Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification

IEC 62680-1-2:2022 specification defines a power delivery system covering all elements of a USB system including: Hosts, Devices, Hubs, Chargers and cable assemblies. This specification describes the architecture, protocols, power supply behavior, connectors and cabling necessary for managing power delivery over USB at up to 100W. This specification is intended to be fully compatible and extend the existing USB infrastructure. It is intended that this specification will allow system OEMs, power supply and peripheral developers adequate flexibility for product versatility and market differentiation without losing backwards compatibility. This sixt edition cancels and replaces the fifth edition published in 2021 and constitutes a technical revision. Extended Power Range (EPR) including Adjustable Voltage Supply (AVS) has been added. This docuemnt is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision 3.1, Version 1.1.

Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie 1-2: Composants communs - Spécification de l'alimentation électrique par port USB

L'IEC 62680-1-2:2022 spécification de l'alimentation électrique par port USB définit un système d'alimentation électrique qui couvre tous les éléments d'un système USB, y compris: hôtes, dispositifs, hubs, chargeurs et assemblages de câbles. La présente spécification décrit l'architecture, les protocoles, le comportement de l'alimentation électrique, les connecteurs et le câblage nécessaires à la gestion de l'alimentation électrique sur USB jusqu'à 100 W. La présente spécification est destinée à être entièrement compatible avec les infrastructures USB existantes et à en assurer une extension. Il est prévu que cette spécification offre aux OEM de systèmes, ainsi qu'aux développeurs d'alimentations électriques et de périphériques, une souplesse appropriée pour une polyvalence des produits et leur différenciation sur le marché, sans perdre en compatibilité ascendante. Cette sixième édition annule et remplace la cinquième édition parue en 2021 et constitue une révision technique.
Le présent document est la publication de l'USB-IF relative à l'alimentation électrique par port USB, révision 3.1, version 1.1. Plage de puissance étendue (EPR) y compris alimentation à tension réglable (AVS) a été ajoutée.

General Information

Status
Published
Publication Date
04-Sep-2022
Current Stage
PPUB - Publication issued
Start Date
31-Aug-2022
Completion Date
05-Sep-2022
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IEC 62680-1-2
®
Edition 6.0 2022-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colourcolour
insinsiidede
Universal serial bus interfaces for data and power –
Part 1-2: Common components – USB Power Delivery specification
Interfaces de bus universel en série pour les données et l'alimentation
électrique –
Partie 1-2: Composants communs – Spécification de l'alimentation électrique
par port USB
IEC 62680-1-2:2022-09(en-fr)

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
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---------------------- Page: 2 ----------------------
IEC 62680-1-2
®
Edition 6.0 2022-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal serial bus interfaces for data and power –
Part 1-2: Common components – USB Power Delivery specification
Interfaces de bus universel en série pour les données et l'alimentation
électrique –
Partie 1-2: Composants communs – Spécification de l'alimentation électrique
par port USB
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.220; 33.120; 35.200 ISBN 978-2-8322-5288-8
Warning! Make sure that you obtained this publication from an authorized distributor.
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® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – IEC 62680-1-2:2022
© USB-IF:2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER –

Part 1-2: Common components – USB Power Delivery specification

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 18: Multimedia
home systems and applications for end-user networks, of IEC technical committee 100: Audio,
video and multimedia systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure
and editorial rules used in this publication reflect the practice of the organization which
submitted it.
The text of this International Standard is based on the following documents:
Draft Report on voting
100/3716/CDV 100/3763/RVC

Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.

---------------------- Page: 4 ----------------------
IEC 62680-1-2:2022 – 3 –
© USB-IF:2021
A list of all parts in the IEC 62680 series, published under the general title Universal serial bus
interfaces for data and power, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

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– 4 – IEC 62680-1-2:2022
© USB-IF:2021
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by the USB
Implementers Forum (USB-IF). These specifications were submitted to the IEC under the auspices of
a special agreement between the IEC and the USB-IF.
This standard is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision
3.1, Version 1.1.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group of
companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a
support organization and forum for the advancement and adoption of Universal Serial Bus technology.
The Forum facilitates the development of high-quality compatible USB peripherals (devices), and
promotes the benefits of USB and the quality of products that have passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT,
OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB IMPLEMENTERS FORUM AND THE
AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM ALL LIABILITY, INCLUDING LIABILITY
FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OR INFORMATION IN THIS SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU WITH ANY
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to participate in a
reciprocal, RAND-Z licensing arrangement for compliant products. For more information, please see:
https://www.usb.org/documents
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO ENTER
INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB IMPLEMENTERS
FORUM.”

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IEC 62680-1-2:2022 – 5 –
© USB-IF:2021






Universal Serial Bus
Power Delivery Specification







Revision:  3.1
Version:  1.1
Release date: July 2021

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– 6 – IEC 62680-1-2:2022
© USB-IF:2021
LIMITED COPYRIGHT LICENSE
THE USB 3.0 PROMOTERS GRANT A CONDITIONAL COPYRIGHT LICENSE UNDER THE COPYRIGHTS
EMBODIED IN THE USB POWER DELIVERY SPECIFICATION TO USE AND REPRODUCE THE
SPECIFICATION FOR THE SOLE PURPOSE OF, AND SOLELY TO THE EXTENT NECESSARY FOR,
EVALUATING WHETHER TO IMPLEMENT THE SPECIFICATION IN PRODUCTS THAT WOULD COMPLY
WITH THE SPECIFICATION. WITHOUT LIMITING THE FOREGOING, USE THE OF SPECIFICATION FOR
THE PURPOSE OF FILING OR MODIFYING ANY PATENT APPLICATION TO TARGET THE SPECIFICATION
OR USB COMPLIANT PRODUCTS IS NOT AUTHORIZED. EXCEPT FOR THIS EXPRESS COPYRIGHT LICENSE,
NO OTHER RIGHTS OR LICENSES ARE GRANTED, INCLUDING WITHOUT LIMITATION ANY PATENT
LICENSES. IN ORDER TO OBTAIN ANY ADDITIONALY INTELLECTUAL PROPERTY LICENSES OR
LICENSING COMMITMENTS ASSOCIATED WITH THE SPECIFICATION A PARTY MUST EXECUTE THE USB
3.0 ADOPTERS AGREEMENT. NOTE: BY USING THE SPECIFICATION, YOU ACCEPT THESE LICENSE
TERMS ON YOUR OWN BEHALF AND, IN THE CASE WHERE YOU ARE DOING THIS AS AN EMPLOYEE, ON
BEHALF OF YOUR EMPLOYER.
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING
ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR
PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OF
INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS SPECIFICATION TO YOU DOES NOT
PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to techsup@usb.org
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org
USB Type-C® and USB4™ are trademarks of the Universal Serial Bus Implementers Forum (USB-IF).
Thunderbolt™ is a trademark of Intel Corporation.
You may only use the Thunderbolt™ trademark or logo in conjunction with products designed to this
specification that complete proper certification and executing a Thunderbolt™ trademark license – see
http://usb.org/compliance for further information.
All product names are trademarks, registered trademarks, or service marks of their respective owners.
Copyright © 2010-2021, USB 3.0 Promoter Group: Apple Inc., Hewlett-Packard Inc., Intel Corporation,
Microsoft Corporation, Renesas, STMicroelectronics, and Texas Instruments.
All rights reserved.

---------------------- Page: 8 ----------------------
IEC 62680-1-2:2022 – 7 –
© USB-IF:2021
Chairs
Alvin Cox Cabling Sub-Chair
Bob Dunstan Specification Chair/Protocol Subgroup Chair
Deric Waters PHY Chair
Ed Berrios Power Supply Chair
Rahman Ismail System Policy Chair
Richard Petrie Specification Chair/Device Policy Chair
Editors
Bob Dunstan
Richard Petrie
Contributors

---------------------- Page: 9 ----------------------
– 8 – IEC 62680-1-2:2022
© USB-IF:2021
Charles Wang ACON, Advanced-Connectek, Inc. Sean O'Neal Bizlink Technology, Inc.
Conrad Choy ACON, Advanced-Connectek, Inc. Tiffany Hsiao Bizlink Technology, Inc.
Dennis Chuang ACON, Advanced-Connectek, Inc. Weichung Ooi Bizlink Technology, Inc.
Steve Sedio ACON, Advanced-Connectek, Inc. Rahul Bhushan Broadcom Corp.
Sunney Yang ACON, Advanced-Connectek, Inc. Asila nahas Cadence Design Systems, Inc.
Vicky Chuang ACON, Advanced-Connectek, Inc. Claire Ying Cadence Design Systems, Inc.
Joseph Scanlon Advanced Micro Devices Jie min Cadence Design Systems, Inc.
Sujan Thomas Advanced Micro Devices Mark Summers Cadence Design Systems, Inc.
Caspar Lin Allion Labs, Inc. Michal Staworko Cadence Design Systems, Inc.
Casper Lee Allion Labs, Inc. Sathish Kumar Cadence Design Systems, Inc.
Ganesan
Danny Shih Allion Labs, Inc.
Alessandro Canova Tech
Howard Chang Allion Labs, Inc.
Ingrassia
Greg Stewart Analogix Semiconductor, Inc.
Andrea Colognese Canova Tech
Mehran Badii Analogix Semiconductor, Inc.
Antonio Orzelli Canova Tech
Alexei Kosut Apple
Davide Ghedin Canova Tech
Bill Cornelius Apple
Matteo Casalin Canova Tech
Carlos Colderon Apple
Michael Marioli Canova Tech
Chris Uiterwijk Apple
Nicola Canova Tech
Colin Whitby- Apple
Scantamburlo
Strevens
Paolo Pilla Canova Tech
Corey Axelowitz Apple
Yi-Feng Lin Canyon Semiconductor
Corey Lange Apple
YuHung Lin Canyon Semiconductor
Dave Conroy Apple
David Tsai Chrontel, Inc.
David Sekowski Apple
Anshul Gulati Cypress Semiconductor
Girault Jones Apple
Anup Nayak Cypress Semiconductor
James Orr Apple
Benjamin Kropf Cypress Semiconductor
Jason Chung Apple
Dhanraj Rajput Cypress Semiconductor
Jay Kim Apple
Ganesh
Cypress Semiconductor
Jeff Wilcox Apple
Subramaniam
Jennifer Tsai Apple
Jagadeesan Raj Cypress Semiconductor
Karl Bowers Apple
Junjie cui Cypress Semiconductor
Keith Porthouse Apple
Manu Kumar Cypress Semiconductor
Kevin Hsiue Apple
Muthu M Cypress Semiconductor
Matt Mora Apple
Nicholas Bodnaruk Cypress Semiconductor
Paul Baker Apple
Pradeep Bajpai Cypress Semiconductor
Reese Schreiber Apple
Rajaram R Cypress Semiconductor
Ricardo Janezic Apple
Rama Vakkantula Cypress Semiconductor
Pregitzer
Rushil Kadakia Cypress Semiconductor
Ruchi Chaturvedi Apple
Simon Nguyen Cypress Semiconductor
Sameer Kelkar Apple
Steven Wong Cypress Semiconductor
Sasha Tietz Apple
Subu Sankaran Cypress Semiconductor
Scott Jackson Apple
Sumeet Gupta Cypress Semiconductor
Sree Raman Apple
Tejender Sheoran Cypress Semiconductor
William Ferry Apple
Venkat Cypress Semiconductor
Zaki Moussaoui Apple
Mandagulathar
Jeff Liu ASMedia Technology Inc.
Xiaofeng Shen Cypress Semiconductor
Kuo Lung Li ASMedia Technology Inc.
Zeng Wei Cypress Semiconductor
Ming-Wei Hsu ASMedia Technology Inc.
Adie Tan Dell Inc.
PS Tseng ASMedia Technology Inc.
Adolfo Montero Dell Inc.
Sam Tzeng ASMedia Technology Inc.
Bruce Montag Dell Inc.
Thomas Hsu ASMedia Technology Inc.
Gary Verdun Dell Inc.
Weikao Chang ASMedia Technology Inc.
Ken Nicholas Dell Inc.
Yang Cheng ASMedia Technology Inc.
Marcin Nowak Dell Inc.
Shawn Meng Bizlink Technology Inc.
Merle Wood Dell Inc.
Bernard Shyu Bizlink Technology, Inc.
Mohammed Hijazi Dell Inc.
Eric Wu Bizlink Technology, Inc.
Siddhartha Reddy Dell Inc.
Morphy Hsieh Bizlink Technology, Inc.

---------------------- Page: 10 ----------------------
IEC 62680-1-2:2022 – 9 –
© USB-IF:2021
Terry Matula Dell Inc. Fred Fons Foxconn / Hon Hai
Jay Hu Derun Semiconductor Jie Zheng Foxconn / Hon Hai
Shelly Liu Derun Semiconductor Patrick Casher Foxconn / Hon Hai
Bindhu Vasu Dialog Semiconductor (UK) Ltd Steve Sedio Foxconn / Hon Hai
Chanchal Gupta Dialog Semiconductor (UK) Ltd Terry Little Foxconn / Hon Hai
Dipti Baheti Dialog Semiconductor (UK) Ltd Bob McVay Fresco Logic Inc.
Duc Doan Dialog Semiconductor (UK) Ltd Christopher Meyers Fresco Logic Inc.
Holger Petersen Dialog Semiconductor (UK) Ltd Dian Kurniawan Fresco Logic Inc.
Jianming Yao Dialog Semiconductor (UK) Ltd Tom Burton Fresco Logic Inc.
John Shi Dialog Semiconductor (UK) Ltd Abraham Levkoy Google Inc.
KE Hong Dialog Semiconductor (UK) Ltd Adam Rodriguez Google Inc.
Kevin Mori Dialog Semiconductor (UK) Ltd Alec Berg Google Inc.
Larry Ping Dialog Semiconductor (UK) Ltd Benson Leung Google Inc.
Mengfei Liu Dialog Semiconductor (UK) Ltd Chao Fei Google Inc.
Scott Brown Dialog Semiconductor (UK) Ltd Dave Bernard Google Inc.
Yimin Chen Dialog Semiconductor (UK) Ltd David Schneider Google Inc.
Yong Li Dialog Semiconductor (UK) Ltd Diana Zigterman Google Inc.
Justin Lee Diodes Incorporated Eric Herrmann Google Inc.
Dan Ellis DisplayLink (UK) Ltd. Jim Guerin Google Inc.
Jason Young DisplayLink (UK) Ltd. Juan Fantin Google Inc.
Kevin Jacobs DisplayLink (UK) Ltd. Ken Wu Google Inc.
Paulo Alcobia DisplayLink (UK) Ltd. Kyle Tso Google Inc.
Peter Burgers DisplayLink (UK) Ltd. Mark Hayter Google Inc.
Richard Petrie DisplayLink (UK) Ltd. Nathan Kolluru Google Inc.
Chien-Cheng Kuo eEver Technology, Inc. Nithya Jagannathan Google Inc.
Shyanjia Chen eEver Technology, Inc. Srikanth Google Inc.
Lakshmikanthan
Abel Astley Ellisys
Todd Broch Google Inc.
Chuck Trefts Ellisys
Toshak Singhal Google Inc.
Emmanuel Durin Ellisys
Vincent Palatin Google Inc.
Mario Pasquali Ellisys
Xuelin Wu Google Inc.
Tim Wei Ellisys
Zhenxue Xu Google Inc.
Chien-Cheng Kuo Etron Technology, Inc.
Alan Kinningham Granite River Labs
Jack Yang Etron Technology, Inc.
Balamurugan Granite River Labs
Richard Crisp Etron Technology, Inc.
Manialagan
Shyanjia Chen Etron Technology, Inc.
Mike Engbretson Granite River Labs
TsungTa Lu Etron Technology, Inc.
Mike Wu Granite River Labs
Christian Klein Fairchild Semiconductor
Mukesh Tatiya Granite River Labs
Oscar Freitas Fairchild Semiconductor
Rajaraman V Granite River Labs
Souhib Harb Fairchild Semiconductor
Sivaram Murugesan Granite River Labs
Amanda Ying Feature Integration Technology
Tim Lin Granite River Labs
Inc.
Vishal Kakade Granite River Labs
Jacky Chan Feature Integration Technology
Inc. Alan Berkema Hewlett Packard
Kenny Hsieh Feature Integration Technology Lee Atkinson Hewlett Packard
Inc.
Rahul Lakdawala Hewlett Packard
KungAn Lin Feature Integration Technology
Robin Castell Hewlett Packard
Inc.
Ron Schooley Hewlett Packard
Paul Yang Feature Integration Technology
Suketa Partiwala Hewlett Packard
Inc.
Steve Chen Hewlett Packard
Su Jaden Feature Integration Technology
Vaibhav Malik Hewlett Packard
Inc.
Walter Fry Hewlett Packard
Yu-Lin Chu Feature Integration Technology
Hideyuki HAYAFUJI Hosiden Corporation
Inc.
Keiji Mine Hosiden Corporation
Yulin Lan Feature Integration Technology
Masaki Yamaoka Hosiden Corporation
Inc.
Takashi Muto Hosiden Corporation
AJ Yang Foxconn / Hon Hai
Bob Hall Foxconn / Hon Hai Yasunori Nishikawa Hosiden Corporation
Alan Berkema HP Inc.
Chihyin Kan Foxconn / Hon Hai

---------------------- Page: 11 ----------------------
– 10 – IEC 62680-1-2:2022
© USB-IF:2021
Kenneth Chan HP Inc. Venkataramani Intel Corporation
Gopalakrishnan
Lee Atkinson HP Inc.
Ziv Kabiry Intel Corporation
Lee Leppo HP Inc.
Jia Wei Intersil Corporation
Rahul Lakdawala HP Inc.
Al Hsiao ITE Tech. Inc.
Robin Castell HP Inc.
Greg Song ITE Tech. Inc.
Roger Benson HP Inc.
Richard Guo ITE Tech. Inc.
Steve Chen HP Inc.
Victor Lin ITE Tech. Inc.
Bai Sean Huawei Technologies Co., Ltd.
Y.C. Chou ITE Tech. Inc.
Chunjiang Zhao Huawei Technologies Co., Ltd.
Kenta Minejima Japan Aviation Electronics
JianQuan Wu Huawei Technologies Co., Ltd.
Industry Ltd. (JAE)
Li Zongjian Huawei Technologies Co., Ltd.
Mark Saubert Japan Aviation Electronics
Liansheng Zheng Huawei Technologies Co., Ltd.
Industry Ltd. (JAE)
Lihua Duan Huawei Technologies Co., Ltd.
Toshio Shimoyama Japan Aviation Electronics
Min Chen Huawei Technologies Co., Ltd.
Industry Ltd. (JAE)
Wang Feng Huawei Technologies Co., Ltd.
Brian Fetz Keysight Technologies Inc.
Wei Haihong Huawei Technologies Co., Ltd.
Jit Lim Keysight Technologies Inc.
James Xie Hynetek Semiconductor Co., Ltd
Babu Mailachalam Lattice Semiconductor Corp
Yingyang Ou Hynetek Semiconductor Co., Ltd
Gianluca Mariani Lattice Semiconductor Corp
Robert Heaton Indie Semiconductor
Joel Coplen Lattice Semiconductor Corp
Vincent Wang Indie Semiconductor
Thomas Watza Lattice Semiconductor Corp
Benjamin Kropf Infineon Technologies
Vesa Lauri Lattice Semiconductor Corp
Sie Boo Chiang Infineon Technologies
Do Kyun Kim LG electronics
Tue Fatt David Wee Infineon Technologies
Bruce Chuang Leadtrend
Wee Tar Richard Ng Infineon Technologies
Eilian Liu Leadtrend
Wolfgang Furtner Infineon Technologies
Daniel H Jacobs LeCroy Corporation
Bob Dunstan Intel Corporation
Jake Jacobs LeCroy Corporation
Brad Saunders Intel Corporation
Kimberley McKay LeCroy Corporation
Chee Lim Nge Intel Corporation
Mike Engbretson LeCroy Corporation
Christine Krause Intel Corporation
Mike Micheletti LeCroy Corporation
Chuen Ming Tan Intel Corporation
Roy Chestnut LeCroy Corporation
Dan Froelich Intel Corporation
Tyler Joe LeCroy Corporation
David Harriman Intel Corporation
Phil Jakes Lenovo
David Hines Intel Corporation
Aaron Melgar Lion Semiconductor
David Thompson Intel Corporation
Chris Zhou Lion Semiconductor
Guobin Liu Intel Corporation
Sehyung Jeon Lion Semiconductor
Harry Skinner Intel Corporation
Wonyoung Kim Lion Semiconductor
Henrik Leegaard Intel Corporation
Yongho Kim Lion Semiconductor
Jenn Chuan Cheng Intel Corporation
Dave Thompson LSI Corporation
Jervis Lin Intel Corporation
Alan Kinningham Luxshare-ICT
John Howard Intel Corporation
Alan Liu Luxshare-ICT
Karthi Vadivelu Intel Corporation
Daniel Chen Luxshare-ICT
Leo Heiland Intel Corporation
Eric Wen Luxshare-ICT
Maarit Harkonen Intel Corporation
James Stevens Luxshare-ICT
Nge Chee Lim Intel Corporation
Josue Castillo Luxshare-ICT
Paul Durley Intel Corporation
Pat Young Luxshare-ICT
Rahman Ismail Intel Corporation
Scott Shuey Luxshare-ICT
Rajaram Regupathy Intel Corporation
Chikara Kakizawa Maxim Integrated Products
Ronald Swartz Intel Corporation
Jacob Scott Maxim Integrated Products
Sarah Sharp Intel Corporation
Ken Helfrich Maxim Integrated Products
Scott Brenden Intel Corporation
Michael Miskho Maxim Integrated Products
Sridharan Intel Corporation
Chris Yokum MCCI Corporation
Ranganathan
Geert Knapen MCCI Corporation
Steve McGowan Intel Corporation
Terry Moore MCCI Corporation
Tim McKee Intel Corporation
Velmurugan MCCI Corporation
Toby Opferman Intel Corporation
Selvaraj
Uma Medepalli Intel Corporation
Satoru Kumashiro MegaChips Corporation

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IEC 62680-1-2:2022 – 11 –
© USB-IF:2021
Brian Marley Microchip Technology Inc. Bart Vertenten NXP Semiconductors
Dave Perchlik Microchip Technology Inc. Dennis Ha NXP Semiconductors
Don Perkins Microchip Technology Inc. Dong Nguyen NXP Semiconductors
Fernando Gonzalez Microchip Technology Inc. Guru Prasad NXP Semiconductors
John Sisto Microchip Technology Inc. Ken Jaramillo NXP Semiconductors
Josh Averyt Microchip Technology Inc. Krishnan TN NXP Semiconductors
Kiet Tran Microchip Technology Inc. Michael Joehren NXP Semiconductors
Mark Bohm Microchip Technology Inc. Robert de Nie NXP Semiconductors
Matthew Kalibat Microchip Technology Inc. Rod Whitby NXP Semiconductors
Mick Davis Microchip Technology Inc. Vijendra Kuroodi NXP Semiconductors
Prasanna Microchip Technology Inc. Winston Langeslag NXP Semiconductors
Vengateshan
Robert Heaton Obsidian Technology
Rich Wahler Microchip Technology Inc.
Andrew Yoo ON Semiconductor
Richard Petrie Microchip Technology Inc.
Brady Maasen ON Semiconductor
Ronald Kunin Microchip Technology Inc.
Bryan McCoy ON Semiconductor
Shannon Cash Microchip Technology Inc.
Christian Klein ON Semiconductor
Thomas Farkas Microchip Technology Inc.
Cor Voorwinden ON Semiconductor
Venkataraman
Microchip Technology Inc.
Edward Berrios ON Semiconductor
Krishnamoorthy
Michael Smith ON Semiconductor
Andrew Yang Microsoft Corporation
Oscar Freitas ON Semiconductor
Anthony Chen Microsoft Corporation
Tom Duffy ON Semiconductor
Arvind Murching Microsoft Corporation
Brian Collins Parade Technologies Inc.
Dave Perchlik Microsoft Corporation
Craig Wiley Parade Technologies Inc.
David Voth Microsoft Corporation
Aditya Kulkarni Power Integrations
Geoff Shew Microsoft Corporation
Akshay Nayaknur Power Integrations
Jayson Kastens Microsoft Corporation
Amruta Patra Power Integrations
Kai Inha Microsoft Corporation
Rahul Joshi Power Integrations
Marwan Kadado Microsoft Corporation
Ricardo Pregiteer Power Integrations
Michelle Bergeron Microsoft Corporation
Shruti Anand Power Integrations
Nathan Sherman Microsoft Corporation
Amit gupta Qualcomm, Inc
Rahul Ramadas Microsoft Corporation
George Paparrizos Qualcomm, Inc
Randy Aull Microsoft Corporation
Giovanni Garcea Qualcomm, Inc
Shiu Ng Microsoft Corporation
Jack Pham Qualcomm, Inc
Tieyong Yin Microsoft Corporation
James Goel Qualcomm, Inc
Timo Toivola Microsoft Corporation
Joshua Warner Qualcomm, Inc
Toby Nixon Microsoft Corporation
Karyn Vuong Qualcomm, Inc
Vahid Vassey Microsoft Corporation
Lalan Mishra Qualcomm, Inc
Vivek Gupta Microsoft Corporation
Vamsi Samavedam Qualcomm, Inc
Yang You Microsoft Corporation
Vatsal Patel Qualcomm, Inc
Adib Al Abaji Molex LLC
Chris Sporck Qualcomm, Inc.
Aaron Xu Monolithic Power Systems Inc.
Craig Aiken Qualcomm, Inc.
Bo Zhou Monolithic Power Systems Inc.
Narendra Mehta Qualcomm, Inc.
Christian Sporck Monolithic Power Systems Inc.
Terry Remple Qualcomm, Inc.
Di Han Monolithic Power Systems Inc.
Will Kun Qualcomm, Inc.
Zhihong Yu Monolithic Power Systems Inc.
Yoram Rimoni Qualcomm, Inc.
Dan Wagner Motorola Mobility Inc.
Fan-Hau Hsu Realtek Semiconductor Corp.
Ben Crowe MQP Electronics Ltd.
Tsung-Peng Chuang Realtek Semiconductor Corp.
Pat Crowe MQP Electronics Ltd
...

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