IEC TS 62686-1:2015

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

IEC TS 62686-1:2015(E) defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers' publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. This new edition includes the following significant technical changes with respect to the previous edition:
- adoption and modification of STACK Specification S/0001 revision 14 notice 3, update of IEC semiconductor test methods;
- update of JEDEC semiconductor test methods;
- including addition of JEP148A, based on the Physics of Failure Risk and Opportunity assessment;
- update of Annex A with additional JEDEC and IEC test information;
- revision of lead-free termination finish requirements.

General Information

• Status: Published
• Publication Date: 21-Apr-2015
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: WG 2 - TC 107/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 20-Apr-2020

Relations

• Revised: IEC TS 62686-1:2020 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
• Effective Date: 05-Sep-2023
• Revises: IEC TS 62686-1:2012 - Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC TS 62686-1 ®
Edition 2.0 2015-04
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,
defence and high performance (ADHP) applications –
Part 1: General requirements for high reliability integrated circuits and discrete
semiconductors
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
3, rue de Varembé Fax: [phone]

CH-1211 Geneva 20 [e-mail]
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing more than 30 000 terms and
Technical Specifications, Technical Reports and other definitions in English and French, with equivalent terms in 15
documents. Available for PC, Mac OS, Android Tablets and additional languages. Also known as the International
iPad. Electrotechnical Vocabulary (IEV) online.

IEC publications search - www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a More than 60 000 electrotechnical terminology entries in
variety of criteria (reference number, text, technical English and French extracted from the Terms and Definitions
committee,…). It also gives information on projects, replaced clause of IEC publications issued since 2002. Some entries
and withdrawn publications. have been collected from earlier publications of IEC TC 37,

77, 86 and CISPR.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: [e-mail].
IEC TS 62686-1 ®
Edition 2.0 2015-04
TECHNICAL
SPECIFICATION
Process management for avionics – Electronic components for aerospace,

defence and high performance (ADHP) applications –

Part 1: General requirements for high reliability integrated circuits and discrete

semiconductors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-2645-2

– 2 – IEC TS 62686-1:2015 © IEC 2015

CONTENTS
FOREWORD . 6

INTRODUCTION . 8

1 Scope . 9

2 Normative references . 9

3 Terms, definitions and abbreviations . 10

3.1 Terms and definitions . 10

3.2 Abbreviations . 12
4 Technical requirements . 14
4.1 General . 14
4.2 Procedures . 14
4.2.1 General . 14
4.2.2 Product discontinuance . 14
4.2.3 ESD protection during manufacture . 14
4.2.4 Specification control . 15
4.2.5 Traceability including anti-counterfeit measures . 15
4.3 Product or process change notification (PCN) . 15
4.3.1 General . 15
4.3.2 Notification . 15
4.3.3 Notification details . 15
4.3.4 Notifiable changes . 16
4.4 Shipment controls . 16
4.4.1 General . 16
4.4.2 Shipping container and date code marking . 16
4.4.3 Date code remarking . 16
4.4.4 Inner container formation . 16
4.4.5 Date code age on delivery . 17
4.4.6 ESD marking . 17
4.4.7 MSL . 17
4.4.8 Lead-free marking . 17
4.4.9 Labels . 17
4.5 Electrical . 18
4.5.1 General . 18

4.5.2 Electrical test . 18
4.5.3 Electrical parameter assessment . 18
4.5.4 SDRAM memories . 18
4.5.5 Logic families . 19
4.5.6 Power MOSFETs . 19
4.5.7 Silicon rectifier diodes . 19
4.6 Mechanical . 19
4.6.1 General . 19
4.6.2 Device marking . 19
4.6.3 Small packages . 19
4.6.4 Moisture sensitivity . 19
4.6.5 Robustness of hermetic seals . 19
4.6.6 Termination finishes . 20
4.7 Audit capability . 20

4.7.1 General . 20

4.7.2 Internal quality audits . 20

4.7.3 Subcontract manufacturing . 20

4.8 Quality assurance . 21

4.8.1 General . 21

4.8.2 Quality system . 21

4.8.3 Sampling plans . 21

4.8.4 Failure analysis support . 21

4.8.5 Outgoing quality . 21

4.9 Supplier performance monitoring by the user . 22

4.9.1 General . 22
4.9.2 Lot acceptance . 22
4.9.3 Suspension of deliveries . 23
4.9.4 Loss of approval . 23
4.9.5 AQL figures . 23
4.9.6 100 % screening . 23
4.9.7 Termination determination . 23
4.10 Qualification . 23
4.10.1 General . 23
4.10.2 Methodology . 24
4.10.3 Test samples . 25
4.10.4 Qualification categories . 26
4.10.5 Maintenance of qualification standard . 26
4.10.6 In-process test results . 26
4.10.7 Product monitor results . 30
4.10.8 References . 30
4.10.9 Qualification report . 30
4.10.10 Archiving . 30
4.10.11 Qualification by similarity . 30
4.10.12 Similarity assessment . 30
4.11 Reliability . 31
4.11.1 General . 31
4.11.2 Operating reliability. 31
4.11.3 Failure criteria . 31
4.11.4 Corrective action . 32

4.11.5 Warranty . 32
4.11.6 Suspension of certification . 32
4.11.7 Single event effects (SEE) . 32
4.12 Product monitor . 32
4.12.1 General . 32
4.12.2 Monitor programme . 32
4.12.3 Problem notification . 33
4.12.4 Data reporting. 33
4.12.5 Samples .
...