Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources

IEC 62668-2:2019, defines requirements for avoiding the use of counterfeit, recycled and fraudulent components when these components are not purchased from the original component manufacturer (OCM) or are purchased from outside of franchised distributor networks for use in the aerospace, defence and high performance (ADHP) industries. This practice is used, as derogation, only when there are no reasonable or practical alternatives.
NOTE: Typically this document is used in conjunction with IEC 62239-1 and IEC 62668-1, enabling ADHP industries to manage and avoid the use of counterfeit, recycled and fraudulent components in their supply chains.
Although developed for the ADHP industry, this document can be used by other high-performance and high-reliability industries, at their discretion.
This first edition cancels and replaces the second edition of IEC TS 62668-2 published in 2016. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the second edition of IEC TS 62668-2:
a) updates to the risk assessment process, including reference to SAE AS6081;
b) updates to the test methods, including reference to the SAE AS6171 test methods published and in development;
c) updates in line with IEC 62668-1 for definitions and references to DFARS.

Gestion des processus pour l'avionique - Prévention de la contrefaçon - Partie 2: Gestion des composants électroniques achetés auprès de sources non franchisées

l'IEC 62668-2:2019 définit les exigences permettant d'éviter l'utilisation de composants contrefaits, recyclés et frauduleux lorsque ces composants ne sont pas achetés auprès du fabricant de composants d'origine (OCM) ou lorsqu'ils sont achetés en dehors des réseaux de distributeurs franchisés pour être utilisés dans le secteur de l'aérospatial, de la défense et des hautes performances (ADHP). Cette pratique est utilisée comme dérogation uniquement si aucune alternative raisonnable ou pratique n'est disponible.
NOTE En règle générale, le présent document est utilisé conjointement avec l'IEC 62239-1 et l'IEC 62668-1, permettant au secteur ADHP de gérer et d'éviter l'utilisation de composants contrefaits, recyclés et frauduleux dans ses chaînes d'approvisionnement.
Bien que développé pour le secteur ADHP, le présent document peut être utilisé par d'autres secteurs hautes performances et haute fiabilité à leur gré.
Cette première édition annule et remplace la deuxième édition de l'IEC TS 62668-2 publiée en 2016. Cette édition constitue une révision technique. La présente édition inclut les modifications techniques majeures suivantes par rapport à la deuxième édition de l'IEC TS 62668-2:
a) mises à jour du processus d'évaluation des risques, y compris la référence à la SAE AS6081;
b) mises à jour des méthodes d'essai, y compris la référence aux méthodes d'essai de la SAE AS6171 publiées et à l'étude;
c) mises à jour des définitions et des références à la DFARS conformément à l'IEC 62668-1.

General Information

Status
Published
Publication Date
08-Jul-2019
Current Stage
PPUB - Publication issued
Completion Date
09-Jul-2019
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IEC 62668-2
Edition 1.0 2019-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Counterfeit prevention –
Part 2: Managing electronic components from non-franchised sources
Gestion des processus pour l'avionique – Prévention de la contrefaçon –
Partie 2: Gestion des composants électroniques achetés auprès de sources non
franchisées
IEC 62668-2:2019-07(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 62668-2
Edition 1.0 2019-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Counterfeit prevention –
Part 2: Managing electronic components from non-franchised sources
Gestion des processus pour l'avionique – Prévention de la contrefaçon –
Partie 2: Gestion des composants électroniques achetés auprès de sources non
franchisées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-7047-9

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62668-2:2019 © IEC 2019
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions and abbreviated terms ........................................................................ 7

3.1 Terms and definitions .............................................................................................. 7

3.2 Abbreviated terms ................................................................................................. 12

4 Technical requirements ................................................................................................. 13

4.1 General ................................................................................................................. 13

4.2 Overview............................................................................................................... 14

4.3 Risks associated with purchasing from non-franchised distributors ....................... 15

4.3.1 General ......................................................................................................... 15

4.3.2 Origin of risks ................................................................................................ 15

4.3.3 Quality risks................................................................................................... 15

4.3.4 Industrial risks ............................................................................................... 16

4.3.5 Reliability risks .............................................................................................. 17

4.3.6 Financial risks ............................................................................................... 17

4.3.7 Legal risk ....................................................................................................... 17

4.4 Reasons to initialize the derogation process ......................................................... 17

4.4.1 General ......................................................................................................... 17

4.4.2 Obsolescence notice failure ........................................................................... 17

4.4.3 Allocation ...................................................................................................... 17

4.4.4 Insufficient end-of-life inventory ..................................................................... 18

4.4.5 Late orders .................................................................................................... 18

4.4.6 Minimum order quantity ................................................................................. 18

4.4.7 Technical requirements ................................................................................. 18

4.5 Derogation process ............................................................................................... 18

4.5.1 Notification to the OEM .................................................................................. 18

4.5.2 Analysis of alternative solutions ..................................................................... 20

4.5.3 List of approved non-franchised distributors................................................... 21

4.5.4 Non-franchised distributor consultation .......................................................... 21

4.5.5 Risk analysis ................................................................................................. 22

4.5.6 Non-franchised distributor order authorization ............................................... 25

4.5.7 Order processing ........................................................................................... 26

4.5.8 Incoming processing ...................................................................................... 26

4.5.9 Records ......................................................................................................... 30

4.5.10 Processing during storage and manufacturing ............................................... 31

4.5.11 Failed electronic components ........................................................................ 31

Annex A (informative) Flowchart of IEC 62668-1 requirements ............................................. 32

Annex B (informative) Example of detailed tests list, linked with risks levels ........................ 34

Annex C (informative) iNEMI assessment methodology and metric development ................. 42

Annex D (informative) Summary of SAE AS6171 series' proposed test methods under

consideration by SAE International ................................................................................ 43

Bibliography .......................................................................................................................... 51

Figure 1 – Suspect components perimeter ............................................................................ 14

---------------------- Page: 4 ----------------------
IEC 62668-2:2019 © IEC 2019 – 3 –

Figure 2 – Typical derogation process when supplying from non-franchised distribution........ 19

Figure 3 – Potential avionics supply chain scenarios and notification feedbacks ................... 20

Figure A.1 – Flowchart of IEC 62668-1 requirements ............................................................ 33

Table 1 – Typical procurement risk scenarios and guidance for risk assessment ................... 23

Table 2 – Typical testing ....................................................................................................... 29

Table B.1 – Example of detailed revalidation testing of suspect stock ................................... 34

Table D.1 – Summary of SAE AS6171 series test methods (published versions and

those under considerations) .................................................................................................. 43

---------------------- Page: 5 ----------------------
– 4 – IEC 62668-2:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 2: Managing electronic components
from non-franchised sources
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

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assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62668-2 has been prepared by IEC technical committee 107:

Process management for avionics.

This first edition cancels and replaces the second edition of IEC TS 62668-2 published in

2016. This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the second

edition of IEC TS 62668-2:
a) updates to the risk assessment process, including reference to SAE AS6081;

b) updates to the test methods, including reference to the SAE AS6171 test methods

published and in development;
c) updates in line with IEC 62668-1 for definitions and references to DFARS.
---------------------- Page: 6 ----------------------
IEC 62668-2:2019 © IEC 2019 – 5 –

This International Standard is to be used in conjunction with IEC 62239-1 and IEC 62668-1.

The text of this International Standard is based on the following documents:
FDIS Report on voting
107/353/FDIS 107/359/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all the parts in the IEC 62668 series, published under the general title Process

management for avionics – Counterfeit prevention, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 7 ----------------------
– 6 – IEC 62668-2:2019 © IEC 2019
INTRODUCTION

The avionics industry has a responsibility to ensure that all flight equipment produced has a

predicted product life which correlates with the predicted repair and service life to ensure the

public is not endangered. Typically, an original equipment manufacturer (OEM) calculates a

mean time between failure (MTBF) and possibly a mean time to failure (MTTF) prediction.

These calculations assume all components are new, or considered as “unused”, at the point

of introduction into flight use and that no useful component life and/or any “unsafe”

component conditions have been used. It is therefore essential that counterfeit, recycled and

fraudulent components which have had potentially some of their ”useful life” consumed and

which can also be malfunctioning are not purchased for use in aerospace, defence and high

performance (ADHP) industries.
---------------------- Page: 8 ----------------------
IEC 62668-2:2019 © IEC 2019 – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
COUNTERFEIT PREVENTION –
Part 2: Managing electronic components
from non-franchised sources
1 Scope

This part of IEC 62668, defines requirements for avoiding the use of counterfeit, recycled and

fraudulent components when these components are not purchased from the original

component manufacturer (OCM) or are purchased from outside of franchised distributor

networks for use in the aerospace, defence and high performance (ADHP) industries. This

practice is used, as derogation, only when there are no reasonable or practical alternatives.

NOTE Typically this document is used in conjunction with IEC 62239-1 and IEC 62668-1, enabling ADHP

industries to manage and avoid the use of counterfeit, recycled and fraudulent components in their supply chains.

Although developed for the ADHP industry, this document can be used by other high-

performance and high-reliability industries, at their discretion.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 62239-1, Process management for avionics – Management plan – Part 1: Preparation and

maintenance of an electronic components management plan

IEC 62668-1:2019, Process management for avionics – Counterfeit prevention – Part 1:

Avoiding the use of counterfeit, fraudulent and recycled electronic components
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1.1
aftermarket source

reseller which may or may not be under contract with the original component manufacturer

(OCM) or is sometimes a component “re-manufacturer”, under contract with the OCM

Note 1 to entry: The reseller accumulates inventories of encapsulated or non-encapsulated components (wafer

and/or die) whose end of life date has been published by the OCM. These components are then resold at a profit to

fill a need within the market for components that have become obsolete.
[SOURCE: IEC 62668-1:2019, 3.1.1]
---------------------- Page: 9 ----------------------
– 8 – IEC 62668-2:2019 © IEC 2019
3.1.2
broker

individual or corporate organization that serves as an intermediary between buyer and seller

Note 1 to entry: In the electronic component sector a broker specifically seeks to supply obsolete or hard to find

components in order to turn a profit. To do so it may accumulate an inventory of components considered to be of

strategic value or may rely on inventories accumulated by another. The broker operates within a worldwide

component exchange network.
[SOURCE: IEC 62668-1:2019, 3.1.2]
3.1.3
COTS product
commercial off-the-shelf product

one or more components, assembled and developed for multiple commercial consumers,

whose design and/or configuration is controlled by the manufacturer’s specification or industry

standard

Note 1 to entry: COTS products can include electronic components, subassemblies, or assemblies, or top-level

assemblies. Electronic COTS subassemblies or assemblies include circuit card assemblies, power supplies, hard

drives, and memory modules. Top-level COTS assemblies include a fully integrated rack of equipment such as raid

arrays, file servers to individual switches, routers, personal computers, or similar equipment.

Note 2 to entry: This note applies to the French language only.
[SOURCE: IEC 62668-1:2019, 3.1.3]
3.1.4
counterfeit, verb

action of simulating, reproducing or modifying a material, good or its packaging without

authorization

Note 1 to entry: It is the practice of producing products which are imitations or are fake goods or services. This

activity infringes the intellectual property rights of the original manufacturer and is an illegal act. Counterfeiting

generally relates to willful trademark infringement.
[SOURCE: IEC 62668-1:2019, 3.1.4]
3.1.5
counterfeited component

material good imitating or copying an authentic material, good which may be covered by the

protection of one or more registered or confidential intellectual property rights

Note 1 to entry: A counterfeited component is one whose identity or pedigree has been altered or misrepresented

by its supplier.

Identity = original manufacturer, part number, date code, lot number, testing, inspection, documentation or warranty

etc.

Pedigree = origin, ownership history, storage, handling, physical condition, previous use, etc.

Note 2 to entry: When a material good has no registered or confidential intellectual property rights, then the

material good has no intellectual property protection. Examples include situations where the original component

manufacturer (OCM) has ceased to trade and has not sold or passed on the intellectual property rights to another

entity.
[SOURCE: IEC 62668-1:2019, 3.1.5]
3.1.6
customer device specification
device specification written by a user and agreed by the supplier
[SOURCE: IEC 62668-1:2019, 3.1.6]
---------------------- Page: 10 ----------------------
IEC 62668-2:2019 © IEC 2019 – 9 –
3.1.7
customer
user

original equipment manufacturer (OEM) which purchases electronic components, including

integrated circuits and/or semiconductor devices compliant with this document, and uses them

to design, produce, and maintain systems
[SOURCE: IEC 62668-1:2019, 3.1.7]
3.1.8
data sheet

document prepared by the manufacturer that describes the electrical, mechanical, and

environmental characteristics of the component
[SOURCE: IEC 62668-1:2019, 3.1.8]
3.1.9
franchised distributor or agent

individual or corporate organisation that is legally independent from the franchiser (in this

case the electronic component manufacturer or OCM) and agrees under contract to distribute

products using the franchiser’s name and sales network

Note 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the

franchiser. Shipments against orders placed can be dispatched either directly from the OCM or the franchised

distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more

electronic component manufacturers to distribute and sell the said components. Distribution agreements may be

stipulated according to the following criteria: geographical area, type of clientele (avionics for example), maximum

manufacturing lot size. Components sourced through this route are protected by the OCM’s warranty and supplied

with full traceability.
[SOURCE: IEC 62668-1:2019, 3.1.9]
3.1.10
fraudulent component

electronic component produced or distributed either in violation of regional or local law or

regulation, or with the intent to deceive the customer

Note 1 to entry: This includes but is not limited to the following which are examples of components which are

fraudulently sold as new ones to a customer:
1) a stolen component;

2) a component scrapped by the original component manufacturer (OCM) or by any user;

3) a recycled component, that becomes a fraudulent recycled component when it is a disassembled (for example,

disassembled from a PCB assembly) component resold as a new component (see Figure 1), where typically

there is evidence of prior use and rework (for example solder, re-plating or lead re-attachment activity) on the

component package terminations;

4) a counterfeit component, a copy, an imitation, a full or partial substitute of brands;

5) fraudulent designs, models, patents, software, or copyright sold as being new and authentic. For example: a

component whose production and distribution are not controlled by the original manufacturer;

6) unlicensed copies of a design;

7) a disguised component (remarking of the original manufacturer’s name, reference date/code or other

identifiers etc.), which may be a counterfeit component (see Figure 1);

8) a component without an internal silicon die or with a substituted silicon die which is not the original

manufacturer’s silicon die.
[SOURCE: IEC 62668-1:2019, 3.1.10]
---------------------- Page: 11 ----------------------
– 10 – IEC 62668-2:2019 © IEC 2019
3.1.11
microcircuit
component
device

electrical or electronic device that is not subject to disassembly without destruction or

impairment of design use and is a small circuit having a high equivalent circuit element

density which is considered as a single part composed of interconnected elements on or

within a single substrate to perform an electronic circuit function

Note 1 to entry: This excludes printed wiring boards / printed circuit boards, circuit card assemblies and modules

composed exclusively of discrete electronic components).

Note 2 to entry: A microcircuit is usually referred to as an active component or device. The term component can

be applied to passive devices such as resistors and capacitors. Sometimes the term ‘part’ is also used instead of

the terms ‘microcircuit’, ‘component’ and ‘device’
[SOURCE: IEC 62668-1:2019, 3.1.12, modified – Note 2 has been added.]
3.1.12
MRO
maintenance, repair and overhaul

operations such as tests, measurements, replacements, adjustments and repairs intended to

retain or restore a functional unit or to a specified state in which the unit can perform its

required functions

Note 1 to entry: This activity includes inspection, rebuilding, alteration and the supply of spare parts, accessories,

raw materials, adhesives, sealants, coatings and consumables.
Note 2 to entry: This note applies to the French language only.
[SOURCE: IEC 62668-1:2019, 3.1.13]
3.1.13
non-franchised distributor
companies which do not fall under a franchised distributor or OCM

Note 1 to entry: These distributors may purchase components from component manufacturers, franchised

distributors, or through other supply channels (open markets). These distributors cannot always provide the

guarantees and support provided by the franchised distributor network; components sourced through this source

are usually protected by the source’s warranty only.

Note 2 to entry: Some non-franchised distributors are able to purchase traceable components from the OCM or

their franchised distributors and prov
...

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