EN 60747-15:2004

Discrete semiconductor devices - Part 15: Isolated power semiconductor devices

Gives the product specific standards, requirements and test methods for isolated power semiconductor devices. These requirements are added to those given in other parts of EN 60747, EN 60748 and EN 60749 for the corresponding non-isolated power devices.

Einzel-Halbleiterbauelemente - Teil 15: Isolierte Leistungshalbleiter

Dispositifs à semiconducteurs - Partie 15: Dispositifs à semiconducteurs de puissance isolés

Gives the product specific standards, requirements and test methods for isolated power semiconductor devices. These requirements are added to those given in other parts of EN 60747, EN 60748 and EN 60749 for the corresponding non-isolated power devices.

Diskretni polprevodniki - 15. del: Izolirani močnostni polprevodniki (IEC 60747-15:2003)

General Information

• Status: Withdrawn
• Publication Date: 06-Jan-2004
• Withdrawal Date: 31-Oct-2006
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47E - Discrete semiconductor devices
• Drafting Committee: IEC/SC 47E - IEC_SC_47E
• Parallel Committee: IEC/SC 47E - IEC_SC_47E
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 20-Jan-2014
• Completion Date: 20-Jan-2014
• Ref Project: SIST EN 60747-15:2004 - Discrete semiconductor devices -- Part 15: Isolated power semiconductor devices

Relations

• Replaced By: EN 60747-15:2012 - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI SIST EN 60747-15:2004

STANDARD
november 2004
Diskretni polprevodniki - 15. del: Izolirani močnostni polprevodniki (IEC 60747-
15:2003)
Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
(IEC 60747-15:2003)
ICS 31.080.01 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 60747-15
NORME EUROPÉENNE
EUROPÄISCHE NORM January 2004

ICS 31.080.99
English version
Discrete semiconductor devices
Part 15: Isolated power semiconductor devices
(IEC 60747-15:2003)
Dispositifs à semiconducteurs Einzel-Halbleiterbauelemente
Partie 15: Dispositifs à semiconducteurs Teil 15: Isolierte Leistungshalbleiter
de puissance isolés (IEC 60747-15:2003)
(CEI 60747-15:2003)
This European Standard was approved by CENELEC on 2003-11-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, Switzerland
and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60747-15:2004 E
Foreword
The text of the International Standard CEI 60747-15:2003, prepared by SC 47E, Discrete
semiconductor devices, of CEI TC 47, Semiconductor devices, was submitted to the Unique
Acceptance Procedure and was approved by CENELEC as EN 60747-15 on 2003-11-01 without any
modification.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-11-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-11-01
__________
Endorsement notice
The text of the International Standard CEI 60747-15:2003 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-1 NOTE Harmonized as EN 60068-1:1994 (not modified).
IEC 60068-2-1 NOTE Harmonized as EN 60068-2-1:1993 (not modified).
IEC 60068-2-2 NOTE Harmonized as EN 60068-2-2:1993 (not modified).
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58:1999 (not modified).
IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78:2001 (not modified).
IEC 60112 NOTE Harmonized as EN 60112:2003 (not modified).
IEC 60146-1-1 NOTE Harmonized as EN 60146-1-1:1993 (not modified).
IEC 60146-2 NOTE Harmonized as EN 60146-2:2000 (not modified).
IEC 60664-3 NOTE Harmonized as HD 625.3 S1:1997 (not modified).
IEC 60747-5-1 NOTE Harmonized as EN 60747-5-1:2001 (not modified).
IEC 60747-5-2 NOTE Harmonized as EN 60747-5-2:2001 (not modified).
IEC 60747-5-3 NOTE Harmonized as EN 60747-5-3:2001 (not modified).
IEC 60749-1 NOTE Harmonized as EN 60749-1:2003 (not modified).
IEC 60749-2 NOTE Harmonized as EN 60749-2:2002 (not modified).
IEC 60749-3 NOTE Harmonized as EN 60749-3:2002 (not modified).
IEC 60749-4 NOTE Harmonized as EN 60749-4:2002 (not modified).
IEC 60749-7 NOTE Harmonized as EN 60749-7:2002 (not modified).
IEC 60749-9 NOTE Harmonized as EN 60749-9:2002 (not modified).
IEC 60749-11 NOTE Harmonized as EN 60749-11:2002 (not modified).

- 3 - EN 60747-15:2004
IEC 60749-13 NOTE Harmonized as EN 60749-13:2002 (not modified).
IEC 60749-16 NOTE Harmonized as EN 60749-16:2003 (not modified).
IEC 60749-17 NOTE Harmonized as EN 60749-17:2003 (not modified).
IEC 60749-18 NOTE Harmonized as EN 60749-18:2003 (not modified).
IEC 60749-19 NOTE Harmonized as EN 60749-19:2003 (not modified).
IEC 60749-29 NOTE Harmonized as EN 60749-29:2003 (not modified).
IEC 60947-4-2 NOTE Harmonized as EN 60947-4-2:2000 (not modified).
IEC 60947-4-3 NOTE Harmonized as EN 60947-4-3:2000 (not modified).
IEC 60950-1 NOTE Harmonized as EN 60950-1:2001 (modified).
IEC 61000 NOTE Harmonized in EN 61000 series (not modified).
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1:2001 (not modified).
IEC 61800-1 NOTE Harmonized as EN 61800-1:1998 (not modified).
IEC 61800-2 NOTE Harmonized as EN 61800-2:1998 (not modified).
_____
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60068-2-6 - Environmental testing EN 60068-2-6 1995
Part 2-6: Tests - Test Fc: Vibration
(sinusoidal)
1) 2)
IEC 60068-2-7 - Part 2-7: Tests - Test Ga and guidance: EN 60068-2-7 1993
Acceleration, steady state
1) 2)
IEC 60068-2-14 - Part 2-14: Tests - Test N: Change of EN 60068-2-14 1999
temperature
1) 2)
IEC 60068-2-20 - Part 2-20: Tests - Test T: Soldering HD 323.2.20 S3 1988

1) 2)
IEC 60068-2-27 - Part 2-27: Tests - Test Ea and EN 60068-2-27 1993
guidance: Shock
1) 2)
IEC 60068-2-47 - Part 2-47: Test methods - Mounting of EN 60068-2-47 1999
components, equipment and other
articles for vibration, impact and similar
dynamic tests
1) 2)
IEC 60068-2-48 - Part 2-48: Tests - Guidance on the EN 60068-2-48 1999
application of the tests of IEC 60068 to
simulate the effects of storage

1) 2)
IEC 60068-3-4 - Part 3-4: Supporting documentation and EN 60068-3-4 2002
guidance - Damp heat tests
IEC 60191-4 1999 Mechanical standardization of EN 60191-4 1999
semiconductor devices
Part 4: Coding system and classification
into forms of package outlines for
semiconductor device packages
IEC 60270 2000 High-voltage test techniques - Partial EN 60270 2001
discharge measurements
1)
Undated reference.
2)
Valid edition at date of issue.

- 5 - EN 60747-15:2004
Publication Year Title EN/HD Year
1)
IEC 60319 - Presentation and specification of - -
reliability data for electronic components

3)
IEC 60664-1 1992 Insulation coordination for equipment EN 60664-1 2003
within low-voltage systems
Part 1: Principles, requirements and
tests
IEC 60721-3-3 1994 Classification of environmental EN 60721-3-3 1995
conditions
Part 3-3: Classification of groups of
environmental parameters and their
severities - Stationary use at
weatherprotected locations
IEC 60747-1 1983 Semiconductor devices - Discrete - -
devices and integrated circuits –
Part 1: General
A1 1991 - -
A3 1996 - -
IEC 60747-2 2000 Part 2: Rectifier diodes - -

IEC 60747-6 2000 Part 6: Thyristors - -

IEC 60747-7 2000 Part 7: Bipolar transistors - -

IEC 60747-8 2000 Part 8: Field-effect transistors - -

IEC 60747-9 1998 Part 9: Insulated-gate bipolar transistors - -
(IGBTs)
1) 2)
IEC 60749-5 - Semiconductor devices - Mechanical EN 60749-5 2003
and climatic test methods
Part 5: Steady-state temperature
humidity bias life test
1) 2)
IEC 60749-6 - Part 6: Storage at high temperature EN 60749-6 2002

1) 2)
IEC 60749-10 - Part 10: Mechanical shock EN 60749-10 2002

1) 2)
IEC 60749-12 - Part 12: Vibration, variable frequency EN 60749-12 2002

1) 2)
IEC 60749-14 - Part 14: Robustness of terminations EN 60749-14 2003
(lead integrity)
1) 2)
IEC 60749-15 - Part 15: Resistance to soldering EN 60749-15 2003
temperature for through-hole mounted
devices
4)
IEC 60749-21 - Part 21: Solderability - -

1) 2)
IEC 60749-25 - Part 25: Temperature cycling EN 60749-25 2003

3)
EN 60664-1 includes A1:2000 + A2:2002 to IEC 60664-1.
4)
At draft stage.
Publication Year Title EN/HD Year
1)
IEC 60749-26 - Part 26: Electrostatic discharge (ESD) - -
sensitivity testing - Human body model
(HBM)
1) 2)
IEC 60749-36 - Part 36: Acceleration, steady state EN 60749-36 2003

IEC 61287-1 1995 Power convertors installed on board - -
rolling stock
Part 1: Characteristics and test methods

ISO 1302 2002 Geometrical Product Specifications EN ISO 1302 2002
(GPS) - Indication of surface texture in
technical product documentation

ISO 2768-2 1989 General tolerances EN 22768-2 1993
Part 2: Geometrical tolerances for
features without individual tolerance
indications
INTERNATIONAL IEC
STANDARD
60747-15
First edition
2003-06
Discrete semiconductor devices –
Part 15:
Isolated power semiconductor devices
Dispositifs à semiconducteurs –
Partie 15:
Dispositifs à semiconducteurs de puissance isolés
 IEC 2003  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
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– 2 – 60747-15  IEC:2003(E)
CONTENTS
FOREWORD . 4
1 Scope . 5
2 Normative references. 5
3 Terms and definitions . 7
4 Letter symbols .12
4.1 General .12
4.2 Additional subscripts/symbols .12
4.3 List letter symbols.12
5 Essential ratings (limiting values) and characteristics .13
5.1 General .13
5.2 Ratings (limiting values) .13
5.3 Characteristics.16
6 Verification of ratings (limiting values) .24
6.1 Isolation voltage between terminals and base plate (V ) .24
isol
6.2 Peak case non-rupture current.26
6.3 Maximum terminal current (I ) .26
tRMS
6.4 Surge (non-repetitive) current test (I ; I ).26
FSM TSM
7 Methods of measurement of characteristics .26
7.1 Rated partial discharge inception and extinction voltages (V ) (V ) .26
i e
7.2 Parasitic stray inductance between main terminals (L ) .27
P
7.3 Parasitic stray capacitance of functional circuit elements to case (C ) .30
P
7.4 Measuring methods for thermal characteristics .31
7.5 Measuring methods of mechanical characteristics .32
8 Acceptance and reliability .33
8.1 General requirements .33
8.2 List of endurance tests .33
8.3 Type tests and routine tests of isolated power devices .36
Annex A (informative) Test method for peak case non-rupture current.38
Annex B (informative) Measuring method of the thickness of thermal compound paste.41
Annex C (informative) Climatic parameters and characteristics .42
Annex D (informative) Internal circuit configurati
...