EN 60749-14:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 14: Festigkeit der Bauelementeanschlüsse (Unversehrtheit der Anschlüsse)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 14: Robustesse des sorties (intégrité des connexions)

Fournit plusieurs essais pour la détermination de l'intégrité entre l'interface connexion/boîtier et la connexion elle-même lorsque la ou les connexions sont pliées en raison d'un assemblage incorrect de carte suivi d'une retouche de la partie concernée pour un nouvel assemblage. Applicable à tous les dispositifs à montage par trous traversants et à montage en surface exigeant que l'utilisateur forme la connexion.

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003)

General Information

• Status: Published
• Publication Date: 16-Oct-2003
• Withdrawal Date: 30-Sep-2006
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 17-Oct-2003
• Completion Date: 17-Oct-2003
• Ref Project: SIST EN 60749-14:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)

Relations

• Replaces: EN 60749:1999/A1:2000 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60749-14:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 14:
Robustness of terminations (lead integrity) (IEC 60749-14:2003)
ICS 31.080.01 Referenčna številka
SIST EN 60749-14:2004(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

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EUROPEAN STANDARD EN 60749-14
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2003

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods
Part 14: Robustness of terminations (lead integrity)
(IEC 60749-14:2003)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais Mechanische und klimatische
mécaniques et climatiques Prüfverfahren
Partie 14: Robustesse des sorties Teil 14: Festigkeit der
(intégrité des connexions) Bauelementeanschlüsse
(CEI 60749-14:2003) (Unversehrtheit der Anschlüsse)
(IEC 60749-14:2003)






This European Standard was approved by CENELEC on 2003-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60749-14:2003 E

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EN 60749-14:2003 - 2 -
Foreword

The text of document 47/1701/FDIS, future edition 1 of IEC 60749-14, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-14 on 2003-10-01.

The following dates were fixed:

– latest date by which the EN has to be implemented
 at national level by publication of an identical
 national standard or by endorsement (dop) 2004-07-01

– latest date by which the national standards conflicting
 with the EN have to be withdrawn (dow) 2006-10-01

Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________

Endorsement notice

The text of the International Standard IEC 60749-14:2003 was approved by CENELEC as a European
Standard without any modification.
__________

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- 3 - EN 60749-14:2003
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60749-8 - Semiconductor devices - Mechanical EN 60749-8 2003
and climatic test methods
Part 8: Sealing





1)
Undated reference.
2)
Valid edition at date of issue.

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NORME CEI
INTERNATIONALE IEC
60749-14
INTERNATIONAL
Première édition
STANDARD
First edition
2003-08
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 14:
Robustesse des sorties
(intégrité des connexions)
Semiconductor devices –
Mechanical and climatic test methods –
Part 14:
Robustness of terminations
(lead integrity)
© IEC 2003
...