IEC 62951-6:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films

IEC 62951-6:2019 specifies terms, as well as the test method and report of sheet resistance of the flexible conducting film under bending and folding tests. The measurement methods include the 2-point probe, 4-point probe and Montgomery method, which can be applied to in-situ and ex-situ measurement and the measurements of anisotropic sheet resistance.

Dispositifs à semiconducteurs - Dispositifs à semiconducteurs souples et extensibles - Partie 6: Méthode d’essai pour la résistance de couche des couches conductrices souples

L’IEC 62951-6:2019 spécifie les termes, ainsi que la méthode et le rapport d’essai de la résistance de couche d’une couche conductrice souple soumise à des essais de courbure et de pliage. Les méthodes de mesurage comprennent la méthode de la sonde 2 points, la méthode de la sonde 4 points et la méthode de Montgomery, qui peuvent être appliquées à un mesurage sur site ou hors site et aux mesurages de résistance de couche anisotrope.

General Information

• Status: Published
• Publication Date: 05-May-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 29.060.20 - Cables
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 6 - TC 47/WG 6
• Current Stage: PPUB - Publication issued
• Start Date: 24-May-2019
• Completion Date: 06-May-2019

Standards Content (Sample)

IEC 62951-6 ®
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Flexible and stretchable semiconductor devices –
Part 6: Test method for sheet resistance of flexible conducting films

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs souples
et extensibles –
Partie 6: Méthode d’essai pour la résistance de couche des couches
conductrices souples
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IEC 62951-6 ®
Edition 1.0 2019-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Flexible and stretchable semiconductor devices –

Part 6: Test method for sheet resistance of flexible conducting films

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs souples

et extensibles –
Partie 6: Méthode d’essai pour la résistance de couche des couches

conductrices souples
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-6871-1

– 2 – IEC 62951-6:2019 © IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Atmospheric conditions for evaluation and conditioning . 7
5 In situ measurements using 2-point probe method . 8
5.1 General . 8
5.2 Sample preparation . 8
5.3 Test methods . 8
5.3.1 Test apparatus . 8
5.3.2 Measurement and data analysis . 9
5.4 Report of results . 9
6 Uniformity measurement using 4-point probe method . 10
6.1 General . 10
6.2 Test methods . 10
6.2.1 Test apparatus . 10
6.2.2 Measurement and data analysis . 10
6.3 Report of results . 11
7 Anisotropic measurement using the Montgomery method . 12
7.1 General . 12
7.2 Test methods . 12
7.2.1 Test apparatus . 12
7.2.2 Measurement and data analysis . 12
7.3 Report of results . 13
Annex A (informative) Bending tests . 14
Annex B (informative) 4-point probe measurements . 15
B.1 General . 15
B.2 Correction for finite sample size . 15
B.3 Correction factors accounting for finite size probe tips . 20
Annex C (informative) Montgomery method. 22
C.1 General . 22
C.2 Sample preparation . 22
C.3 Measurement of sheet resistance of isotropic sample . 23
C.4 Measurement of anisotropic sheet resistance . 24
Bibliography . 25

Figure 1 – Possible electric connection of 2-point probe measurement . 8
Figure 2 – Gauge section of bending test . 9
Figure 3 – Example of measuring positions . 11
Figure 4 – Direction of bending and collinear probes . 11
Figure 5 – Resistance measurement with the Montgomery method . 13
Figure A.1 – Two common bending test methods for flexible substrates . 14
Figure B.1 – Schematic diagram of 4-point probe . 15
Figure B.2 – Correction factor of square sample depending on length/probe spacing [2] . 17

Figure B.3 – Correction factor depending on measuring position when collinear probes
are directed vertically . 18
Figure B.4 – Correction factor depending on measuring position when collinear probes

are directed horizontally . 18
Figure B.5 – Correction factor, f depending on measuring positions and direction of
collinear probes . 19
Figure B.6 – Example of probe with a finite contact diameter (e.g. 2mm) comparable to
inter-distance between probes (e.g. 5 mm) . 20
Figure B.7 – Dimensional sketch of probe with a finite contact diameter . 21
Figure C.1 – Possible contact placements of square or rectangular sample . 22
Figure C.2 – Correction factors for finite contact size on resistivity measurement [4] . 23
Figure C.3 – Resistance measurement of Montgomery method . 24

– 4 – IEC 62951-6:2019 © IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES –

Part 6: Test method for sheet resistance of flexible conducting films

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