.

General Information

• Status: Published
• Publication Date: 17-Aug-2022
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 30-Mar-2022
• Due Date: 04-Jun-2022
• Completion Date: 18-Aug-2022
• Ref Project: EN IEC 61189-2-501:2022 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61189-2-501:2022
01-september-2022
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-501. del: Preskusne metode za materiale, namenjene za
medvezalne strukture - Merjenje elastične trdnosti in faktor zadrževanja elastične
trdnosti upogljivih dielektričnih materialov
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-501: Test methods for materials for interconnection structures -
Measurement of Resilience strength and Resilience strength Retention Factor of Flexible
Dielectric Materials
Ta slovenski standard je istoveten z: EN IEC 61189-2-501:2022
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN IEC 61189-2-501:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-2-501:2022

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SIST EN IEC 61189-2-501:2022


EUROPEAN STANDARD EN IEC 61189-2-501

NORME EUROPÉENNE

EUROPÄISCHE NORM March 2022
ICS 31.180

English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-501: Test
methods for materials for interconnection structures -
Measurement of resilience strength and resilience strength
retention factor of flexible dielectric materials
(IEC 61189-2-501:2022)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-501: Méthodes d'essai des matériaux 501: Prüfverfahren für Materialien für
pour structures d'interconnexion - Mesure de la puissance Verbindungsstrukturen - Messung der Belastbarkeit und
élastique et du facteur de rétention de la puissance Belastbarkeit Rückhaltefaktor flexibler dielektrischer
élastique des matériaux diélectriques flexibles Materialien
(IEC 61189-2-501:2022) (IEC 61189-2-501:2022)
This European Standard was approved by CENELEC on 2022-03-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61189-2-501:2022 E

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SIST EN IEC 61189-2-501:2022
EN IEC 61189-2-501:2022 (E)
European foreword
The text of document 91/1765/FDIS, future edition 1 of IEC 61189-2-501, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-501:2022.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-12-10
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2025-03-10
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-501:2022 was approved by CENELEC as a
European Standard without any modification.


2

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SIST EN IEC 61189-2-501:2022




IEC 61189-2-501

®


Edition 1.0 2022-02




INTERNATIONAL



STANDARD




NORME


INTERNATIONALE
colour

inside










Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 2-501: Test methods for materials for interconnection structures –


Measurement of resilience strength and resilience strength retention factor of

flexible dielectric materials




Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion –

Mesure de la puissance élastique et du facteur de rétention de la puissance

élastique des matériaux diélectriques flexibles








INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.180 ISBN 978-2-8322-1071-7




Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN IEC 61189-2-501:2022
– 2 – IEC 61189-2-501:2022  IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test apparatus and materials . 8
5 Test specimens . 8
6 Procedure . 8
7 Calculation . 10
8 Report . 11
Annex A (informative) Example of test fixture . 12

Figure 1 – Test specimen . 8
Figure 2 – Schematic of compression jig with test specimen . 9
Figure 3 – Force curve . 10
Figure A.1 – A test fixture and a fixture with a sample . 12
Figure A.2 – General assembly drawing . 13
Figure A.3 – A detailed dimensional drawing for each part of an example test fixture . 15
Figure A.4 – Construction of a test fixture is using the parts shown in Figure A.3 . 16
Figure A.5 – Connector attachments . 16

Table 1 – Settings of distance between the clamps after compression . 9
Table A.1 – Parts list . 13

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SIST EN IEC 61189-2-501:2022
IEC 61189-2-501:2022  IEC 2022 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention
factor of flexible dielectric materials

FOREWORD
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...