IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-807: Méthodes d’essai des matériaux pour structures d’interconnexion - Température de décomposition (T_d) par analyse thermogravimétrique

L'IEC 61189-2-807:2021 spécifie une méthode d'essai pour déterminer la température de décomposition (Td) des matériaux stratifiés de base par analyse thermogravimétrique (TGA, thermogravimetric analysis).

General Information

• Status: Published
• Publication Date: 02-Sep-2021
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 04-Oct-2021
• Completion Date: 03-Sep-2021

Standards Content (Sample)

IEC 61189-2-807 ®
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-807: Test methods for materials for interconnection structures –
Decomposition temperature (T ) using TGA
d
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-807: Méthodes d’essai des matériaux pour structures
d’interconnexion – Température de décomposition (T ) par analyse
d
thermogravimétrique
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IEC 61189-2-807 ®
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-807: Test methods for materials for interconnection structures –

Decomposition temperature (T ) using TGA
d
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-807: Méthodes d’essai des matériaux pour structures

d’interconnexion – Température de décomposition (T ) par analyse

d
thermogravimétrique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-1019-8

– 2 – IEC 61189-2-807:2021 © IEC 2021
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
5 Test apparatus . 6
6 Test procedure . 6
7 Report . 7
Bibliography . 8

Figure 1 – Mass-temperature curve. 7

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-807: Test methods for materials for interconnection structures –
Decomposition temperature (T ) using TGA
d
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-807 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1697/CDV 91/1738/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 61189-2-807:2021 © IEC 2021
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-807: Test methods for materials for interconnection structures –
Decomposition temperature (T ) using TGA
d
1 Scope
This part of IEC 61189 specifies a test method to determine the decomposition temperature (T )
d
of base laminate materials using thermogravimetric analysis (TGA).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60194-2, Printed boards design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
ISO 11358-1, Plastics – Thermogravimetry (TG) of polymers – Part 1: General principles
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-2 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia available at http://www.electropedia.org/
• ISO Online browsing platform available at https://www.iso.org/obp
4 Test specimens
4.1 Specimens shall be an unclad laminate material or laminate material where the copper
has been completely removed.
4.2 The typical weight of the sample is 10 mg to 30 mg. Samples shall be cut to a specified
size which is suitable for the sample pan using appropriate procedures and equipment. All
edges of the sample shall be finished such that it is smooth and burr-free to allow the sample
to rest completely flat on th
...