IEC TS 62878-2-3:2015

Device embedded substrate - Part 2-3: Guidelines - Design guide

IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

Substrat avec appareil(s) intégré(s) - Partie 2-3: Directives - Guide de conception

L'IEC TS 62878-2-3:2015 décrit le guide de conception des substrats avec appareil(s) intégré(s). Le guide de conception du substrat avec appareil(s) intégré(s) est essentiellement identique à celui de différentes cartes de circuits électroniques. La présente partie de l'IEC 62878 permet une compréhension approfondie de la conception du circuit, de la conception de la structure, de la conception de la carte, de la fabrication de la carte, de jisso (processus d'assemblage) et des essais des produits. Il est applicable aux substrats avec appareil(s) intégré(s) fabriqués à partir de matériaux de base organiques, y compris par exemple les appareils actifs ou passifs, les composants discrets formés lors du processus de fabrication d'une carte de câblage électronique, ainsi que les composants de feuilles minces.

General Information

• Status: Published
• Publication Date: 26-Mar-2015
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 6 - TC 91/WG 6
• Current Stage: PPUB - Publication issued
• Start Date: 15-Mar-2015
• Completion Date: 27-Mar-2015

Standards Content (Sample)

IEC TS 62878-2-3 ®
Edition 1.0 2015-03
TECHNICAL
SPECIFICATION
SPECIFICATION
TECHNIQUE
colour
inside
Device embedded substrate –
Part 2-3: Guidelines – Design guide

Substrat avec appareil(s) intégré(s) –
Partie 2-3: Directives – Guide de conception

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: [phone]
3, rue de Varembé Fax: [phone]
CH-1211 Geneva 20 [e-mail]
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing more than 30 000 terms and
Technical Specifications, Technical Reports and other definitions in English and French, with equivalent terms in 15
documents. Available for PC, Mac OS, Android Tablets and additional languages. Also known as the International
iPad. Electrotechnical Vocabulary (IEV) online.

IEC publications search - www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a More than 60 000 electrotechnical terminology entries in
variety of criteria (reference number, text, technical English and French extracted from the Terms and Definitions
committee,…). It also gives information on projects, replaced clause of IEC publications issued since 2002. Some entries
and withdrawn publications. have been collected from earlier publications of IEC TC 37,

77, 86 and CISPR.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: [e-mail].
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient plus de 30 000 termes et définitions en
Spécifications techniques, Rapports techniques et autres
anglais et en français, ainsi que les termes équivalents dans
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
15 langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.

Recherche de publications IEC - www.iec.ch/searchpub
Glossaire IEC - std.iec.ch/glossary
La recherche avancée permet de trouver des publications IEC Plus de 60 000 entrées terminologiques électrotechniques, en
en utilisant différents critères (numéro de référence, texte, anglais et en français, extraites des articles Termes et
comité d’études,…). Elle donne aussi des informations sur les Définitions des publications IEC parues depuis 2002. Plus
projets et les publications remplacées ou retirées. certaines entrées antérieures extraites des publications des

CE 37, 77, 86 et CISPR de l'IEC.
IEC Just Published - webstore.iec.ch/justpublished

Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just
Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur cette
Disponible en ligne et aussi une fois par mois par email. publication ou si vous avez des questions contactez-nous:
[e-mail].
IEC TS 62878-2-3 ®
Edition 1.0 2015-03
TECHNICAL
SPECIFICATION
SPECIFICATION
TECHNIQUE
colour
inside
Device embedded substrate –
Part 2-3: Guidelines – Design guide

Substrat avec appareil(s) intégré(s) –

Partie 2-3: Directives – Guide de conception

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-2403-8

– 2 – IEC TS 62878-2-3:2015 © IEC 2015

CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references. 7
3 Terms, definition and abbreviations . 7
3.1 Terms and definitions . 7
3.2 Abbreviations . 7
4 Structure of device embedded substrates . 8
4.1 General . 8
4.2 Specification of the top and bottom surfaces of a device embedded substrate . 8
4.3 Definition of layers of a device embedded substrate . 9
4.4 Conductor spacing at a terminal . 12
5 Conditions to prepare base and embedding devices . 15
5.1 Conditions for base . 15
5.2 Conditions for embedding devices . 16
6 Recommendation for embedding devices . 18
7 Design specification of device embedded substrate . 19
7.1 General . 19
7.2 Items to be included in the design specification . 19
7.2.1 Graphical indication of device embedding substrate . 19
7.2.2 Design specification template . 20
Bibliography . 24

Figure 1 – Definition of top and bottom surfaces of a device embedded substrate . 8
Figure 2 – Definition of top and bottom surfaces for mounting on a mother board . 9
Figure 3 – Names of layers in pad connection . 9
Figure 4 – Additional information concerning the interconnection position . 10
Figure 5 – Names of layers in via connection [I] . 11
Figure 6 – Names of layers in via connection [II] . 11
Figure 7 – Names of layers in via connection [III] . 12
Figure 8 – Definitions of dielectric gap and layer gap in the pad connection method . 13
Figure 9 – Definitions of dielectric gap and layer gap in the via connection method . 13
Figure 10 – Additional illustration of dielectric gap . 14
Figure 11 – Additional illustration of layer gap . 14
Figure 12 – Additional drawing . 19
Figure 13 – Forbidden wiring area . 20

Table 1 – Name of layers of device embedded board . 12
Table 2 – Recommendation for device assembly to base substrate for device
embedded boards . 15
Table 3 – Embedding recommendation . 16

– 3 – IEC TS 62878-2-3:2015 © IEC 2015
Table 4 – Mounting methods of semiconductor devices . 17
Table 5 – Embedding device . 18
Table 6 – Specification of device embedded substrate 1 . 21
Table 7 – Specification of device embedded substrate 2 . 22
Table 8 – Specification of device embedded substrate 3 . 23

– 4 – IEC TS 62878-2-3:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDED SUBSTRATE –
Part 2-3: Guidelines – Design guide

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the pub
...