IEC 61189-2-720:2024

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-720 : Détection de défauts présents dans les structures d'interconnexion par mesurage de la capacité

L’IEC 61189-2-720:2024 fournit une méthode pour évaluer les caractéristiques spécifiques des circuits imprimés en mesurant la capacité entre les traces conductrices et un plan de masse. Elle peut être utilisée pour établir une comparaison qualitative d'un spécimen d'essai par rapport à un circuit de référence. Cette méthode n'est pas destinée aux mesures quantitatives ni à l'évaluation de la conformité à une spécification.

General Information

• Status: Published
• Publication Date: 05-Mar-2024
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 22-Mar-2024
• Completion Date: 06-Mar-2024

Standards Content (Sample)

IEC 61189-2-720 ®
Edition 1.0 2024-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, circuit boards and other interconnection
structures and assemblies –
Part 2-720: Detection of defects in interconnection structures by measurement
of capacitance
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-720 : Détection de défauts présents dans les structures
d'interconnexion par mesurage de la capacité
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IEC 61189-2-720 ®
Edition 1.0 2024-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, circuit boards and other interconnection

structures and assemblies –
Part 2-720: Detection of defects in interconnection structures by measurement

of capacitance
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-720 : Détection de défauts présents dans les structures

d'interconnexion par mesurage de la capacité

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-8327-1

– 2 – IEC 61189-2-720:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Objective . 5
5 Test specimen . 6
6 Test method . 6
7 Test procedures . 7
8 Report . 8
Annex A (informative) The capacitive test method . 9
A.1 Test schematic . 9
A.2 Test result. 9

Figure 1 – Capacitance difference depending on the defect of mouse bite . 6
Figure 2 – Test specimen . 6
Figure 3 – Schematic of the capacitance test method . 7
Figure A.1 – Test schematic . 9

Table 1 – Definition of uppercase . 8
Table A.1 – Test result for the test specimen . 10

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, CIRCUIT BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-720: Detection of defects in interconnection
structures by measurement of capacitance

FOREWORD
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IEC 61189-2-720 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1923/FDIS 91/1934/RVD
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 61189-2-720:2024 © IEC 2024
This document has been drafted in accordance with the ISO/IEC Directives, Part 2 2, and
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A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, circuit boards and other interconnection structures and assemblies, can be
found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
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