IEC 60747-16-2:2001

Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers

Provides terminology and letter symbols, essential ratings and characteristics, as well as measuring methods for the integrated circuit micowave frequency prescalers.

General Information

• Status: Published
• Publication Date: 21-Mar-2001
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: SC 47E - Discrete semiconductor devices
• Drafting Committee: WG 2 - TC 47/SC 47E/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 31-Oct-2000
• Completion Date: 22-Mar-2001

Relations

• Amended By: IEC 60747-16-2:2001/AMD1:2007 - Amendment 1 - Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD
60747-16-2
First edition
2001-03
Semiconductor devices –
Part 16-2:
Microwave integrated circuits –
Frequency prescalers
Dispositifs à semiconducteurs –
Partie 16-2:
Circuits intégrés hyperfréquences –
Diviseurs préalables de fréquence
Reference number
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
Consolidated editions
The IEC is now publishing consolidated versions of its publications. For example,
edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
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thus ensuring that the content reflects current technology. Information relating to
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INTERNATIONAL IEC
STANDARD
60747-16-2
First edition
2001-03
Semiconductor devices –
Part 16-2:
Microwave integrated circuits –
Frequency prescalers
Dispositifs à semiconducteurs –
Partie 16-2:
Circuits intégrés hyperfréquences –
Diviseurs préalables de fréquence
 IEC 2001  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
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Telefax: [phone] e-mail: [e-mail] IEC web site http://www.iec.ch
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International Electrotechnical Commission
For price, see current catalogue

– 2 – 60747-16-2  IEC:2001(E)
CONTENTS
FOREWORD . 3
1 Scope . 4
2 Normative references. 4
3 Terms and definitions. 4
4 Essential ratings and characteristics . 6
4.1 General. 6
4.2 Application-related description. 6
4.3 Specification of the function. 7
4.4 Limiting values (absolute maximum rating system). 9
4.5 Operating conditions (within the specified operating temperature range). 10
4.6 Electrical characteristics . 11
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 12
5 Measuring methods. 13
5.1 General. 13
5.2 Output power (P ). 13
o
5.3 Output voltage (V ) . 14
o
5.4 Minimum operating input power (P ). 16
i, min
5.5 Maximum operating input power (P ) . 17
i, max
5.6 Minimum operating input voltage (V ) . 19
i, min
5.7 Maximum operating input voltage (V ) . 21
i, max
5.8 Maximum input frequency (f ) . 23
i, max
5.9 Minimum input frequency (f ). 24
i, min
5.10 High-level modulus control input voltage (V ) . 25
CH
5.11 Low-level modulus control input voltage (V ) . 27
CL
5.12 High-level modulus control input current (I ). 28
CH
5.13 Low-level modulus control input current (I ) . 29
CL
60747-16-2 © IEC:2001(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-2: Microwave integrated circuits –
Frequency prescalers
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60474-16-2 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47E/160/FDIS 47E/172/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
The committee has decided that the contents of this publication will remain unchanged until
2006. At this date, the publication will be
reconfirmed;
withdrawn;
replaced by a revised edition, or
amended.
– 4 – 60747-16-2  IEC:2001(E)
SEMICONDUCTOR DEVICES –
Part 16-2: Microwave integrated circuits –
Frequency prescalers
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
prescalers.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 60747. For dated references, subsequent amend-
ments to, or revisions of, any of these publications do not apply. However, parties to
agreements based on this part of IEC 60747 are encouraged to investigate the possibility of
applying the most recent editions of the normative documents indicated below. For undated
references, the latest edition of the normative document referred to applies. Members of IEC
and ISO maintain registers of currently valid International Standards.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60747-1, Semiconductor devices – Discrete devices – Part 1: General
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices. Integrated circuits – Part 3: Analogue integrated
circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
3 Terms and definitions
For the purpose of this part of IEC 60747, the following terms and definitions apply:
3.1
power supply voltage V
xxi
(terminal voltage)
d.c. voltage required to be applied to an 'i'-th terminal noted by 'xx'
3.2
power supply current I
xxi
d.c. current flowing through an 'i'-th terminal noted by 'xx'
3.3
output power Po
a.c. power measured at the output terminal

60747-16-2 © IEC:2001(E) – 5 –
3.4
output voltage V
o
amplitude of voltage swing measured at the output terminal
3.5
input power P
i
a.c. power delivered to the input terminal
3.6
input voltage V
i
amplitude of input voltage swing
3.7
high-level modulus control input voltage V
CH
control voltage value to transfer the division ratio from low-level modulus to high-level
modulus
3.8
low-level modulus control input voltage V
CL
control voltage value to transfer the division ratio from high-level modulus to low-level
modulus
3.9
high-level modulus control input current I
CH
control current value to transfer the division ratio from low-level modulus to high-level
modulus
3.10
low-level modulus control input current I
CL
control current value to transfer the division ratio from high-level modulus to low-level
modulus
3.11
input frequency f
i
input frequency for which the device functions
3.12
division ratio N
ratio of the output frequency and input frequency
3.13
set-up time t
set
(under consideration)
– 6 – 60747-16-2  IEC:2001(E)
4 Essential ratings and characteristics
4.1 General
This clause gives ratings and characteristics required for specifying integrated circuit
microwave frequency prescalers used at the microwave or millimetre-wave frequency band.
The integrated circuits contain fixed and two modulus prescalers.
4.1.1 Circuit identification and types
4.1.1.1 Designation and types
Indication of type (device name), category of circuit and technology applied should be given.
Microwave frequency prescalers are divided into two categories:
• type A: fixed modulus type;
• type B: two modulus type.
4.1.1.2 General function description
A general description should be made of the function performed by the integrated circuit
microwave frequency prescalers, and the features for the application.
4.1.1.3 Manufacturing technology
The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film
integrated circuit, micro-assembly, should be stated. This statement should include details of
the semiconductor technologies such as MESFET, MISFET, MOSFET, Si bipolar transistor,
HBT, etc.
4.1.1.4 Package identification
The following should be stated:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing or of the drawing of a non-
standard package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic;
d) for chip form, outlines, dimensions, pad sizes, contact material, and recommended contact
technologies.
4.1.1.5 Main application
The main application should be stated if necessary. If the device has restrictive applications,
these should be stated here.
4.2 Application-related description
Information on the application of the integrated circuit and its relation to the associated
devices should be given.
60747-16-2 © IEC:2001(E) – 7 –
4.2.1 Conformance to system and/or interface information
It should be stated whether the integrated circuit conforms to an application system and/or an
interface standard or recommendation.
Detailed information about application systems, equipment and circuits such as VSAT
systems, DBS receivers, and microwave landing systems should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data
The most important properties required to permit comparison between derivative types should
be given.
4.2.4 Electrical compatibility
It should be stated whet
...

IEC 60747-16-2 ®
Edition 1.1 2008-01
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 16-2: Microwave integrated circuits – Frequency prescalers

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IEC 60747-16-2 ®
Edition 1.1 2008-01
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 16-2: Microwave integrated circuits – Frequency prescalers

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 2-8318-9451-4

– 2 – 60747-16-2 © IEC:2001+A1:2007(E)
CONTENTS
FOREWORD.3

1 Scope.5
2 Normative references.5
3 Terms and definitions .5
4 Essential ratings and characteristics.7
4.1 General.7
4.2 Application-related description .7
4.3 Specification of the function .8
4.4 Limiting values (absolute maximum rating system) .10
4.5 Operating conditions (within the specified operating temperature range) .11
4.6 Electrical characteristics.12
4.7 Mechanical and environmental ratings, characteristics and data.13
4.8 Additional information.13
5 Measuring methods.14
5.1 General.14
5.2 Output power (P ) .14
o
5.3 Output voltage (V ) .15
o
) .17
5.4 Minimum operating input power (P
i, min
5.5 Maximum operating input power (P ).18
i, max
5.6 Minimum operating input voltage (V ) .20
i, min
5.7 Maximum operating input voltage (V ) .22
i, max
5.8 Maximum input frequency (f ).24
i, max
5.9 Minimum input frequency (f ) .25
i, min
).26
5.10 High-level modulus control input voltage (V
CH
5.11 Low-level modulus control input voltage (V ) .28
CL
5.12 High-level modulus control input current (I ) .29
CH
5.13 Low-level modulus control input current (I ).30
CL
60747-16-2 © IEC:2001+A1:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-2: Microwave integrated circuits –
Frequency prescalers
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This consolidated version of the official IEC Standard and its amendment has
been prepared for user convenience.
IEC 60747-16-2 edition 1.1 contains the first edition (2001) [documents 47E/160/
FDIS and 47E/172/RVD] and its amendment 1 (2007) [documents 47E/338/FDIS and
47E/343/RVD].
A vertical line in the margin shows where the base publication has been modified
by amendment 1.
International Standard IEC 60747-16-2 has been prepared by subcommittee 47E:
Discrete semiconductor devices, of IEC technical committee 47: Semiconductor devices.

– 4 – 60747-16-2 © IEC:2001+A1:2007(E)
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
60747-16-2 © IEC:2001+A1:2007(E) – 5 –
SEMICONDUCTOR DEVICES –
Part 16-2: Microwave integrated circuits –
Frequency prescalers
1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave frequency
prescalers.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617:2001, Graphical symbols for diagrams
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices. Integrated circuits – Part 3: Analogue integrated
circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
IEC 61340-5-1:2007, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena - General requirements
IEC/TR 61340-5-2:2007, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
3 Terms and definitions
For the purpose of this part of IEC 60747, the following terms and definitions apply:
3.1
power supply voltage V
xxi
(terminal voltage)
d.c. voltage required to be applied to an 'i'-th terminal noted by 'xx'
3.2
power supply current I
xxi
d.c. current flowing through an 'i'-th terminal noted by 'xx'

– 6 – 60747-16-2 © IEC:2001+A1:2007(E)
3.3
output power P
o
a.c. power measured at the output terminal
3.4
output voltage V
o
amplitude of voltage swing measured at the output terminal
3.5
input power P
i
a.c. power delivered to the input terminal
3.6
input voltage V
i
amplitude of input voltage swing
3.7
high-level modulus control input voltage V
CH
control voltage value to transfer the division ratio from low-level modulus to high-level
modulus
3.8
low-level modulus control input voltage V
CL
control voltage value to transfer the division ratio from high-level modulus to low-level
modulus
3.9
high-level modulus control input current I
CH
control current value to transfer the division ratio from low-level modulus to high-level
modulus
3.10
low-level modulus control input current I
CL
control current value to transfer the division ratio from high-level modulus to low-level
modulus
3.11
input frequency f
i
input frequency for which the device functions
3.12
division ratio N
ratio of the output frequency and input frequency
3.13
set-up time t
set
(under consideration)
60747-16-2 © IEC:2001+A1:2007(E) – 7 –
4 Essential ratings and characteristics
4.1 General
This clause gives ratings and characteristics required for specifying integrated circuit
microwave frequency prescalers used at the microwave or millimetre-wave frequency band.
The integrated circuits contain fixed and two modulus prescalers.
4.1.1 Circuit identification and types
4.1.1.1 Designation and types
Indication of type (device name), category of circuit and technology applied should be given.
Microwave frequency prescalers are divided into two categories:
• type A: fixed modulus type;
• type B: two modulus type.
4.1.1.2 General function description
A general description should be made of the function performed by the integrated circuit
microwave frequency prescalers, and the features for the application.
4.1.1.3 Manufacturing technology
The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film
integrated circuit, micro-assembly, should be stated. This statement should include details of
the semiconductor technologies such as MESFET, MISFET, MOSFET, Si bipolar transistor,
HBT, etc.
4.1.1.4 Package identification
The following should be stated:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing or of the draw
...