IEC 62878-1:2019
(Main)Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Techniques d’assemblage avec appareils intégrés - Partie 1: Spécification générique pour substrats avec appareils intégrés
L'IEC 62878-1:2019 spécifie les exigences et méthodes d’essai génériques relatives aux substrats avec appareils intégrés. Les méthodes fondamentales d'essai pour les matériaux de substrats des cartes imprimées et pour les substrats eux-mêmes sont spécifiées dans l'IEC 61189-3.
La présente partie de l'IEC 62878 est applicable aux substrats avec appareils intégrés fabriqués à partir de matériaux organiques de base, y compris par exemple les appareils actifs ou passifs, les composants discrets formés lors du processus de fabrication des cartes imprimées électroniques, ainsi que les composants de feuilles minces.
La série IEC 62878 ne s'applique ni à la couche de redistribution (RDL – redistribution layer), ni aux modules électroniques définis dans l’IEC 62421.
General Information
Standards Content (Sample)
IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.190 ISBN 978-2-8322-7460-6
– 2 – IEC 62878-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Value chain . 8
4.1 System description. 8
4.1.1 Generic design variants . 8
4.1.2 Generic value chain . 8
4.2 Elements of the value chain . 9
4.2.1 General . 9
4.2.2 System manufacturer . 9
4.2.3 Components manufacturer . 9
4.2.4 Material manufacturer . 10
4.2.5 Submodule manufacturer . 10
4.2.6 Board manufacturer . 10
4.2.7 Assembly manufacturer . 10
4.3 Traceability . 10
5 Safety aspects of base material and components . 10
6 Design and structure of device embedded substrate . 11
6.1 Basic rules for layer description . 11
6.2 Design for embedding and testability . 11
6.3 Safety aspects of design . 11
7 Embedding technology . 11
7.1 Basic technologies for embedding . 11
7.2 Basic requirements to embedding technology . 11
7.2.1 Cleanliness of components, submodules and process . 11
7.2.2 ESD . 11
7.2.3 Moisture sensitivity . 11
7.2.4 Defects . 12
8 Tests and measuring methods . 12
8.1 Standard atmospheric conditions . 12
8.1.1 Standard atmospheric conditions for testing . 12
8.1.2 Referee conditions . 12
8.1.3 Reference conditions . 13
8.2 Electrical performance tests . 13
8.2.1 General . 13
8.2.2 Electrical test levels . 13
8.2.3 Protection of DES and test equipment . 13
8.2.4 Accuracy of measurement . 14
8.2.5 Test structures. 15
8.2.6 Mechanical performance tests . 15
8.2.7 Resistance to soldering heat . 15
8.2.8 Solderability. 16
8.2.9 Shock . 16
8.2.10 Vibration (sinusoidal) . 16
8.2.11 Resistance to solvents . 16
8.3 Climatic performance tests . 16
8.3.1 Dry heat . 16
8.3.2 Cold. 17
8.3.3 Damp heat, steady state . 17
8.3.4 Change of temperature . 17
9 Transportation, handling and packing material . 18
9.1 Humidity / Temperature / Environmental protection . 18
9.2 Mechanical protection . 18
9.3 ESD . 18
10 General requirements . 18
Bibliography . 19
Figure 1 – Value chain and interfaces . 9
Table 1 – Referee conditions . 12
– 4 – IEC 62878-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62878-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1597/FDIS 91/1616/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62878 series, published under the general title Device embedded
substrate, can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
– 6 – IEC 62878-1:2019 © IEC 2019
INTRODUCTION
This document is a generic specification for device-embedded substrates fabricated by
embedding discrete active and/or passive electronic devices into one or multiple inner layers
of an organic substrate with electric connections by means of vias, conductor plating,
conductive paste, and printing. Other special technologies for the realization of conductive or
isolating structures and electronic components functions inside of substrates, like electronic
modules or redistribution layers of integrated circuit packages are not covered by this
document.
The device-embedded substrate can be used as a substrate to mount SMDs or THDs to form
electronic circuits, as conductor and insulator layers can be formed after embedding
electronic devices.
The purpose of this series of documents is to obtain common understanding in structures, test
methods, design and fabrication processes and use of device-embedded substrate in the
industry. These documents do not specify details of the manufacturing processes, design
criteria and requirements, as those normally constitute intellectual property of the
manufacturers and are very specific to the individual embedding technologies and
applications.
Generic specification
The generic specification covers all subjects mainly common to device-embedded substrates
for use in electronic equipment, such as terminology, methods of measurement and tests.
Where the individual subjects require the prescription of conditions or parameters specific to
the particular sub-family or type of embedded substrates, such prescriptions are required to
be given by one of the subordinate specifications.
The numeric reference of the generic specification is IEC 62878-1.
Sectional and detail specifications (requirements to technology and components)
Sectional specifications cover all subjects additional to those given in the generic
specification, which are specific to a defined sub-group of device-embedded substrate
technologies. These subjects normally are preferred values for characteristics, additional test
methods and relevant prescriptions for test methods given in the generic specification,
prescriptions for sampling and for the preparation of specimens, recommended test severities
and preferred acceptance criteria. The sectional specification also outlines the structure and
scope of the test schedules that are to be applied in all subordinate detail specifications.
The numeric reference of the sectional and related detail specifications is IEC 62878-3-x.
Guidelines and supporting documentation
Supporting documentation and guidelines provide information in addition to the provisions of
generic, sectional and detail specifications.
The numeric reference of supporting documentation and guidelines is IEC 62878-2-x.
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
1 Scope
This part of IEC 62878 specifies the generic requirements and test methods for device-
embedded substrates. The basic test methods for printed board substrate materials and
substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of
organic base material, which includes, for example, active or passive devices, discrete
components formed in the fabrication process of electronic printed boards, and sheet-formed
components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic
modules defined in IEC 62421.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-69, Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing
of electronic components and printed boards by the wetting balance (force measurement)
method
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60194-2, Printed board design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
– 8 – IEC 62878-1:2019 © IEC 2019
IEC 61340-5-3, Electrostatics – Part 5-3: Protection of electronic devices from electrostatic
phenomena – Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760-4, Surface mounting technology – Part 4: Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62137-1-4, Surface mounting technology – Environmental and endurance test methods
for surface mount solder joint – Part 1-4: Cyclic bending test
IEC 62878-1-1, Device embedded substrate – Part 1-1: Generic specification – Test methods
IEC TS 62878-2-1, Device embedded substrate – Part 2-1: Guidelines – General description
of technology
IEC TR 62878-2-2, Device embedded substrate – Part 2-2: Guidelines – Electrical testing
IEC TS 62878-2-3, Device Embedded Substrate – Part 2-3: Guidelines – Design Guide
IEC TS 62878-2-4, Device Embedded Substrate – Part 2-4: Guidelines – Test element groups
(TEG)
J-STD 033, Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process
Sensitive Components
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-2 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
device-embedded substrate
DES
substrate in which one or more active devices (semiconductor device) and/or passive devices
(e.g. resistor or capacitor) are formed using thick-film technology or by embedding them
within the substrate
4 Value chain
4.1 System description
4.1.1 Generic design variants
Generic design variants are described in IEC TS 62878-2-1.
4.1.2 Generic value chain
The business model shown in Figure 1 shows the supply routes and communication along the
value chain.
---------------------- Pag
...
IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
Techniques d’assemblage avec appareils intégrés –
Partie 1: Spécification générique pour substrats avec appareils intégrés
IEC 662878-1:2019-10(en-fr)
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
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IEC 62878-1 ®
Edition 1.0 2019-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Device embedding assembly technology –
Part 1: Generic specification for device embedded substrates
Techniques d’assemblage avec appareils intégrés –
Partie 1: Spécification générique pour substrats avec appareils intégrés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-7949-6
– 2 – IEC 62878-1:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Value chain . 8
4.1 System description. 8
4.1.1 Generic design variants . 8
4.1.2 Generic value chain . 8
4.2 Elements of the value chain . 9
4.2.1 General . 9
4.2.2 System manufacturer . 9
4.2.3 Components manufacturer . 9
4.2.4 Material manufacturer . 10
4.2.5 Submodule manufacturer . 10
4.2.6 Board manufacturer . 10
4.2.7 Assembly manufacturer . 10
4.3 Traceability . 10
5 Safety aspects of base material and components . 10
6 Design and structure of device embedded substrate . 11
6.1 Basic rules for layer description . 11
6.2 Design for embedding and testability . 11
6.3 Safety aspects of design . 11
7 Embedding technology . 11
7.1 Basic technologies for embedding . 11
7.2 Basic requirements to embedding technology . 11
7.2.1 Cleanliness of components, submodules and process . 11
7.2.2 ESD . 11
7.2.3 Moisture sensitivity . 11
7.2.4 Defects . 12
8 Tests and measuring methods . 12
8.1 Standard atmospheric conditions . 12
8.1.1 Standard atmospheric conditions for testing . 12
8.1.2 Referee conditions . 12
8.1.3 Reference conditions . 13
8.2 Electrical performance tests . 13
8.2.1 General . 13
8.2.2 Electrical test levels . 13
8.2.3 Protection of DES and test equipment . 13
8.2.4 Accuracy of measurement . 14
8.2.5 Test structures. 15
8.2.6 Mechanical performance tests . 15
8.2.7 Resistance to soldering heat . 15
8.2.8 Solderability. 16
8.2.9 Shock . 16
8.2.10 Vibration (sinusoidal) . 16
8.2.11 Resistance to solvents . 16
8.3 Climatic performance tests . 16
8.3.1 Dry heat . 16
8.3.2 Cold. 17
8.3.3 Damp heat, steady state . 17
8.3.4 Change of temperature . 17
9 Transportation, handling and packing material . 18
9.1 Humidity / Temperature / Environmental protection . 18
9.2 Mechanical protection . 18
9.3 ESD . 18
10 General requirements . 18
Bibliography . 19
Figure 1 – Value chain and interfaces . 9
Table 1 – Referee conditions . 12
– 4 – IEC 62878-1:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62878-1 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This bilingual version (2020-03) corresponds to the monolingual English version, published in
2019-10.
The text of this International Standard is based on the following documents:
FDIS Report on voting
91/1597/FDIS 91/1616/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
The French version of this standard has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62878 series, published under the general title Device embedded
substrate, can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 62878-1:2019 © IEC 2019
INTRODUCTION
This document is a generic specification for device-embedded substrates fabricated by
embedding discrete active and/or passive electronic devices into one or multiple inner layers
of an organic substrate with electric connections by means of vias, conductor plating,
conductive paste, and printing. Other special technologies for the realization of conductive or
isolating structures and electronic components functions inside of substrates, like electronic
modules or redistribution layers of integrated circuit packages are not covered by this
document.
The device-embedded substrate can be used as a substrate to mount SMDs or THDs to form
electronic circuits, as conductor and insulator layers can be formed after embedding
electronic devices.
The purpose of this series of documents is to obtain common understanding in structures, test
methods, design and fabrication processes and use of device-embedded substrate in the
industry. These documents do not specify details of the manufacturing processes, design
criteria and requirements, as those normally constitute intellectual property of the
manufacturers and are very specific to the individual embedding technologies and
applications.
Generic specification
The generic specification covers all subjects mainly common to device-embedded substrates
for use in electronic equipment, such as terminology, methods of measurement and tests.
Where the individual subjects require the prescription of conditions or parameters specific to
the particular sub-family or type of embedded substrates, such prescriptions are required to
be given by one of the subordinate specifications.
The numeric reference of the generic specification is IEC 62878-1.
Sectional and detail specifications (requirements to technology and components)
Sectional specifications cover all subjects additional to those given in the generic
specification, which are specific to a defined sub-group of device-embedded substrate
technologies. These subjects normally are preferred values for characteristics, additional test
methods and relevant prescriptions for test methods given in the generic specification,
prescriptions for sampling and for the preparation of specimens, recommended test severities
and preferred acceptance criteria. The sectional specification also outlines the structure and
scope of the test schedules that are to be applied in all subordinate detail specifications.
The numeric reference of the sectional and related detail specifications is IEC 62878-3-x.
Guidelines and supporting documentation
Supporting documentation and guidelines provide information in addition to the provisions of
generic, sectional and detail specifications.
The numeric reference of supporting documentation and guidelines is IEC 62878-2-x.
DEVICE EMBEDDING ASSEMBLY TECHNOLOGY –
Part 1: Generic specification for device embedded substrates
1 Scope
This part of IEC 62878 specifies the generic requirements and test methods for device-
embedded substrates. The basic test methods for printed board substrate materials and
substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of
organic base material, which includes, for example, active or passive devices, discrete
components formed in the fabrication process of electronic printed boards, and sheet-formed
components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic
modules defined in IEC 62421.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-69, Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing
of electronic components and printed boards by the wetting balance (force measurement)
method
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60194-2, Printed board design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
– 8 – IEC 62878-1:2019 © IEC 2019
IEC 61340-5-3, Electrostatics – Part 5-3: Protection of electronic devices from electrostatic
phenomena – Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices
IEC 61760-4, Surface mounting technology – Part 4: Classification, packaging, labelling and
handling of moisture sensitive devices
IEC 62137-1-4, Surface mounting technology – Environmental and endurance test methods
for surface mount solder joint – Part 1-4: Cyclic bending test
IEC 62878-1-1, Device embedded substrate – Part 1-1: Generic specification – Test methods
IEC TS 62878-2-1, Device embedded substrate – Part 2-1: Guidelines – General description
of technology
IEC TR 62878-2-2, Device embedded substrate – Part 2-2: Guidelines – Electrical testing
IEC TS 62878-2-3, Device Embedded Substrate – Part 2-3: Guidelines – Design Guide
IEC TS 62878-2-4, Device Embedded Substrate – Part 2-4: Guidelines – Test element groups
(TEG)
J-STD 033, Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process
Sensitive Components
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-2 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
device-embedded substrate
DES
substrate in which one or more active devices (semiconductor device) and/or passive devices
(e.g. resistor or capacitor) are formed using thick-film technology or by embedding them
within the substrate
4 Value chain
4.1 System description
4.1.1 Generic design variants
Generic design variants are described in IEC TS 62878-2-1.
4.1.2 Generic value chain
The business model shown in Figure 1 shows the supply routes and communication along the
value chain.
Figure 1 – Value chain and interfaces
4.2 Elements of the value chain
4.2.1 General
All materials have to be aligned with the embedding technology and the components to be
embedded. Composition and processability of the materials and components for embedding
shall be compatible.
The detail specification for the base material shall be defined by the board or submodule
manufacturer. Generic specifications such as "FR4" are not specific enough.
4.2.2 System manufacturer
The requirements to the electronic system normally are determined by the system (equipment)
manufacturer and can contain requirements such as functionality, use conditions
(environmental and electrical), field performance, reliability, useful lifetime, restriction of
substances and further customer-specific requirements. These requirements shall be
deployed through the total value chain, e.g. by requirement sheets, so that assembly design
and processing, device-embedded substrate design and processing, as well as the
components and materials fit together, and can contribute to the fulfilment of those
requirements. The strategy for electrical tests shall be planned and confirmed by the involved
partners in accordance with IEC 62878-1-1 and IEC TR 62878-2-2, taking into consideration
component test specifications and tests at board and system level.
This deployment process can be supported in form of a failure mode and effect analysis
(FMEA) or by similar tools. A concept for the qualification of processes, components and
materials shall be agreed at a very early stage of development (see also IEC TS 62878-2-4).
4.2.3 Components manufacturer
The generic requirements of components are related to the embedding technology used, and
shall be specified in the supply specification, including specific requirements on dimensions
and tolerances.
– 10 – IEC 62878-1:2019 © IEC 2019
Standard components can be used for embedding technologies using solder or conductive
adhesive to realize electrical contacts. Specific embedding technologies, such as contacting
the components by microvia, require components specially designed for that use.
The manufacturers of components for DES should provide information on the limiting
conditions, e.g. sensitivity to pressure and mechanical forces, temperature, incompatibility
with chemicals and ionic contaminations, as well as other stresses induced by embedding
processes. Also, the thermal characteristic of the component under electrical load should be
specified. The component supplier should also supply a material content data sheet in a
format required by the submodule/board manufacturer.
4.2.4 Material manufacturer
Manufacturers of materials should be mindful of the limiting conditions and the characteristics
of the components. In order to indicate that the material can’t be specified for use with the
components, either a purchase specification that reflects the limiting conditions and
characteristics of the components in the frame of the upper and lower specification limits
should be signed, or an early warning should be given.
4.2.5 Submodule manufacturer
The submodule manufacturer is responsible for selecting processes, materials and
components that meet the specifications of the system manufacturer, but also ensure that no
incompatibilities or reliability risks arise between the material, components and processes.
The careful selection of materials, processes and components should be documented by
purchase specifications signed by all suppliers that participate in the DES. Risks related to
shipping, transportation, handling and assembly into the substrate shall be considered.
4.2.6 Board manufacturer
The board manufacturer shall provide design guidelines and a description of process
capability. All processes needed for the selected embedding technology shall be qualified
accordingly (see also Clause 7).
4.2.7 Assembly manufacturer
When processing the device embedded substrate (printed circuit board with devices
embedded), the assembly manufacturer shall consider the allowable mechanical and thermal
stresses as provided by the substrate manufacturer.
4.3 Traceability
Details and depth of traceability information shall be agreed between the involved partners at
the beginning of a project. Traceability information, in form of a lot traveller or similar, should
contain, among others, information on:
• components and material used,
• test and inspection records,
• indication of defective DES,
• test coupons (if required),
• manufacturing lot, date code or time stamp.
5 Safety aspects of base material and components
Safety requirements that apply to the base material and components are dependent on the
final application and requirements of the system designer. These shall be communicated
along the supply chain during the early stages of system development.
6 Design and structure of device embedded substrate
6.1 Basic rules for layer description
Built-up construction and terminology shall be established and aligned with suitable CAD
systems used, taking into account the 3D structure of the device-embedded substrate.
6.2 Design for embedding and testability
For more details, see design guideline IEC TS 62878-2-3 and test guideline
IEC TR 62878-2-2.
6.3 Safety aspects of design
The safety requirements of the design, e.g. clearance and creepage distances, need to be set
and agreed between the system designer and suppliers.
7 Embedding technology
7.1 Basic technologies for embedding
For more details, see IEC TS 62878-2-1. Further information can be found in JPCA-EB01 and
IPC 7092.
7.2 Basic requirements to embedding technology
7.2.1 Cleanliness of components, submodules and process
Surface properties and cleanliness shall be adapted to the processes. Related requirements
shall be agreed between the involved partners.
EXAMPLE Surface roughness, ionic or organic contamination, oxidation.
7.2.2 ESD
If electrostatic sensitive devices are handled in the embedding process, an electrostatic
control programme in accordance with IEC 61340-5-1 shall be developed, implemented and
monitored. This programme covers all activities such as: manufacturing, processing,
assembly, installation, packaging, labelling, servicing, testing, inspection or other handling of
electrical or electronic parts, assemblies and equipment susceptible to damage by
electrostatic discharges.
The level of protection against electrostatic discharge is determined by the most sensitive
components to be processed.
For guidance, refer to IEC TR 61340-5-2.
7.2.3 Moisture sensitivity
When moisture-sensitive devices are handled in the embedding process, the instructions
issued by the component manufacturers shall be followed [e.g. moisture sensitivity level
(MSL), floor life, manufacturing exposure time, pre-drying].
For specification of the device-embedded substrate, the most moisture-sensitive component
in its embedded stage shall be considered.
– 12 – IEC 62878-1:2019 © IEC 2019
7.2.4 Defects
Defect criteria and requirements shall be agreed in the specification of a device-embedded
substrate. It is recommended to include:
• interconnection defects,
• mechanical damages,
• voids, delamination,
• bow and twist of substrate,
• flatness of the surface (e.g. bulge).
8 Tests and measuring methods
8.1 Standard atmospheric conditions
8.1.1 Standard atmospheric conditions for testing
Unless otherwise specified, all tests and measurements shall be made under the standard
atmospheric conditions for testing as given in 4.3 of IEC 60068-1:2013:
– temperature: 15 °C to 35 °C;
– relative humidity: 25 % to 75 %;
– air pressure: 86 kPa to 106 kPa.
Before measurements, the DES shall be stored at the measuring temperature for a sufficient
duration to allow the entire DES to reach this temperature. The same duration as is
prescribed for recovery at the end of a test is normally sufficient for this purpose.
When it is difficult to measure in the standard atmospheric conditions and other conditions are
allowed in the relevant specification, the conditions during the measurements shall be stated
in the test report.
In the event of dispute or where required, the referee conditions (as given in 8.1.2) shall be
applied. If conversion is necessary, the conditions of 8.1.3 shall be employed.
During measurements, the DES shall not be exposed to draughts, direct sunlight or other
influences likely to cause an error.
8.1.2 Referee conditions
For referee purposes, one of the standard atmospheric conditions for referee tests as given in
Table 1 shall be selected:
Table 1 – Referee conditions
Temperature Relative humidity Air pressure
°C % kPa
20 ± 1 63 to 67 86 to 106
23 ± 1 48 to 52 86 to 106
25 ± 1 48 to 52 86 to 106
27 ± 1 63 to 67 86 to 106
8.1.3 Reference conditions
For reference purposes, the standard atmospheric conditions given in IEC 60068-1:2013, 4.1,
apply:
– temperature: 20 °C;
– air pressure: 101,3 kPa.
In such cases, the temperature alone may be specified as reference conditions.
8.2 Electrical performance tests
8.2.1 General
Test requirements, test levels and test coverage shall be considered at an early stage in the
design process, and shall include at which stage of the value chain these tests are feasible
and economical.
This clause provides general precautions to carry out the electrical performance tests of DESs.
Details of the test methods of electrical performances and special precautions for a particular
DES shall be given in the relevant specification.
Attention: embedded components shall not be damaged or destroyed by interconnection and
insulation tests performed at the board level. The test methods and severities shall be set out
in a way equivalent to in-circuit test (ICT) methods and precautions.
In principle, it is possible to measure the electrical characteristics of embedded devices, but
the following limitations shall be considered:
• not all components can be accessible from outside;
• the characteristics can be changed compared to the initial specification values by the
embedding process;
• the characteristics can be changed compared to the initial specification values by parasitic
effects;
• specific characteristics can require external components or circuits be connected to the
DES.
For further information and guidance, see IEC 62878-1-1.
8.2.2 Electrical test levels
In principle, electrical tests on DESs can be categorized into 3 levels. The levels rank from a
connectivity test only (Level 1) to an in-circuit test (Level 2) and a functional test (Level 3).
Test levels 2 and 3 will need significant resources (test know-how and equipment); also, test
coverage may not always be 100 %, depending upon the accessibility of single components
and the complexity of electrical circuit. Thus, test strategy and requirements shall be carefully
considered in the very early stage of circuit design.
For further information and guidance, see IEC 62878-1-1.
8.2.3 Protection of DES and test equipment
The test conditions for all measurements should be such that the extreme values applied to
the DES do not exceed the specified limiting values of the embedded components. It is
recommended that the DES should not be inserted into or removed from a circuit while it is
under test.
– 14 – IEC 62878-1:2019 © IEC 2019
The output level of all the power supplies connected to the test circuit of the DES should be
limited to a specified value to protect the inserted components from possible damage caused
by transient phenomena and surges during switching, adjustment and measurement.
8.2.4 Accuracy of measurement
8.2.4.1 Thermal equilibrium conditions
All electrical tests should be conducted under thermal equilibrium conditions, unless the
measurement is performed under pulsed conditions or unless otherwise specified. When test
conditions cause a significant change over time of the characteristic being measured, means
of compensation for such effects should be specified; for example, the length of time that the
DES should be maintained at test conditions before making a measurement.
Thermal equilibrium may be considered to have been achieved if doubling the time between
the application of power and the measurement causes no change in the indicated result within
the expected error.
8.2.4.2 Power supplies
The ripples of a power supply should not affect the designated accuracy of the measurement.
8.2.4.3 Circuit conditions
If low currents are measured, suitable precautions should be taken to ensure that parasitic
circuit currents or external leakage currents are small compared with the current being
measured.
Care should be taken to ensure that stray capacitance and inductance values have no effect
on the measurement result within the desired accuracy, or alternatively that the effect of stray
capacitance and inductance are taken into account in the result.
Care should be taken to minimize spurious oscillations or distortions likely to affect the
accuracy of the measurement.
8.2.4.4 Lighting conditions
When a characteristic is known to be light sensitive, the effect of lighting conditions should be
taken into account.
8.2.4.5 Measuring instruments
For any DES carrying large currents, separate current-carrying and voltage-measuring
contacts should be used. When this is not possible, corrections can have to be made to the
measured values of inter-terminal voltage.
In addition, for high-current DESs, residual inductance should be as low as possible.
The input and output waveforms of rectifying and converting circuits can be distorted from
sinusoidal. Conventional sinusoidal conversion factors are not applicable to distorted
waveforms, e.g. from average to RMS or crest values.
Therefore, allowance should be made in the measuring process. Allowance shall be made for
the voltage drop across current-measuring circuits and for the current taken by voltage-
measuring circuits, if these are significant.
8.2.5 Test structures
For process qualification and control, it may be advisable to use specific test structures
representing the embedding process technology, instead of testing the real DES.
These test structures shall be manufactured in the same or representative technologies as the
real components used in the DES.
For further information, see IEC TS 62878-2-4.
8.2.6 Mechanical performance tests
8.2.6.1 General
Mechanical tests applicable to the substrate are described in IEC 62878-1-1.
8.2.6.2 Robustness against bending stress
The purpose of this test is the evaluation of the resistance of DESs to the stress applied
during normal assembly or handling operations.
Unless otherwise specified in the relevant specification, the DES shall be subjected to either
of IEC 60068-2-21.
the tests of IEC 62137-1-4 or Test Ue
Test details, conditions and severities, or alternative test methods, shall be specified in the
relevant specification.
8.2.7 Resistance to soldering heat
8.2.7.1 General
There are two types of resistance to soldering heat test for DESs, solder bath method and the
reflow method, as specified in IEC 60068-2-58. Details of the applicable test methods and
conditions shall be specified in the detail specification.
8.2.7.2 Preconditioning
Drying and/or moisture soak may be required prior to the test.
8.2.7.3 Test severities
Limitations in test severity can be necessary compared to those applied to bare printed
boards. These are determined by the sensitivity of the embedded components and substrate
material.
Requirements and severities shall be defined between the user and the supplier.
For information only:
a) typical test severity for DESs intended for reflow soldering:
3 × 260 °C reflow method
b) typical test severity for DESs intended for flow soldering:
2 × 288 °C dip test/floating test method.
8.2.7.4 Final inspection and requirements
As prescribed in the relevant specification.
– 16 – IEC 62878-1:2019 © IEC 2019
8.2.8 Solderability
Solderability tests shall be performed in accordance with the requirements of the relevant
specification or in accordance with IEC 60068-2-69.
8.2.9 Shock
This test is to evaluate the resistance of a DES to relatively infrequent and non-repetitive
shocks being applied during transport or use.
Details of the test methods and conditions shall be given in the relevant specification in
accordance with IEC 60068-2-27.
8.2.10 Vibration (sinusoidal)
This test is to evaluate the resistance of a DES to harmonic vibration during transport or use.
The vibration of a harmonic pattern is generated primarily by rotating, pulsating or oscillating
forces, such as those that occur in ships, aircraft, land vehicles, rotorcraft and space
applications, or are caused by machinery and seismic phenomena.
Details of the test methods and conditions shall be given in the relevant specification in
accordance with IEC 60068-2-6.
8.2.11 Resistance to solvents
Many DESs are subjected to cleaning processes using solvents. This test is applicable to the
evaluation of the resistance to solvents of the DES during cleaning.
Details of the test methods and conditions shall be given in the relevant specification. See
also IEC 60068-2-45 for further information.
8.3 Climatic performance tests
8.3.1 Dry heat
8.3.1.1 General
This test is to evaluate the suitability of the DES for use or storage at high temperatures. The
high-temperature load test shall be applied to evaluate the use at high temperatures, and the
high-temperature storage test to evaluate high-temperature storage.
The dry heat tests are subdivided into the following:
a) Dry heat tests for non heat-dissipating specimens
– with sudden change of temperature, Ba;
– with gradual change of temperature, Bb.
b) Dry heat tests for heat-dissipating specimens
– with sudden change of temperature, Bc;
– with gradual change of temperature, Bd.
8.3.1.2 Preconditioning
Test methods and conditions shall be given in the relevant specification in accordance with
IEC 60068-2-1.
8.3.1.3 Test methods
Details of the test methods and conditions shall be given in the detail specification in
accordance with IEC 60068-2-2.
8.3.2 Cold
8.3.2.1 General
This test is to evaluate the suitability of the DES for use or storage at low temperatures. The
low-temperature load test shall be applied to evaluate the use at low temperatures, and the
low-temperature storage test to evaluat
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