IEC 61189-2-805:2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces

L’IEC 61189-2-805:2024 définit la méthode à suivre pour la détermination du coefficient de dilatation thermique X/Y de matériaux isolants électriques minces par l’utilisation d’un analyseur thermomécanique (TMA, thermomechanical analyser). Cette méthode est applicable aux matériaux qui sont solides sur toute la plage de températures utilisée et qui conservent une rigidité suffisante sur toute la plage de températures, de telle sorte qu'une indentation irréversible du spécimen par la sonde de détection ne se produise pas.

General Information

• Status: Published
• Publication Date: 17-Apr-2024
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 08-May-2024
• Completion Date: 18-Apr-2024

Standards Content (Sample)

IEC 61189-2-805 ®
Edition 1.0 2024-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-805: X/Y CTE test for thin base materials by TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces
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IEC 61189-2-805 ®
Edition 1.0 2024-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-805: X/Y CTE test for thin base materials by TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-8700-2

– 2 – IEC 61189-2-805:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
4.1 Preparation . 5
4.2 Number . 5
4.3 Form . 5
4.4 Conditioning . 6
5 Apparatus and materials . 6
6 Procedure . 6
7 Evaluation . 7
7.1 General . 7
7.2 Calculation of coefficient of thermal expansion curve . 8
7.3 Calculation of instantaneous coefficient of thermal expansion curve
(optional) . 9
8 Report . 9
Bibliography . 10

Figure 1 – TMA expansion curves: first heat cycles and second heat cycles . 6
Figure 2 – TMA expansion curve . 7
Figure 3 – TMA expansion curve and instantaneous CTE curve . 8

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-805: X/Y CTE test for thin base materials by TMA

FOREWORD
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IEC 61189-2-805 has been prepared IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1755/CDV 91/1782/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 61189-2-805:2024 © IEC 2024
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
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specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUC
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