EN 60749-14:2003
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 14: Robustesse des sorties (intégrité des connexions)
Fournit plusieurs essais pour la détermination de l'intégrité entre l'interface connexion/boîtier et la connexion elle-même lorsque la ou les connexions sont pliées en raison d'un assemblage incorrect de carte suivi d'une retouche de la partie concernée pour un nouvel assemblage. Applicable à tous les dispositifs à montage par trous traversants et à montage en surface exigeant que l'utilisateur forme la connexion.
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003)
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SLOVENSKI SIST EN 60749-14:2004
STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 14:
Robustness of terminations (lead integrity) (IEC 60749-14:2003)
ICS 31.080.01 Referenčna številka
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
EUROPEAN STANDARD EN 60749-14
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2003
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 14: Robustness of terminations (lead integrity)
(IEC 60749-14:2003)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Méthodes d'essais Mechanische und klimatische
mécaniques et climatiques Prüfverfahren
Partie 14: Robustesse des sorties Teil 14: Festigkeit der
(intégrité des connexions) Bauelementeanschlüsse
(CEI 60749-14:2003) (Unversehrtheit der Anschlüsse)
(IEC 60749-14:2003)
This European Standard was approved by CENELEC on 2003-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-14:2003 E
Foreword
The text of document 47/1701/FDIS, future edition 1 of IEC 60749-14, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-14 on 2003-10-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-10-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-14:2003 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60749-14:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60749-8 - Semiconductor devices - Mechanical EN 60749-8 2003
and climatic test methods
Part 8: Sealing
1)
Undated reference.
2)
Valid edition at date of issue.
NORME CEI
INTERNATIONALE IEC
60749-14
INTERNATIONAL
Première édition
STANDARD
First edition
2003-08
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 14:
Robustesse des sorties
(intégrité des connexions)
Semiconductor devices –
Mechanical and climatic test methods –
Part 14:
Robustness of terminations
(lead integrity)
© IEC 2003 Droits de reproduction réservés ⎯ Copyright - all rights reserved
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électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
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Pour prix, voir catalogue en vigueur
For price, see current catalogue
60749-14 © IEC:2003 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 14: Robustness of terminations
(lead integrity)
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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participate in this preparation. IEC collaborates closely with the International Organization for Standardization
(ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-14 has been prepared by IEC technical committee 47:
Semiconductor devices.
This standard cancels and replaces IEC/PAS 62184 published in 2000. This first edition
constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1701/FDIS 47/1707/RVD
Full information on the voting for the approval of this standard can be found in the report
on voting indicated in the above table.
60749-14 © IEC:2003 – 5 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until 2007.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60749-14 © IEC:2003 – 7 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 14: Robustness of terminations
(lead integrity)
1 Scope
This part of IEC 60749 provides various tests for determining the integrity between the
lead/package interface and the lead itself when the lead(s) are bent due to faulty board
assembly followed by rework of the part for re-assembly. For hermetic packages, it is
recommended that this test be followed by hermeticity tests in accordance with IEC 60749-8
to determine if there are any adverse effects from the stresses applied to the seals as well
as to the leads.
This test, including each of the test conditions, is considered destructive and is only
recommended for qualification testing.
This standard is applicable to all through-hole devices and surface-mount devices requiring
lead forming by the user.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:
Sealing
3 General
3.1 Apparatus
The appropriate apparatus is described under each particular test condition.
3.2 General procedure applicable to all test conditions
The device shall be subjected to the stress described in the specified test condition and the
specified end point measurements and inspections shall be made except for initial condition-
ing unless otherwise specified. When possible, the stress shall be applied to randomly
selected leads from each device. The same leads shall not be used for more than one test
condition.
3.3 General summary
The following details, and those required by the specific test condition, shall be specified
in the relevant specification:
a) Test condition letter.
b) Sample size (combinations of number of leads per device and number of devices) and
quality level.
60749-14 © IEC:2003 – 9 –
4 Test condition A – Tension
4.1 Purpose
This test condition provides for the application of straight tensile loading. It is designed to
check the capabilities of the device, leads, welds, and seals to withstand a straight pull.
4.2 Apparatus
The tension test requires suitable clamps and fixtures for securing the device and attaching the
specified weight without lead restriction. Equivalent linear pull test equipment may be used.
4.3 Procedure
A tension of 2,2 N ± 0,1 N (220 g ± 10 g) shall be applied without shock to each lead to be
tested in a direction parallel to the axis of the lead or terminal and the tension shall be
maintained for 30 s minimum. For leads with a diameter of less than 0,25 mm (or cross
sectional area of less than 0,05 mm ) a tension of 1 N ± 0,1 N (100 g ± 10 g) shall be applied.
The tension shall be applied as close to the end of the lead as practicable.
4.3.1 Measurements
Hermeticity test on hermetically sealed packages, visual examination and electrical measure-
ments that consist of parametric and functional tests shall be taken, as specified in the
relevant specification.
4.3.2 Failure criteria
After the removal of the stress, examine the device using a magnification between 10×
and 20×. Any evidence of breakage, loosening, or relative motion between the lead and the
device body shall be considered a device failure. When hermeticity tests are conducted
(in accordance IEC 60749-8) as a post measurement, meniscus cracks shall not be a cause
for rejection of the devices which have passed the tests. Failure to meet the requirements of
any specified post electrical measurement shall be considered a cause for failure.
4.4 Summary
The following details shall be specified in the relevant specification:
a) Weight to be attached to lead, if other than 2,2 N ± 0,1 N (220 g ± 10 g).
b) Length of time weight is to be attached, if other than 30 s.
c) Failure criteria, if other than specified in 4.3.2.
5 Test condition B – Bending stress
5.1 Purpose
This test condition provides for the application of bending stresses to determine the integrity
of leads, seals and lead plating. It is designed to check the capability of the leads, lead finish,
lead welds and seals of the devices to withstand stresses to the leads and seals which
might reasonably be expected to occur from actual handling and assembly of the devices
in application.
60749-14 © IEC:2003 – 11 –
5.2 Apparatus
The bending test requires attaching devices, clamps, supports or other suitable hardware,
necessary to apply the bending stress through the specified bend angle.
5.3 Procedure
Each lead of the sample shall be subjected to a force sufficient to bend the lead as specified.
Any number, or all
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