Process management for avionics - Electronic components capability in operation - Part 2: Semiconductor microcircuit lifetime

IEC TR 62240-2:2018(E) describes a process and a method for selecting digital semiconductor microcircuits by ensuring that their lifetime is compatible with the requirements of aerospace, defence and high performance (ADHP) applications (generally in connection with functional environments). Methods and guidelines are provided to assess the long term reliability of COTS semiconductor microcircuits in such applications; they mainly apply during the electronic design phase when selecting semiconductor microcircuits and assessing the application reliability. focuses on original equipment manufacturers (OEMs) using commercial off the shelf (COTS) semiconductor microcircuits for high performance, high reliability and long duration applications. This document supports OEMs in the preparation and maintenance of their semiconductor electronic component management plan (ECMP).

General Information

Status
Published
Publication Date
17-Jun-2018
Current Stage
PPUB - Publication issued
Start Date
04-Jul-2018
Completion Date
18-Jun-2018
Ref Project

Buy Standard

Technical report
IEC TR 62240-2:2018 - Process management for avionics - Electronic components capability in operation - Part 2: Semiconductor microcircuit lifetime
English language
28 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)


IEC TR 62240-2 ®
Edition 1.0 2018-06
TECHNICAL
REPORT
colour
inside
Process management for avionics – Electronic components capability in
operation –
Part 2: Semiconductor microcircuit lifetime

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC TR 62240-2 ®
Edition 1.0 2018-06
TECHNICAL
REPORT
colour
inside
Process management for avionics – Electronic components capability in

operation –
Part 2: Semiconductor microcircuit lifetime

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5769-2

– 2 – IEC TR 62240-2:2018 © IEC 2018
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 10
4 Lifetime assessment process and method. 11
4.1 General . 11
4.2 Input data for the method . 13
4.2.1 General . 13
4.2.2 COTS semiconductor microcircuits and lifetime issues considerations . 13
4.2.3 Operating and thermal conditions . 13
4.3 Lifetime requirements in mission . 13
4.3.1 Lifetime requirements for electronic equipment in mission . 13
4.3.2 Lifetime requirement for COTS semiconductor microcircuit . 14
4.4 Lifetime assessment for COTS semiconductor microcircuit based on the
OCM information . 14
4.4.1 Availability of lifetime assessment by the OCM . 14
4.4.2 Lifetime compliance . 14
4.5 Lifetime assessment for a COTS semiconductor microcircuit processed by
the OEM . 14
4.5.1 Approach . 14
4.5.2 Risk analysis based on physics of failure (PoF) and the component
family . 15
4.5.3 OCM’s technical data availability and relevance . 15
4.5.4 Acceleration models assessment paths . 15
4.6 Lifetime calculation of COTS semiconductor microcircuit in mission . 16
4.7 Lifetime compliance of COTS semiconductor microcircuit in mission . 16
4.8 Situation reconsideration and alternatives . 17
4.8.1 General . 17
4.8.2 Semiconductor microcircuits change . 17
4.8.3 Lifetime mitigation solutions . 17
4.9 Final report . 18
5 Considerations with regard to semiconductor ageing level estimation for
semiconductor microcircuits . 19
Annex A (informative) Failure and degradation mechanisms of COTS semiconductor
microcircuits . 20
Annex B (informative) Example of operating and thermal mission profile for a COTS
semiconductor microcircuit . 22
Annex C (informative) Risk of failure and degradation mechanisms according to the
type of COTS semiconductor microcircuit . 23
Annex D (informative) BEOL and FEOL technological parameters . 24
Annex E (informative) Generic acceleration models . 25
Annex F (informative) Final report . 26
Bibliography . 28

Figure 1 – Process flow for lifetime assessment and selection of COTS semiconductor
microcircuits . 12
Figure B.1 – Example of thermal and operating mission profile for a semiconductor
microcircuit implemented in an electronic equipment located on the avionic bay of a
civil aircraft, assuming 30 °C of thermal dissipation . 22

Table A.1 – Some failure and degradation mechanisms for COTS semiconductor
microcircuits . 20
Table C.1 – Typical failure and degradation mechanisms according to the COTS

semiconductor microcircuit family and structure . 23
Table D.1 – BEOL and FEOL technological parameters . 24
Table E.1 – Examples of generic acceleration model based on the failure and
degradation mechanism, and based on the internal semiconductor microcircuit
structure . 25
Table F.1 – Template for final report . 26

– 4 – IEC TR 62240-2:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
ELECTRONIC COMPONENTS CAPABILITY IN OPERATION –

Part 2: Semiconductor microcircuit lifetime

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a Technical Report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC TR 62240-2, which is a Technical Report, has been prepared by IEC technical committee
107: Process management for avionics.
IEC TR 62240-2 adapts and modifies the GIFAS/2015/5022 document that has served as a
basis for the elaboration of this Technical Report.

The text of this Technical Report is based on the following documents:
Draft TR Report on voting
107/325/DTR 107/332/RVDTR
Full information on the voting for the approval of this Technical Report can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.