Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification

IEC 62680-1-2:2019 defines a power delivery system covering all elements of a USB system including: Hosts, Devices, Hubs, Chargers and cable assemblies. This specification describes the architecture, protocols, power supply behavior, connectors and cabling necessary for managing power delivery over USB at up to 100W. This specification is intended to be fully compatible and extend the existing USB infrastructure. It is intended that this specification will allow system OEMs, power supply and peripheral developers adequate flexibility for product versatility and market differentiation without losing backwards compatibility.
This fourth edition cancels and replaces the third edition published in 2018 and constitutes a technical revision.
It is also identified as USB Power Delivery Specification, Revision 3.0, Version 1.2
This updated release of the USB PD specification was made to incorporate all the ECNs that were made to USB PD 3.0, V1.1. This makes a full completed printed specifications with all ECNs incorporated into a hard copy specification.

Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie 1-2 : Composants communs – Spécification de l'alimentation électrique par port USB

IEC 62680-1-2:2019 définit un système d'alimentation électrique par port USB qui couvre tous les éléments d'un système USB, y compris: hôtes, dispositifs, hubs, chargeurs et assemblages de câbles. La présente spécification décrit l'architecture, les protocoles, le comportement de l'alimentation électrique, les connecteurs et le câblage nécessaires à la gestion de l'alimentation électrique sur USB jusqu'à 100W. Cette spécification est destinée à être entièrement compatible avec les infrastructures USB existantes et à en assurer une extension. Il est prévu que cette spécification offre aux OEM de systèmes, ainsi qu'aux développeurs d'alimentations électriques et de périphériques, une souplesse appropriée pour une polyvalence des produits et leur différenciation sur le marché, sans perdre en compatibilité ascendante.
IEC 62680-1-2:2019 annule et remplace la troisième édition publiée en 2018, dont elle constitue une révision technique.

General Information

Status
Published
Publication Date
11-Dec-2019
Current Stage
DELPUB - Deleted Publication
Completion Date
16-Mar-2021
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IEC 62680-1-2
Edition 4.0 2019-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal serial bus interfaces for data and power
Part 1-2: Common components – USB Power Delivery specification

Interfaces de bus universel en série pour les données et l'alimentation électrique

Partie 1-2: Composants communs – Spécification de l'alimentation électrique
par port USB
IEC 62680-1-2:2019-12(en-fr)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2018 USB-IF

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

IEC, or USB-IF at the respective address given below. Any questions about USB-IF copyright should be addressed to

the USB-IF. Enquiries about obtaining additional rights to this publication and other information requests should be

addressed to t he IEC or your local IEC member National Committee.
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---------------------- Page: 2 ----------------------
IEC 62680-1-2
Edition 4.0 2019-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal serial bus interfaces for data and power
Part 1-2: Common components – USB Power Delivery specification

Interfaces de bus universel en série pour les données et l'alimentation électrique

Partie 1-2: Composants communs – Spécification de l'alimentation électrique
par port USB
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.220; 33.120; 35.200 ISBN 978-2-8322-7646-4

Warning! Make sure that you obtained this publication from an authorized distributor.

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® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62680-1-2:2019
© USB IF:2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER
Part 1-2: Common components – USB Power Delivery specification
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all

national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-

operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition

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with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights.

IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62680-1-2 has been prepared by technical area 18: Multimedia home

systems and applications for end-user networks, of IEC technical committee 100: Audio, video and

multimedia systems and equipment.

The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure and

editorial rules used in this publication reflect the practice of the organization which submitted it.

The text of this International Standard is based on the following documents:
CDV Report on voting
100/3189/CDV 100/3251/RVC

Full information on the voting for the approval of this International Standard can be found in the

report on voting indicated in the above table.
---------------------- Page: 4 ----------------------
IEC 62680-1-2:2019 – 3 –
© USB IF:2018

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to the

specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 5 ----------------------
– 4 – IEC 62680-1-2:2019
© USB IF:2018
INTRODUCTION

The IEC 62680 series is based on a series of specifications that were originally developed by the

USB Implementers Forum (USB-IF). These specifications were submitted to the IEC under the

auspices of a special agreement between the IEC and the USB-IF.

This standard is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision

3.0, Version 1.2.

The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group of

companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide

a support organization and forum for the advancement and adoption of Universal Serial Bus

technology. The Forum facilitates the development of high-quality compatible USB peripherals

(devices), and promotes the benefits of USB and the quality of products that have passed

compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS", WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT,
OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB IMPLEMENTERS FORUM AND THE
AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM ALL LIABILITY, INCLUDING LIABILITY
FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OR INFORMATION IN THIS SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU WITH ANY
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS.

Entering into USB Adopters Agreements may, however, allow a signing company to participate in a

reciprocal, RAND-Z licensing arrangement for compliant products. For more information, please see:

https://www.usb.org/documents
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO ENTER
INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB IMPLEMENTERS
FORUM.”
---------------------- Page: 6 ----------------------
IEC 62680-1-2:2019 © IEC 2019 – 5 –
© USB IF:2018
Universal Serial Bus
Power Delivery Specification
Revision: 3.0
Version: 1.2
Release date: 21 June 2018
---------------------- Page: 7 ----------------------
– 6 – IEC 62680-1-2:2019
© USB IF:2018
LIMITED COPYRIGHT LICENSE
THE USB 3.0 PROMOTERS GRANT A CONDITIONAL COPYRIGHT LICENSE UNDER THE
COPYRIGHTS EMBODIED IN THE USB POWER DELIVERY SPECIFICATION TO USE AND
REPRODUCE THE SPECIFICATION FOR THE SOLE PURPOSE OF, AND SOLELY TO THE EXTENT
NECESSARY FOR, EVALUATING WHETHER TO IMPLEMENT THE SPECIFICATION IN PRODUCTS
THAT WOULD COMPLY WITH THE SPECIFICATION. WITHOUT LIMITING THE FOREGOING, USE
THE OF SPECIFICATION FOR THE PURPOSE OF FILING OR MODIFYING ANY PATENT
APPLICATION TO TARGET THE SPECIFICATION OR USB COMPLIANT PRODUCTS IS NOT
AUTHORIZED. EXCEPT FOR THIS EXPRESS COPYRIGHT LICENSE, NO OTHER RIGHTS OR

LICENSES ARE GRANTED, INCLUDING WITHOUT LIMITATION ANY PATENT LICENSES. IN ORDER

TO OBTAIN ANY ADDITIONALY INTELLECTUAL PROPERTY LICENSES OR LICENSING
COMMITMENTS ASSOCIATED WITH THE SPECIFICATION A PARTY MUST EXECUTE THE USB 3.0
ADOPTERS AGREEMENT. NOTE: BY USING THE SPECIFICATION, YOU ACCEPT THESE LICENSE
TERMS ON YOUR OWN BEHALF AND, IN THE CASE WHERE YOU ARE DOING THIS AS AN
EMPLOYEE, ON BEHALF OF YOUR EMPLOYER.
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER,
INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR

ANY PARTICULAR PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY,

INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE
OR IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS

SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to techsup@usb.org
For industry information, refer to the USB Implementers Forum web page at
http://www.usb.org

All product names are trademarks, registered trademarks, or service marks of their respective

owners.

Copyright © 2010-2018, USB 3.0 Promoter Group: Apple Inc., Hewlett-Packard Inc., Intel

Corporation, Microsoft Corporation, Renesas, STMicroelectronics, and Texas Instruments.

All rights reserved.
---------------------- Page: 8 ----------------------
IEC 62680-1-2:2019 © IEC 2019 – 7 –
© USB IF:2018
Chairs
Alvin Cox Cabling Sub-Chair
Bob Dunstan Specification Chair/Protocol Subgroup Chair
Deric Waters PHY Chair
Ed Berrios Power Supply Chair
Rahman Ismail System Policy Chair
Richard Petrie Specification Chair/Device Policy Chair
Editors
Bob Dunstan
Richard Petrie
Contributors
---------------------- Page: 9 ----------------------
– 8 – IEC 62680-1-2:2019
© USB IF:2018

Charles Wang ACON, Advanced-Connectek, Inc. Sathish Kumar Cadence Design Systems, Inc.

Ganesan
Conrad Choy ACON, Advanced-Connectek, Inc.
Alessandro Canova Tech
Dennis Chuang ACON, Advanced-Connectek, Inc.
Ingrassia
Steve Sedio ACON, Advanced-Connectek, Inc.
Andrea Colognese Canova Tech
Sunney Yang ACON, Advanced-Connectek, Inc.
Antonio Orzelli Canova Tech
Vicky Chuang ACON, Advanced-Connectek, Inc.
Davide Ghedin Canova Tech
Joseph Scanlon Advanced Micro Devices
Matteo Casalin Canova Tech
Caspar Lin Allion Labs, Inc.
Michael Marioli Canova Tech
Casper Lee Allion Labs, Inc.
Nicola Canova Tech
Danny Shih Allion Labs, Inc.
Scantamburlo
Howard Chang Allion Labs, Inc.
Paolo Pilla Canova Tech
Greg Stewart Analogix Semiconductor, Inc.
Yi-Feng Lin Canyon Semiconductor
Mehran Badii Analogix Semiconductor, Inc.
YuHung Lin Canyon Semiconductor
Alexei Kosut Apple
David Tsai Chrontel, Inc.
Bill Cornelius Apple
Anshul Gulati Cypress Semiconductor
Carlos Colderon Apple
Anup Nayak Cypress Semiconductor
Chris Uiterwijk Apple
Benjamin Kropf Cypress Semiconductor
Colin Whitby- Apple
Dhanraj Rajput Cypress Semiconductor
Strevens
Ganesh Cypress Semiconductor
Corey Axelowitz Apple
Subramaniam
Corey Lange Apple
Jagadeesan Raj Cypress Semiconductor
Dave Conroy Apple
Junjie cui Cypress Semiconductor
David Sekowski Apple
Manu Kumar Cypress Semiconductor
Girault Jones Apple
Muthu M Cypress Semiconductor
James Orr Apple
Nicholas Bodnaruk Cypress Semiconductor
Jason Chung Apple
Pradeep Bajpai Cypress Semiconductor
Jay Kim Apple
Rajaram R Cypress Semiconductor
Jeff Wilcox Apple
Rama Vakkantula Cypress Semiconductor
Jennifer Tsai Apple
Rushil Kadakia Cypress Semiconductor
Karl Bowers Apple
Simon Nguyen Cypress Semiconductor
Keith Porthouse Apple
Steven Wong Cypress Semiconductor
Kevin Hsiue Apple
Subu Sankaran Cypress Semiconductor
Matt Mora Apple
Sumeet Gupta Cypress Semiconductor
Paul Baker Apple
Tejender Sheoran Cypress Semiconductor
Reese Schreiber Apple
Venkat Cypress Semiconductor
Ruchi Chaturvedi Apple
Mandagulathar
Sameer Kelkar Apple
Xiaofeng Shen Cypress Semiconductor
Sasha Tietz Apple
Zeng Wei Cypress Semiconductor
Scott Jackson Apple
Adolfo Montero Dell Inc.
Sree Raman Apple
Bruce Montag Dell Inc.
William Ferry Apple
Gary Verdun Dell Inc.
Zaki Moussaoui Apple
Merle Wood Dell Inc.
Jeff Liu ASMedia Technology Inc.
Mohammed Hijazi Dell Inc.
Kuo Lung Li ASMedia Technology Inc.
Siddhartha Reddy Dell Inc.
Ming-Wei Hsu ASMedia Technology Inc.
Bindhu Vasu Dialog Semiconductor (UK) Ltd
PS Tseng ASMedia Technology Inc.
Chanchal Gupta Dialog Semiconductor (UK) Ltd
Sam Tzeng ASMedia Technology Inc.
Dipti Baheti Dialog Semiconductor (UK) Ltd
Thomas Hsu ASMedia Technology Inc.
Duc Doan Dialog Semiconductor (UK) Ltd
Weikao Chang ASMedia Technology Inc.
Holger Petersen Dialog Semiconductor (UK) Ltd
Yang Cheng ASMedia Technology Inc.
Jianming Yao Dialog Semiconductor (UK) Ltd
Shawn Meng Bizlink Technology Inc.
John Shi Dialog Semiconductor (UK) Ltd
Bernard Shyu Bizlink Technology, Inc.
KE Hong Dialog Semiconductor (UK) Ltd
Eric Wu Bizlink Technology, Inc.
Kevin Mori Dialog Semiconductor (UK) Ltd
Morphy Hsieh Bizlink Technology, Inc.
Larry Ping Dialog Semiconductor (UK) Ltd
Sean O'Neal Bizlink Technology, Inc.
Mengfei Liu Dialog Semiconductor (UK) Ltd
Tiffany Hsiao Bizlink Technology, Inc.
Scott Brown Dialog Semiconductor (UK) Ltd
Weichung Ooi Bizlink Technology, Inc.
Yimin Chen Dialog Semiconductor (UK) Ltd
Rahul Bhushan Broadcom Corp.
Yong Li Dialog Semiconductor (UK) Ltd
Asila nahas Cadence Design Systems, Inc.
Dan Ellis DisplayLink (UK) Ltd.
Claire Ying Cadence Design Systems, Inc.
Jason Young DisplayLink (UK) Ltd.
Jie min Cadence Design Systems, Inc.
Kevin Jacobs DisplayLink (UK) Ltd.
Mark Summers Cadence Design Systems, Inc.
Paulo Alcobia DisplayLink (UK) Ltd.
Michal Staworko Cadence Design Systems, Inc.
Peter Burgers DisplayLink (UK) Ltd.
---------------------- Page: 10 ----------------------
IEC 62680-1-2:2019 © IEC 2019 – 9 –
© USB IF:2018
Richard Petrie DisplayLink (UK) Ltd. Rahul Lakdawala Hewlett Packard
Abel Astley Ellisys Robin Castell Hewlett Packard
Chuck Trefts Ellisys Roger Benson Hewlett Packard
Emmanuel Durin Ellisys Ron Schooley Hewlett Packard
Mario Pasquali Ellisys Hideyuki Hosiden Corporation
HAYAFUJI
Tim Wei Ellisys
Keiji Mine Hosiden Corporation
Chien-Cheng Kuo Etron Technology, Inc.
Masaki YAMAOKA Hosiden Corporation
Jack Yang Etron Technology, Inc.
Takashi MUTO Hosiden Corporation
Richard Crisp Etron Technology, Inc.
Yasunori Hosiden Corporation
Shyanjia Chen Etron Technology, Inc.
NISHIKAWA
TsungTa Lu Etron Technology, Inc.
Kenneth Chan HP Inc.
Christian Klein Fairchild Semiconductor
Lee Atkinson HP Inc.
Oscar Freitas Fairchild Semiconductor
Steve Chen HP Inc.
Souhib Harb Fairchild Semiconductor
Suketu Partiwala HP Inc.
Amanda Ying Feature Integration Technology
Suketu Partiwala HP Inc.
Inc.
Vaibhav Malik HP Inc.
Jacky Chan Feature Integration Technology
Inc. Walter Fry HP Inc.

Kenny Hsieh Feature Integration Technology Bai Sean Huawei Technologies Co., Ltd.

Inc.
Chunjiang Zhao Huawei Technologies Co., Ltd.
KungAn Lin Feature Integration Technology
JianQuan Wu Huawei Technologies Co., Ltd.
Inc.
Li Zongjian Huawei Technologies Co., Ltd.
Paul Yang Feature Integration Technology
Lihua Duan Huawei Technologies Co., Ltd.
Inc.
Min Chen Huawei Technologies Co., Ltd.
su Jaden Feature Integration Technology
Wang Feng Huawei Technologies Co., Ltd.
Inc.
Wei Haihong Huawei Technologies Co., Ltd.
Yu-Lin Chu Feature Integration Technology
Robert Heaton Indie Semiconductor
Inc.
Vincent Wang Indie Semiconductor
Yulin Lan Feature Integration Technology
Inc.
Sie Boo Chiang Infineon Technologies
AJ Yang Foxconn / Hon Hai
Tue Fatt David Infineon Technologies
Wee
Fred Fons Foxconn / Hon Hai
Wee Tar Richard Infineon Technologies
Jie zheng Foxconn / Hon Hai
Steve Sedio Foxconn / Hon Hai
Wolfgang Furtner Infineon Technologies
Terry Little Foxconn / Hon Hai
Bob Dunstan Intel Corporation
Bob McVay Fresco Logic Inc.
Brad Saunders Intel Corporation
Christopher Meyers Fresco Logic Inc.
Chee Lim Nge Intel Corporation
Dian Kurniawan Fresco Logic Inc.
Christine Krause Intel Corporation
Tom Burton Fresco Logic Inc.
Dan Froelich Intel Corporation
Adam Rodriguez Google Inc.
David Harriman Intel Corporation
Alec Berg Google Inc.
David Hines Intel Corporation
Dave Bernard Google Inc.
David Thompson Intel Corporation
David Schneider Google Inc.
Guobin Liu Intel Corporation
Jim Guerin Google Inc.
Harry Skinner Intel Corporation
Juan Fantin Google Inc.
Henrik Leegaard Intel Corporation
Ken Wu Google Inc.
Jenn Chuan Cheng Intel Corporation
Mark Hayter Google Inc.
Jervis Lin Intel Corporation
Nithya Google Inc.
John Howard Intel Corporation
Jagannathan
Karthi Vadivelu Intel Corporation
Srikanth Google Inc.
Lakshmikanthan
Leo Heiland Intel Corporation
Todd Broch Google Inc.
Maarit Harkonen Intel Corporation
Toshak Singhal Google Inc.
Nge Chee Lim Intel Corporation
Vincent Palatin Google Inc. Paul Durley Intel Corporation
Xuelin Wu Google Inc.
Rahman Ismail Intel Corporation
Alan Kinningham Granite River Labs
Rajaram Intel Corporation
Regupathy
Balamurugan Granite River Labs
Manialagan
Ronald Swartz Intel Corporation
Mike Engbretson Granite River Labs Sarah Sharp Intel Corporation
Mike Wu Granite River Labs
Scott Brenden Intel Corporation
Mukesh Tatiya Granite River Labs
Sridharan Intel Corporation
Ranganathan
Rajaraman V Granite River Labs
Steve McGowan Intel Corporation
Tim Lin Granite River Labs
Tim McKee Intel Corporation
Alan Berkema Hewlett Packard
Toby Opferman Intel Corporation
Lee Atkinson Hewlett Packard
---------------------- Page: 11 ----------------------
– 10 – IEC 62680-1-2:2019
© USB IF:2018
Jia Wei Intersil Corporation Thomas Farkas Microchip Technology Inc.
Al Hsiao ITE Tech. Inc. Andrew Yang Microsoft Corporation
Greg Song ITE Tech. Inc. Anthony Chen Microsoft Corporation
Richard Guo ITE Tech. Inc. Arvind Murching Microsoft Corporation
Victor Lin ITE Tech. Inc. Dave Perchlik Microsoft Corporation
Y.C. Chou ITE Tech. Inc. David Voth Microsoft Corporation
Kenta Minejima Japan Aviation Electronics Geoff Shew Microsoft Corporation
Industry Ltd. (JAE)
Jayson Kastens Microsoft Corporation
Mark Saubert Japan Aviation Electronics
Kai Inha Microsoft Corporation
Industry Ltd. (JAE)
Marwan Kadado Microsoft Corporation
Toshio Shimoyama Japan Aviation Electronics
Michelle Bergeron Microsoft Corporation
Industry Ltd. (JAE)
Rahul Ramadas Microsoft Corporation
Brian Fetz Keysight Technologies Inc.
Randy Aull Microsoft Corporation
Babu Mailachalam Lattice Semiconductor Corp
Shiu Ng Microsoft Corporation
Gianluca Mariani Lattice Semiconductor Corp
Timo Toivola Microsoft Corporation
Joel Coplen Lattice Semiconductor Corp
Toby Nixon Microsoft Corporation
Thomas Watza Lattice Semiconductor Corp
Vivek Gupta Microsoft Corporation
Vesa Lauri Lattice Semiconductor Corp
Yang You Microsoft Corporation
Bruce Chuang Leadtrend
Aaron Xu Monolithic Power Systems Inc.
Eilian Liu Leadtrend
Bo Zhou Monolithic Power Systems Inc.
Daniel H Jacobs LeCroy Corporation
Christian Sporck Monolithic Power Systems Inc.
Jake Jacobs LeCroy Corporation
Di Han Monolithic Power Systems Inc.
Kimberley McKay LeCroy Corporation
Zhihong Yu Monolithic Power Systems Inc.
Mike Micheletti LeCroy Corporation
Dan Wagner Motorola Mobility Inc.
Roy Chestnut LeCroy Corporation
Ben Crowe MQP Electronics Ltd.
Tyler Joe LeCroy Corporation
Pat Crowe MQP Electronics Ltd.
Phil Jakes Lenovo
Sten Carlsen MQP Electronics Ltd.
Aaron Melgar Lion Semiconductor
Kenji Oguma NEC Corporation
Chris Zhou Lion Semiconductor
Frank Borngräber Nokia Corporation
Sehyung Jeon Lion Semiconductor
Kai Inha Nokia Corporation
Wonyoung Kim Lion Semiconductor
Pekka Leinonen Nokia Corporation
Yongho Kim Lion Semiconductor
Richard Petrie Nokia Corporation
Dave Thompson LSI Corporation
Sten Carlsen Nokia Corporation
Alan Kinningham Luxshare-ICT
Abhijeet Kulkarni NXP Semiconductors
Daniel Chen Luxshare-ICT
Ahmad Yazdi NXP Semiconductors
James Stevens Luxshare-ICT
Bart Vertenten NXP Semiconductors
Josue Castillo Luxshare-ICT
Dennis Ha NXP Semiconductors
Scott Shuey Luxshare-ICT
Dong Nguyen NXP Semiconductors
Chikara Kakizawa Maxim Integrated Products
Guru Prasad NXP Semiconductors
Jacob Scott Maxim Integrated Products
Ken Jaramillo NXP Semiconductors
Ken Helfrich Maxim Integrated Products
Krishnan TN NXP Semiconductors
Michael Miskho Maxim Integrated Products
Michael Joehren NXP Semiconductors
Chris Yokum MCCI Corporation
Robert de Nie NXP Semiconductors
Geert Knapen MCCI Corporation
Rod Whitby NXP Semiconductors
Terry Moore MCCI Corporation
Vijendra Kuroodi NXP Semiconductors
Velmurugan MCCI Corporation
Winston Langeslag NXP Semiconductors
Selvaraj
Robert Heaton Obsidian Technology
Satoru Kumashiro MegaChips Corporation
Andrew Yoo ON Semiconductor
Brian Marley Microchip Technology Inc.
Brady Maasen ON Semiconductor
Dave Perchlik Microchip Technology Inc.
Bryan McCoy ON Semiconductor
Don Perkins Microchip Technology Inc.
Christian Klein ON Semiconductor
Fernando Gonzalez Microchip Technology Inc.
Cor Voorwinden ON Semiconductor
John Sisto Microchip Technology Inc.
Edward Berrios ON Semiconductor
Josh Averyt Microchip Technology Inc.
Michael Smith ON Semiconductor
Kiet Tran Microchip Technology Inc.
Oscar Freitas ON Semiconductor
Mark Bohm Microchip Technology Inc.
Tom Duffy ON Semiconductor
Matthew Kalibat Microchip Technology Inc.
Craig Wiley Parade Technologies Inc.
Mick Davis Microchip Technology Inc.
Aditya Kulkarni Power Integrations
Prasanna Microchip Technology Inc.
Amruta Patra Power Integrations
Vengateshan
Rahul Joshi Power Integrations
Rich Wahler Microchip Technology Inc.
Ricardo Pregiteer Power Integrations
Richard Petrie Microchip Technology Inc.
Shruti Anand Power Integrations
Ronald Kunin Microchip Technology Inc.
Amit gupta Qualcomm, Inc
Shannon Cash Microchip Technology Inc.
---------------------- Page: 12 ----------------------
IEC 62680-1-2:2019 © IEC 2019 – 11 –
© USB IF:2018
George Paparrizos Qualcomm, Inc Steven Ghang Silicon Laboratories, Inc.
Giovanni Garcea Qualcomm, Inc Abhishek SiliConch Systems Private Limited
Sardeshpande
Jack Pham Qualcomm, Inc
Aniket Mathad SiliConch Systems Private Limited
James Goel Qualcomm, Inc
Chandana N SiliConch Systems Private Limited
Joshua Warner Qualcomm, Inc
Jaswanth SiliConch Systems Private Limited
Karyn Vuong Qualcomm, Inc
Ammineni
Vamsi Samavedam Qualcomm, Inc
Jinisha Patel SiliConch Systems Private Limited
Vatsal Patel Qualcomm, Inc
Kaustubh Kumar SiliConch Systems Private Limited
Chris Sporck Qualcomm, Inc.
Nitish Nitish SiliConch Systems Private Limited
Craig Aiken Qualcomm, Inc.
Pavitra SiliConch Systems Private Limited
Narendra Mehta Qualcomm, Inc.
Balasubramanian
Terry Remple Qualcomm, Inc.
Rakesh Polasa SiliConch Systems Private Limited
Will Kun Qualcomm, Inc.
Shubham Paliwal SiliConch Systems Private Limited
Yoram Rimoni Qualcomm, Inc.
Vishnu Pusuluri SiliConch Systems Private Limited
Tsung-Peng Realtek Semiconductor Corp.
John Sisto SMSC
Chuang
Ken Gay SMSC
Atsushi Mitamura Renesas Electronics Corp.
Mark Bohm SMSC
Bob Dunstan Renesas Electronics Corp.
Richard Wahler SMSC
Brian Allen Renesas Electronics Corp.
Shannon Cash SMSC
Dan Aoki Renesas Electronics Corp.
Tim Knowlton SMSC
Hajime Nozaki Renesas Electronics Corp.
William Chiechi SMSC
John Carpenter Renesas Electronics Corp.
Shigenori Tagami Sony Corporation
Kiichi Muto Renesas Electronics Corp.
Shinichi Hirata Sony Corporation
Masami Katagiri Renesas Electronics Corp.
Amanda Hosler Specwerkz
Nobuo Furuya Renesas Electronics Corp.
Bob Dunstan Specwerkz
Patrick Yu Renesas Electronics Corp.
Diane Lenox Specwerkz
Peter Teng Renesas Electronics Corp.
Michael Munn StarTech.com Ltd.
Philip Leung Renesas Electronics Corp.
Fabien Friess ST-Ericsson
Steve Roux Renesas Electronics Corp.
Giuseppe Platania ST-Ericsson
Tetsu Sato Renesas Electronics Corp.
Jean-Francois ST-Ericsson
Toshifumi Yamaoka Renesas Electronics Corp.
Gatto
Chunan Kuo Richtek Technology Corporation
Milan Stamenkovic ST-Ericsson
Heinz Wei Richtek Technology Corporation
Nicolas Florenchie ST-Ericsson
TZUHSIEN Richtek Technology Corporation
Patrizia Milazzo ST-Ericsson
CHUANG
Christophe STMicroelectronics
Tatsuya Irisawa Ricoh Company Ltd.
Cochard
Akihiro Ono Rohm Co. Ltd.
Christophe Lorin STMicroelectronics
Chris Lin Rohm Co. Ltd.
Jessy Guilbot STMicroelectronics
Hidenori Nishimoto Rohm Co. Ltd.
Joel Huloux STMicroelectronics
Kris Bahar Rohm Co. Ltd.
John Bloomfield STMicroelectronics
Manabu Miyata Rohm Co. Ltd.
Massimo Panzica STMicroelectronics
Ruben Balbuena Rohm Co. Ltd.
Meriem Mersel STMicroelectronics
Takashi Sato Rohm Co. Ltd.
Nathalie Ballot STMicroelectronics
Vijendra Kuroodi Rohm Co. Ltd.
Pascal Legrand STMicroelectronics
Yusuke Kondo Rohm Co. Ltd.
Patrizia Milazzo STMicroelectronics
Kazuomi Nagai ROHM Co., Ltd.
Richard O’Connor STMicroelectronics
Matti Kulmala Salcomp Plc
Morten Synopsys, Inc.
Toni Lehimo Salcomp Plc
Christiansen
Tong Kim Samsung Electronics Co. Ltd.
Nivin George Synopsys, Inc.
Alvin Cox Seagate Technology LLC
Zongyao Wen Synopsys, Inc.
Emmanuel Lemay Seagate Technology LLC
Joan Marrinan Tektronix
John Hein Seagate Technology LLC
Kimberley McKay Teledyne-LeCroy
Marc Noblitt Seagate Technology LLC
Matthew Dunn Teledyne-LeCroy
Michael Morgan Seagate Technology LLC
Tony Minchell Teledyne-LeCroy
Ronald Rueckert Seagate Technology LLC
Anand Dabak Texas Instruments
Tony Priborsky Seagate Technology LLC
Bill Waters Texas Instruments
Chin Chang Semtech Corporation
Bing Lu Texas Instruments
Tom Farkas Semtech C
...

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