IEC PAS 62158:2000

Printed Board Manufacturers' Qualification Profile (MQP)

Aims at defining a qualification profile for manufacturers, making audits simpler and less frequently required. Less paper work would thus be necessary as customers and suppliers work closer to meeting each others' needs. A diskette is also available with the hardcopy of this PAS. Two zipped files are available through Webstore : the pdf file of the PAS itself and the contents of the diskette.

General Information

• Status: Withdrawn
• Publication Date: 17-Aug-2000
• Withdrawal Date: 28-Oct-2004
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Current Stage: WPUB - Publication withdrawn
• Start Date: 29-Oct-2004
• Completion Date: 31-Oct-2004

Standards Content (Sample)

�������������
Edition 1.0
2000-08
Printed Board Manufacturers’
Qualification Profile (MQP)
��������������������������������
IN TER N A TION AL Reference number
E L E C TROTE CHNI CA L
IEC/PAS 62158
C O MMI S S I O N
Copyright © 1997, IPC; 2000, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
PRINTED BOARD MANUFACTURERS’
QUALIFICATION PROFILE (MQP)
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62158 was submitted by the IPC (The Institute for Interconnecting and Packaging Electronic Circuits) and
has been processed by IEC technical committee 52: Printed circuits.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
52/841/PAS 52/855/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and IPC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.

Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
NOTICE IPC standards and publications are designed to serve the public interest

through eliminating misunderstandings between manufacturers and

purchasers, facilitating interchangeability and improvement of products, and

assisting the purchaser in selecting and obtaining with minimum delay the

proper product for his particular need. Existence of such Standards and

Publications shall not in any respect preclude any member or non-member of

IPC from manufacturing or selling products not conforming to such Standards
and Publications, nor shall the existence of such Standards and Publications
preclude their voluntary use by those other than IPC members, whether the
standard is to be used either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without
regard to whether their adoption may involve patents on articles, materials or
processes. By such action, IPC does not assume any liability to any patent
owner, nor do they assume any obligation whatever to parties adopting the
recommended Standard or Publication. Users are also wholly responsible for
protecting themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the OEM Council of the
Institute for Interconnecting and Packaging Electronic Circuits.

 IPC 1996
IPC-1710 - 12/97
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
FOREWORD
It is not intended that this Manufacturers’ Qualification Profile (MQP) satisfies all the requirements of the customer,

however, conscientious maintenance of this document and or registration to ISO 9000 requirements should satisfy the major
conc erns. Thus, audits should be simpler, required less frequently, and facilitate less paper work as customers and suppliers
work closer to meeting each others needs.

Although the MQP is for a single site or location, information about the overall company is helpful in establishing the

relationship of the existing site to the total company and to other sites or divisions. The first page of section 1 is intended to

convey that information. The remainder of the MQP is devoted to information about the existing site.

The Printed Board Manufacturer should keep all sections current. In the initial contact between the manufacturer and

a new customer, an abbreviated MQP will suffice (site description from Sections 1 and 2). Access to MQP in electronic media
is suggested in order to facilitate the appropriate manufacturer/user information interchange. The remaining sections of the
MQP provide details of the site manufacturing capability and the quality principles that have been incorporated into the
systems used to fabricate printed boards. The information is also of use to the printed board manufacturer in assessing
where the organization stands on implementing quality and technology; the same data helps the customer in determining how
well the manufacturers’ capability matches the customer need.
CONTENTS
This document is divided into ten sections. Each section is dated and maintained as a separate entity.
The sections are:                                           Pages
1. Company and Site Description 1-1 - 1-2
2. Site Capability Snapshot 2-1 - 2-5
3. Equipment Profile (Pre-site Audit) 3-1 - 3-6
4. Technology Profile Specifics 4-1 - 4-8
5. Quality Profile 5-1 - 5-10
6. Manufacturing History 6-1
7. Identification of Previous Audits 7-1
8. Financial Review (optional) 8-1
9. MQP Electronic Data Format (See included floppy disk) 9-1 - 9-6
10. Glossary of Terms 10-1
ACKNOWLEDGMENTS
The IPC is indebted to the members of the OEM council who participated in the development of this document. A note of
thanks is also expressed to the members of the IPC Presidents Council for their review and critique and construction
recommendations in finalizing the principles developed for the MQP.
Although the IPC is grateful for all the involvement and individual contributions made in completing the MQP a special
acknowledgment is extended to the following individuals. It was their dedication and foresight that made this publication
possible.
Rudolfo Archbold Rick Iantaffi Don Noel Mario Suarez-Solis
Digital Equipment Corp Northern Telecom Harris Corp. - Computer Sys. Div Encore Computer Corp.
Patrick Bernardi Sue Jones Rick Smith Gordon Wolfram
IBM Wilcox Electric Compaq Computer Corp. Raytheon Company
Vernon Brown Chuck Krzesicki Peter Solecky Jerald G. Rosser
Motorola, Inc. Honeywell Avionics Division IBM Hughes Missile Operations Div.
Don Holt Thomas Kurtz Joseph F. Sterba Jamie Zanios
Texas Instruments Hughes Defense Communications Honeywell, Inc. Wellborn Industries Ltd.
IPC-1710 - 12/97
ii
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
����������
SECTION 1.1
COMPANY DESCRIPTION
GENERAL INFORMATION
LEGAL NAME
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PHYSICAL ADDRESS
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CITY STATE ZIP
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PROVINCE COUNTRY
���������� ����������
TELEPHONE NUMBER FAX NUMBER TELEX NUMBER
���������� ���������� ����������
E-MAIL ADDRESS MODEM NUMBER DATE FOUNDED
PUBLIC PRIVATE
���������� ����������
INTERNET URL FTP SITE
���������� ����������
MANAGEMENT
PRESIDENT
����������
CHIEF OPERATING OFFICER
����������
VICE PRESIDENT OF MANUFACTURING
����������
VICE PRESIDENT OF QUALITY
����������
VICE PRESIDENT OF MARKETING/SALES
����������
VICE PRESIDENT OF CUSTOMER SERVICE
����������
WASTE TREATMENT MANAGER (POLLUTION PREVENTION)
����������
CORPORATE NUMBER OF EMPLOYEES
DESCRIPTION CORPORATE SITE COMMENTS
DESIGN AND DEVELOPMENT
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ENGINEERING
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MANUFACTURING CONTROL
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MANUFACTURING DIRECT
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INDIRECT
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QUALITY QUALITY
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CONTROL ENGINEERS
INTERNAL
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AUDITORS
GENERAL
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MANAGEMENT
ADMINISTRATION
������������������������������
TOTAL ������������������������������
IPC-1710 - 12/97 1-1
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED ����������
SECTION 1.2
(TO BE COMPLETED FOR EACH SITE) ATTACH APPROPRIATE CHARTS (OPTIONAL)

SITE DESCRIPTION
MANUFACTURING FACILITY
����������
COMPANY NAME
PHYSICAL ADDRESS ����������
CITY ���������� STATE ���������� ZIP ����������

PROVINCE COUNTRY
TELEPHONE NUMBER FAX NUMBER TELEX

E-MAIL ADDRESS MODEM NUMBER YEARS IN BUSINESS

INTERNET URL     FTP
PRINCIPLE PRODUCTS/SERVICES/SPECIALTIES BUSINESS CHARACTERIZATION (HIGH VOLUME, QUICK TURN-AROUND, ETC.)
���������� ����������
���������� ����������
REPORTS TO (Function/Job Title)
FACILITY MANAGEMENT TITLE
OVERALL OPERATION RESPONSIBILITY FOR THIS SITE ����������
MANUFACTURING
TECHNICAL/ENGINEERING
MATERIALS/PRODUCTION CONTROL
PURCHASING
QUALITY
SALES REPRESENTATIVE
WASTE MANAGEMENT
BUILDINGS SYSTEMS (INDICATE % COVERAGE)
Power Air Waste
AGE AREA Construction
Conditioning Heating Ventilation Conditioning Sprinklers Treatment Other
(Sq. Ft.) (Wood/Brick)
Office
Manufacturing
Storage
Planned
additions
SAFETY AND REGULATORY AGENCY REQUIREMENTS
Are fire extinguishers functional and YES NO What is the distance to the nearest
accessible to employees? fire station? (in minutes)     Minutes
Do you conform to local/federal environ- YES NO Date of last OSHA visit
ment protection agency requirements? Date of last EPA visit
UL #     ISO 9000#
Are you currently operating under a waiver YES NO Other Agency Audits, UL,
or in violation of local government ISO 9000, NECQ, CSA Approval CSA #      Other
requirements? and Number
Do you have a safety program? YES NO Hazardous Waste Number
Describe below. Trade Waste Account Number
PLANT PERSONNEL (TOTAL EMPLOYEES)
Regular Contract Office Technical/ Production Full-Time Part-Time Union Non- Union Contract
Engineering
QA QA Union Name Expires (Date)

COMMENTS
IPC-1710 - 12/97 1-2
©
Copyright 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
����������
SECTION 2.1
PROCESSES
This section is intended to provide overview information on the processes used to fabricate printed board products.
Site Capability Snapshot (Please Check all that apply)
DESIGNATORS 1 23 45 67 8 9 OTHER REMARKS
A Conductor Sub- Thin foil Sub- Semi- Additive Black Thick Thin Film
Forming tractive tractive Additive (Electro-less) Hole Film Semi-
Process less than Paste and conductor
.5 oz. Fire Sputtering
PTH
B Materials Acid Pyro- Full Built Gold Copper Gold Nickel
and Copper Phosphate Electro-Less Paste Paste Conductor Conductor
Processes Copper Sputtering Sputtering
C Permanent Tin Tin-Lead Tin-Nickel Nickel Nickel Nickel Nickel Conductive
Over-plating Alloy Gold Gold Rhodium Polymer
(Hard) (Soft)
D Permanent Tin Tin-Lead Tin-Nickel Nickel Nickel Nickel Nickel
Selective Alloy Gold Gold Rhodium
Plating (Hard) (Soft)
E Permanent Photo Photo Image Conformal Cover
Mask or Dry Film Liquid Transfer Coating Coat
Coating Screen Mask Solder Mask
F Other Tin-Lead Immersion Solder Roll Electro-less Solder Solder Azole Flux
Surface Fused Tin Leveled Soldered Solder Bumped Paste Organic Protective
Finishes Fused Lands Fused Protective Covering
Covering
IPC-1710 - 12/97 2-1
©
Copyright 1997, IPC; 2000, IEC
December, 1997 IPC
DATE COMPLETED
����������
SECTION 2.2
ELECTRICAL TEST EQUIPMENT
This section is intended to provide overview information on the test equipment and testing capability of the manufacturer.
Site Capability Snapshot (Please Check the column that applies furthest to the right.)
DESIGNATORS 1 23 45 67 8 9 OTHER REMARKS
A Number <200 200 500 1000 2000 3000 4000 5000 >5000
of
Nets
B Number <500 500 1000 2000 3000 4000 5000 6000 >6000
of
Nodes
C Probe >1.0 1.0 0.8 0.65 0.50 0.40 0.30 0.20 <0.20
Point [.040] [.040] [.032] [.025] [.020] [.016] [.012] [.008] [.008]
Pitch
D
Test % None <60% 60% 70% 80% 90% 95% 99% 100%
Single
Pass
E
Probe >0.2 0.2 0.15 0.125 0.1 0.075 <0.075
Accuracy [.008] [.008] [.006] [.005] [.004] [.003] [.003]
(DTP)
Double
F Grid Single Side Double Double Density Quad Double Flying
Density Grid Sided Grid Density Grid Double Density Sided Quad Probe
Sided Density
G Netlist Golden IPC-D-356 Net List CAD/CAM
Capability Board Extraction Net List
Compare
H Test <20 VDC 20 VDC 40 VDC 60 VDC 80 VDC 100 VDC 500 VDC 1000 VDC >1000 VDC
Voltage
J Impedance Micro Inboard Coupon Manual Automated
Measure Section Circuit TDR TDR
K Impedance None >20% 20% 15% 10% 7% 5% 2% <2%
Tolerance
IPC-1710 - 12/97 2-2
©
Copyright 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
����������
SECTION 2.3
PRODUCT TYPE
This section is intended to provide overview information on the printed board product types being fabricated by the manufacturer.
Site Capability Snapshot (Please Check all that apply)
DESIGNATORS 12 34 56 78 9 OTHER REMARKS
A Product Rigid Flex Rigid/Flex Rigid Molded Ceramic Multichip Liminated Deposited
Type Printed Printed Board Back Product Printed Module Multichip Dielectric
Board Board Plane Board Module Multichip
Modules
B Circuit Single Double Multi- Single-sided Double-sided Multi layer Constrained Distributed
Mounting Sided Sided layer Bonded to Bonded to Bonded to Multi layer Plane
Type Substrate Substrate Substrate Multi layer
C Via No-Vias Thru Hole Buried Vias Blind Vias Thru Hole Thru Hole Thru Hole Buried
Technology Vias & Blind & Buried Buried & & Blind
Vias Vias Blind Vias Vias
D Laminate Phenolic Epoxy Epoxy Modified Polyimide Cynanate Teflon Ceramic Various
Material Paper Glass Epoxy Film & Ester Glass Combinations
Composite Reinforce Types
E Core No Core Polymer Copper Aluminum Graphite Copper Copper
Material Invar/ Moly/
Copper Copper
F Copper 1/8 Minimum 1/4 Minimum 3/8 Minimum 1/2 Nominal 1 Nominal 2 Nominal 3-5 Max 6-9 Max >10
Thickness
(Oz.)
G Construction >4 Planes THK to TOL THK to TOL Bow/Twist Bow/Twist >0.3 mm
≤4 Planes ≤0.3 mm
≤0.2 mm >0.2 mm ≤1% >1% Profile Profile
Tolerance
Tolerance
H Coatings >0.1 mm One Side Two Sided None U.L. U.L. U.L. U.L.
≤0.1 mm
and Mask Mask (Legend) (Legend) (Legend) Material V V V
0 1 2
Markings Clearance Clearance Logo Logo Logo Logo
IPC-1710 - 12/97 2-3
©
Copyright 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
����������
SECTION 2.4
PRODUCT COMPLEXITY
This section is intended to provide overview information on the product complexity being fabricated by the manufacturer.
(Please check the column that applies furthest to the right)
DESIGNATORS 1 23 45 67 8 9 OTHER REMARKS
Board
A
Size <250 250 350 450 550 650 750 850 >850
Diagonal [10.00] [10.00] [14.00] [17.50] [21.50] [25.50] [29.50] [33.50] [33.50]
Total
B Board 1, 0 1, 0 1, 6 2, 0 2, 5 3, 5 5, 0 6, 5 >6, 5
Thickness [.040] [.040] [.060] [.080] [.100] [.135] [.200] [.250] [.250]
Number
C Conductive 1 - 4 5 - 6 7 - 8 9 - 12 13 - 16 17 - 20 21 - 24 25 - 28 >28
Layers
Dia
D Drilled >0, 5 0, 5 0, 4 0, 35 0, 30 0, 25 0, 20 0, 15 <0, 15
Holes [.020] [.020] [.016] [.014] [.012] [.010] [.008] [.006] [.006]
Total
E PTH TOL >0, 250 0, 250 0, 200 0, 150 0, 125 0, 100 0, 075 0, 050 <0, 050
(Max-Min) [.010] [.010] [.008] [.006] [.005] [.004] [.003] [.002] [.002]
Hole
F Location >0, 50 0, 50 0, 40 0, 30 0, 25 0, 20 0, 15 0, 10 <0, 10
TOL DTP [.020] [.020] [.016] [.012] [.010] [.008] [.006] [.004] [.004]
Internal Layer
G Clearance >0, 350 0, 350 0, 250 0, 200 0, 150 0, 125 0, 100 0, 075 <0, 075
(Min) [.014] [.014] [.010] [.008] [.006] [.005] [.004] [.003] [.003]
Internal Layer
H Conductor >0, 250 0, 250 0, 200 0, 150 0, 125 0, 100 0, 075 0, 050 <0, 050
Width (Min) [.010] [.010] [.008] [.006] [.005] [.004] [.003] [.002] [.002]
Internal Layer
J Process >0, 100 0, 100 0, 075 0, 050 0, 040 0, 030 0, 025 0, 020 <0, 020
Allowance [.004] [.004] [.003] [.002] [.0015] [.0012] [.001] [.0008] [.0008]
External Layer
K Clearance >0, 350 0, 350 0, 250 0, 200 0, 150 0, 125 0, 100 0, 075 <0, 075
(Min) [.014] [.014] [.010] [.008] [.006] [.005] [.004] [.003] [.003]
External Layer
L
Conductor >0, 250 0, 250 0, 200 0, 150 0, 125 0, 100 0, 075 0, 050 <0, 050
Width (Min) [.010] [.010] [.008] [.006] [.005] [.004] [.003] [.002] [.002]
External Layer
M Process >0, 100 0, 100 0, 075 0, 050 0, 040 0, 030 0, 025 0, 020 <0, 020
Allowance [.004] [.004] [.003] [.002] [.0015] [.0012] [.001] [.0008] [.0008]
Feature
N Location >0, 50 0, 50 0, 40 0, 30 0, 25 0, 20 0, 15 0, 10 <0, 10
DTP [.020] [.020] [.016] [.012] [.010] [.008] [.006] [.004] [.004]
All Dimensions are in millimeters [inches shown in brackets]
IPC-1710 - 12/97 2-4
©
Copyright 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
SECTION 2.5
QUALITY DEVELOPMENT
This section is intended to provide overview information on the quality systems in place in the manufacturing facility.
Site Capability Snapshot (Please Check all that apply)
DESIGNATORS 1 2 3 4 5 6 7 8 9 OTHER REMARKS
A Strategic Functional TQM Plan Documented Implementation TQM Controlled Management Employee Total TQM
Plan Steering & Philosophy Quality & review of Communi- New process Participates Recognition Plan/
Committee Established & Progress Project Team cated Start-up in TQM Program Involvement
Formed Published Review Recommend- throughout Audits Customer
ations organization Training
B
Employee Certified Training of TQM Design of New Process Support Advanced Quality Ongoing
Involvement Training Employee Team Experiment Implementa- Personnel Statistical Functional Improvement
Available Base Trained Training and tion Training Training Deployment Program for
Use Training Employees
C Quality Quality Generic 10% of manu- 25% of manu- 50% of manu- Non- 25% of all 50% of all All Manufac-
Manual Manual Quality facturing facturing facturing manufac- departments departments turing and
Started Manual for depts. have depts. have depts. have turing have quality have quality support depts.
Facility process process process Manuals manuals manuals have controlled
specifications specifications specifications Developed quality manual
D Instructions Work Quality 10% Work 10% Quality 25% Work 25% Quality 50% Work 50% Quality Quality and
Instructions Instructions Instructions Instructions Instructions Instructions Instructions Instructions work Instruct.
Started Started Completed Completed Completed, Completed, Completed, Completed, Completed,
Controlled Controlled Controlled Controlled Controlled
E SPC Plan Training Process All First Several Continued Additional All
Implementation Exists Started Data Employees Process Major Improvement Mfg Processes
IPC-PC-90 Collected & Trained Stable & Processes of Stable Processes Under
Analyzed Capable Stable & Processes under control Control
Capable
F Supplier Supplier Monthly Key Supplier TQM 10% of 25% of 50% of All Key
Programs/ Rating Analysis Problems Reviews Acceptance Suppliers Suppliers Suppliers Suppliers using
Controls Program Program Identified Performance by Using SPC Using SPC Using SPC Certified parts
Data provided suppliers program
G Third Instrument Measurement Document Reduced 10% of 50% or ISO-9003 ISO-9002 ISO-9001
Party Controls in System in Controls Lot Processes Greater of Certified Certified Certified
IPC-QS-95 Place Control in Place Sampling Under Audit Processes
IPC-PC-90 Control Under Audit
Control
IPC-1710 - 12/97 2-5
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
����������
SECTION 3
EQUIPMENT PROFILE (Pre-Site Audit)
* Examples of equipment limitations include:
min/max board size & min/max working area

3.1 PHOTOTOOL CAPABILITY YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) AOI of phototool
B) AOI CAD reference (CAM)
C) Photoplotting
D) Photo reductions
E) Film scan and conversion
F) Film processing
air-dried   force-dried
processed in automatic processor
G) Media types
silver halide film   glass
diazo
3.2 DRILLING EQUIPMENT YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Manual
B) Optical (single spindle)
C) N.C. drill
3.3 ROUTING EQUIPMENT YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Edge beveler
B) Hand router (pin router)
C) N.C. router
D) N.C. driller/router
E) Scoring (profile)
F) Scoring (straight line)
IPC-1710 - 12/97 3-1
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
3.4 MECHANICAL EQUIPMENT YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Punch press
B) Shear
C) Milling machine
3 .5 HOLE PREPARATION (DESMEAR) YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Permagnate
B) Plasma
C) Mechanical
D) Etchback
3.6 PRIMARY IMAGE APPLICATION YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Dry film
B) Hand screening
C) Machine screening
D) Wet film
E) Liquid photoimageable
3.7 TYPE OF TREATMENT FOR YES NO EQUIPMENT QTY EQUIPMENT LIMITS
MULTILAYER INNERLAYERS
A) Black oxide
B) Red oxide
C) Copper scrub
D) Durabond
E) Other
IPC-1710 - 12/97 3-2
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
3.8 LAMINATION YES NO MATERIAL QTY APPLICATION TECHNIQUE

A) High pressure
B) High temperature
C) Vacuum
D) Vacuum assist
E) Foil heat assist
F) Separate cool-down
3.9 ELECTROLESS COPPER PLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Fully additive application
B) Electroless deposition
(semiadditive)
C) Through-hole and via
3.10 COPPER ELECTROPLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Copper sulfate
B) Pyrophosphate
C) Copper fluoborate
D) Other
3.11 TIN/LEAD SURFACE YES NO EQUIPMENT QTY EQUIPMENT LIMITS
PLATINGS/COATINGS
A) Tin/lead electroplated
B) Immersion tin or tin/lead
(electroless)
C) Hot air solder leveled (HASL)
IPC-1710 - 12/97 3-3
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
3.12 FUSING PROCESSES YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) I.R. reflow
B) Hot oil reflow
C) Horizontal (hot air level)
D) Vertical (hot air level)
3.13 NICKEL SURFACE PLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Electroless nickel
B) Electroplated nickel
3.14 GOLD SURFACE PLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Electroless gold
B) Electroplated gold
3.15 PALLADIUM SURFACE PLATING YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Electroless palladium
(immersion)
B) Electroplated palladium
3.16 SOLDERMASK YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Screened deposited image
B) Dry film photoimageable
C) Liquid photoimageable
D) Dry film/liquid combination

3.17 ORGANIC SURFACE PROTECTION YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Benzotriazole
B) Imidazole
C) Benzimidazole
IPC-1710 - 12/97 3-4
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
3.18 MICROSECTION CAPABILITY YES NO EQUIPMENT QTY EQUIPMENT LIMITS

A) Manual
B) Single cavity automated
C) Multiple cavity automated
D) Plating thickness analysis
3.19 CHEMICAL ANALYSIS YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Etching chemistry
B) Plating chemistry
C) Effluent (PPM) analysis
3.20 ELECTRICAL TEST EQUIPMENT YES NO EQUIPMENT QTY EQUIPMENT LIMITS
A) Continuity and shorts
B) Fixture development
C) Flying probe test
D) Impedance control
IPC-1710 - 12/97 3-5
©
Copyright 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
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MASTER EQUIPMENT LISTING
FORM MQP 10
Please complete a Master Equipment List. You may use your own form or the MQP Form 10.
IDENTIFICATION EQUIPMENT MANUFACTURER EQUIPMENT LIMITS ACCURACY CALIBRATION REMARKS
NAME/DESCRIPTION TYPE/MODEL FREQUENCY

IPC-1710 - 12/97 3-6
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
SECTION 4
TECHNOLOGY PROFILE SPECIFICS
4.1 ADMINISTRATION
4. 1.1 CAPACITY PROFILE EST % COMMENTS

A) Total annual capacity in square meters
(surface area) per month
B) Presently running at ____ % of capacity

4.1.2 PERCENTAGE OF DOLLAR VOLUME EST % COMMENTS
A) Single sided (rigid)
B) Double sided (rigid)
C) Multilayer (rigid)
D) Single side (unreinforced-flex)
E) Double sided (unreinforced-flex)
F) Multilayer (unreinforced-flex)
G) Multilayer (rigid/flex)
4.1.3 PANEL PRODUCTION PROFILE UNITS PER MONTH
A) Size of a production lot in panels
1) Normal
2) Smallest
B) Number of panels per month
1) High Production
2) Medium Production
3) Low Production
3) Short run
4) Prototype
IPC-1710 - 12/97 4-1
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
C) Average lead time (delivery) as
defined in B)
1) High Production
2) Medium Production
3) Low Production
3) Short run
4) Prototype
Quick turn - No. of days     .
D) Product delivered in full panel or
array sub-panel format
1) Total in panel or array format
2) Scored format
3) Tab breakaway format
4) Other
5) Total to customer layout
6) Total to manufacturing layout
E) Product delivered in board format
1) Total in board format
2) Extracted: scored to size
3) Extracted: sheared to size
4) Extracted: routed to size
4.1.4 APPROVAL AND CERTIFICATION YES NO COMMENTS
A) Company approvals
1) UL approval ��8 .GXGN �
2) Canadian standards
3) MIL-P-55110
4) MIL-P-50884
IPC-1710 - 12/97 4-2
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
5) ISO-9002
6) ISO-9001
7) ISO-14000
8) BABT
9) EEC
10) Customer satisfaction
B) Other certification information
1)  Laminate
2)  Quality standards
3)  Equipment calibration
4.1.5 CUSTOMER INTERFACE PROFILE YES NO COMMENTS
A) Modem capability
B) Baud rate
C) Data verification technique
D) Engineering change order
process
E) Job status reporting to customers
4.1.6 OTHER CAPABILITIES YES NO COMMENTS
A) Facility research and
development
B) (Automated) On-line shop floor

control/MRP system
C) Process control system
D) Operator training system
IPC-1710 - 12/97 4-3
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
4.2 PROCESS ORIENTATION
4.2.1 LAMINATE MATERIAL EST % COMMENTS

A) Most commonly used laminates   $TCPF PCOG 6[RG
(G10, FR4, etc.)
$TCPF PCOG 6[RG
$TCPF PCOG 6[RG
$TCPF PCOG 6[RG
B) Other laminate material
1) Planar resistor layers   7. CRRTQXGF

2) BT epoxy   7. CRRTQXGF
3) Kevlar
7. CRRTQXGF
4) Teflon   7. CRRTQXGF
5) Polyimide   7. CRRTQXGF
6) Cyanate ester   7. CRRTQXGF
7) Other   7. CRRTQXGF
C) Specification to which laminate is
purchased (check all that apply)
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D) Laminate storage
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E) Panel size configurations in X, Y

dimesions
maximum X      Y      mm
minimum X      Y      mm
other X      Y      mm
IPC-1710 - 12/97 4-4
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
4.2.2 PROCESS PRECISION SPECIFICS YES NO VALUE COMMENTS

A) Maximum printed board
thickness built in volume
1) Single sided
2) Double sided
3) Multilayer
4) Rigid flex
B) Printed board electrical
performance capability
1) Impedance control
2) Capacitance control
3) Microstrip boards
C) Tooling system description
1) Same holes in panels used
for all processes
2) Optical registration 2TQEGUU�
3) Other
4.2.3 OTHER PROCESS ORIENTATION YES NO SYSTEM COMMENTS
SPECIFICS
A) Solder mask over bare copper
B) Plating/coating information
1) Tin/lead reflow
2) Hot air leveling
3) Azole organic
4) Conductive
C) Hole formation
1) Hole cleaning
2) Hole cleanliness verified
IPC-1710 - 12/97 4-5
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
4.3 PRODUCT DESCRIPTION
*CONSISTENCY IMPLIES YIELDS IN EXCESS OF 80%

4.3.1. THROUGH HOLE INSERTION EST % SIZE (MM) - +/- TOL COMMENTS

A) Smallest conductor width and

tolerance produced with consistency

1) Outer layers (print and etch) 5K\G OO

6QN ± �OO
2) Inner layers (print and etch) 5K\G OO

6QN ± �OO
3) Outer layers (plated) 5K\G OO
6QN ± �OO
4) Inner layers (plated) 5K\G OO
6QN ± �OO
5) Outer layers (additive plating)
5K\G OO
6QN ± �OO
6) Inner layers (additive plating) 5K\G OO
6QN ± �OO
B) Smallest plated-through hole (PTH)
and tolerance consistently produced
in 1.5mm thickness material or
multilayer board
1) Minimum PTH diameter
5K\G OO
6QN ± �OO
2) Largest panel where this hole can 5K\G OO
be controlled (across diagonal)
6QN ± �OO
C) Largest hole size that can be drilled
and plated through in a 1.25 mm
diameter land while maintaining an
annular ring of 0.125 mm in
large/small boards
1) Largest board size (across 5K\G OO
diagonal)
2) Largest hole diameter
5K\G OO
3) Smallest board size (across 5K\G OO
diagonal)
4) Largest hole diameter 5K\G OO
D) Surface mount land pattern pitch
(check all that apply)
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���OO =����? ����OO =����?
1VJGT �
IPC-1710 - 12/97 4-6
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
E) Solder mask dam between lands
(check all that apply)
����OO =����? ����OO =����?
���OO =����? ���OO =����?
���OO =����? ����OO =����?
1VJGT �
F) Flatness tolerance (bow & twist) after

reflow or solder coating
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4.3.2 PRODUCT QUALITATIVE AND YES NO QUANTITY OF NUMBER or COMMENTS
QUANTITATIVE INFORMATION PANELS DIMENSION
A) Multilayer layer count
1) Maximum layers fabricated in
volume (Maximum Lot)
2) Maximum layers fabricated in
prototype (Minimum Lot)
B) Buried vias produced consistently
in volume
1) Size
2) Number of layers
B) Blind vias produced consistently in
volume
1) Size
2) Number of layers
1) Controlled depth drilling
2) Total number of layers
4.4. TESTING CAPABILITY
4.4.1 TEST AND TEST EQUIPMENT YES NO COMMENTS
CAPABILITY
A) SMT centerline pitch that can be
electrically tested
0.63mm [.025] 0.5mm [.020]
0.4mm [.016] 0.3mm [.012]
0.25mm [.010] Other
B) Double sided simultaneous
electrical testing
1) Equipment type
2) X-ray fluorescence inspection
equipment
IPC-1710 - 12/97 4-7
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
3) TDR equipment
4) Hi-pot test equipment
5) Four-wire kelvin tester
6) Capacitance meter
7) Cleanliness testing
4.4.2 AUTOMATED OPTICAL INSPECTION EST % COMMENTS
USAGE
A) Before etching
B) After etching
C) Internal layers
D) Final inspection
E) Other
F) Conductor/clearance normally
inspected by AOI equipment
1) 0.05mm [.002]
2) 0.05-.10mm [.002-.004]
3) >.10mm [.004]
4) Planes
G) CAD download to AOI
IPC-1710 - 12/97 4-8
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
DATE COMPLETED
����������
SECTION 5
QUALITY PROFILE
GENERAL INFORMATION
COMPANY NAME
����������
CONTACT
����� �����
TELEPHONE NUMBER FAX NUMBER
���������� ����������
This section of the Manufacturer’s Qualification Profile is intended to describe the Total Quality Management (TQM) activity in
place of being implemented at the manufacturing facility identified in the site description of this MQP.
To ease in the task of identifying the TQM program being planned or underway at the manufacturing site, the activities have
been divided into twenty sections which when completed, provide the total picture of the posture toward managing quality
issues. Each section contains a number of questions with regard to the topic under review.
It is not the intent to have the questions be all encompassing, nor is every question applicable to all manufacturers. However,
identification of the status, related to each question, when considered as a whole will convey an impression of the progress
that the company has achieved in adopting the principles of total quality management.
The twenty sections, in order of the occurrence are:
5.1 General Quality Programs 5.11 Statistical Process Control
5.2 New Products/Technical Services 5.12 Problem Solving
5.3 Customer Satisfaction 5.13 In-Process Control
5.4 Computer Integrated Manufacturing 5.14 Receiving Inspection
5.5 Process Documentation 5.15 Material Handling
5.6 Quality Records 5.16 Non-Conforming Material Control
5.7 Skill, Training & Certification 5.17 Inspection and Test Plan
5.8 Subcontractor Control 5.18 Product Inspection/Final Audit
5.9 Calibration Control 5.19 Tooling Inspection, Handling, & Storage
5.10 Internal Audits 5.20 Corrective Action
Each section provides a status report related to each question. The question may not be applicable, no activity has started as
yet, or the company may have developed an approach to the issues raised by the questions. An (X) is indicated in the
appropriate column. If deployment/implementation has started, the status is reported as percent deployment; this is indicated
in column 4. The percentage number closely approximates the status of deployment. If deployment exists, the percentage
results that have been achieved is indicated in column 5. Results are based on expected goals. Not providing percent
information in either the deployment or results column implies a lack of activity in the particular area.
The quality descriptions requested are completed on the following pages by checking (X) the appropriate column to reflect the
status of the manufacturing facility TQM program. Additional information may be provided as comments shown below, or on
individual sections, or additional sheets as necessary.

COMMENTS
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IPC-1710 - 12/97
5-i
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
STATUS
5.1 GENERAL QUALITY PROGRAMS
Not Not Approach Percent Percent

DESCRIPTION OF PROGRAM
Applicable Started Developed Deployed Results

1. Are quality objectives and responsibilities clearly stated, widely distributed and understood

through the company?
2. Is there a quality function or well defined organization which provides customer advocate
guidance to the total organization and is this position fully supported by management?

3. Does a quality measurement system exist with clearly defined metrics and is it utilized as a

management tool?
4. Are work instructions approved and controlled; and are they under revision control?

5. Are the quality procedures and policies current and available at the point of application; and
are they under revision control?
6. Are benchmark and customer satisfaction studies done to determine best in class for all
products, services, and administrative functions; and are quality goals set?
7. Are Statistical Process Control (SPC) principles understood by all levels of management?
8. Are there programs with sufficient resources assigned to support corrective actions and
prevention?
9. Does management solicit and accept feedback from the work force?
10. Is there management support of ongoing training (including quality training), and is it
documented by an organizational training plan?
11. Are there regular management reviews of elements of the quality improvement process,
including feedback for corrective action, and are the results acted upon?
12. Are the quality and reliability goals aggressive relative to customer expectations and targeted
at continuous improvement?
13. Are the people who are responsible for administering the quality assurance function
technically informed?
14. Does Management have a “defect prevention” attitude to achieve continuous improvement?
STATUS
5.2 NEW PRODUCTS/TECHNICAL
SERVICES
Not Not Approach Percent Percent
DESCRIPTION OF PROGRAM
Applicable Started Developed Deployed Results
1. Do new product/technology/service development policies and procedures exist, and do they
result in clearly defined project plans with appropriate measureables and approvals?
2. Is quantitative benchmarking used to evaluate all new products/technologies/services in
comparison to best-in-class offerings?
3. Does a roadmap exist to ensure continued development of leading edge, best-in-class
products/technology/services?
4. Is the capability of each operation which controls critical-to-function characteristics for new
products, fully certified?
5. Are statistical tools used in the development of robust (high yield) new processes, products,
and services?
6. When new product/technology/service requires a new process, is it developed jointly and
concurrently with the customer and/or suppliers?
7. Are design reviews conducted on a scheduled basis which properly address the process
capability indices of critical-to-function and product/service characteristics?
8.
Is the new product/technology/service, as produced by the process, verified to meet all
customer satisfaction requirements?
COMMENTS
IPC-1710 - 12/97 5-1
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
STATUS
5.3 CUSTOMER SATISFACTION
Not Not Approach Percent Percent
DESCRIPTION OF PROGRAM
Applicable Started Developed Deployed Results

1. Is there a measurement system in place to assess the customer’s perception of complete
performance?
2. Is an independent (unbiased) customer survey routinely conducted?

3. Is there an internal measurement system within the organization which correlates to the level

of customer satisfaction?
4. Are there specific goals for achieving Total Customer Satisfaction, both internal and
external?
5. To what extent are customer satisfaction goals disseminated and understood by everyone in
the organization?
6. Does management regularly review and assess all operating systems to determine if barriers
to customer satisfaction exist and are appropriate action plans then implemented?
7. Is there a method in place to obtain future customer requirements?
8. Are all findings of customer dissatisfaction reported back to the proper organization for
analysis and corrective action?
9. Are customer satisfaction requirements formally defined and documented, and are they
based on customer input?
10. Do all support organizations understand their role in achieving total customer satisfaction?
STATUS
5.4 COMPUTER INTEGRATED
MANUFACTURING
Not Not Approach Percent Percent
DESCRIPTION OF PROGRAM
Applicable Started Developed Deployed Results
1. Are systems integrated to allow electronic transfer of information between multiple systems to
eliminate redundant data entry?
2. Can customers electronically transfer CAD/CAM directly into manufacturing?
3. Can customers electronically transfer order information directly into the business system?
4. Is data electronically shared between shop floor control and process control systems (i.e.,
CNC, SPC, Electrical Test, AOI, etc.)?
5. Are planning systems (MRP, forecasting, capacity planning, financial planning, etc.)
electronically integrated with operation systems (order processing, purchasing, inventory
management, shop floor control, financial/cost control, etc.)?
6. Is information available from system processes in real time (vs. batch processing)?
7. Are processes and procedures documented and available on-line?
8. Do all functional departments have system access to key financial, manufacturing, sales, and
operational data, as it relates to their functional objectives?

9. Are computer simulation and design tools used to the maximum extent practicable in the
design of new products/technologies/services
COMMENTS
IPC-1710 - 12/97 5-2
Copyright © 1997, IPC; 2000, IEC
DECEMBER, 1997 IPC
STATUS
5.5 PROCESS DOCUMENTATION
Not Not Approach Percent Percent
DESCRIPTION OF PROGRAM
Applicable Started Developed Deployed Results

1. Are manufacturing product, process, and configuration documents under issue control?

2. Are “preliminary” and “special product” specifications controlled?

3. Does the system ensure that the most current customer specifications are available to the
manufacturing personnel?
4. Does the system ensure that the most current material specifications are available to the

procurement function?
5. Are incoming orders reviewed for revisions and issue changes?
6. Is conformance to customer specifications assured before an order is accepted?
7. Is customer feedback provided when designs do not meet manufacturability requirements?
8. Are critical characteristics classified, relative to impact on product performance?
9. Are customers informed of changes made to products controlled by customer drawings or
specifications?
10. Is there an effective internal deviation control procedure and, are customer requested
deviations documented and followed?
11. Do new product development procedures exist, and are they followed in the design
development process?
STATUS
5.6 QUALITY RECORDS
Not Not Approach Percent Percent
DESCRIPTION OF PROGRAM
Applicable
...