IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées

L'IEC 61189-2-803:2023 définit une méthode d'essai pour déterminer la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées en utilisant un analyseur thermomécanique (TMA - thermomechanical analyser).

General Information

• Status: Published
• Publication Date: 25-Jul-2023
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 24-Aug-2023
• Completion Date: 26-Jul-2023

Standards Content (Sample)

IEC 61189-2-803 ®
Edition 1.0 2023-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-803: Test methods for Z-axis expansion of base materials and printed
boards
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de
base et des cartes imprimées
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IEC 61189-2-803 ®
Edition 1.0 2023-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-803: Test methods for Z-axis expansion of base materials and printed

boards
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux

de base et des cartes imprimées

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-7264-0

– 2 – IEC 61189-2-803:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Preparation of test specimens . 5
5 Test specimens . 5
6 Test apparatus . 6
7 Test procedure . 6
8 Calculation . 6
9 Report . 7
Bibliography . 8

Figure 1 – Example TMA data output . 6

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-803: Test methods for Z-axis expansion of base materials and
printed boards
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61189-2-803 has been prepared by IEC technical committee TC 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1760/CDV 91/1863/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 61189-2-803:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-803: Test methods for Z-axis expansion of base materials and
printed boards
1 Scope
This part of IEC 61189 specifies a test method to determine the Z-axis expansion of base
materials and printed boards using a thermomechanical analyser (TMA).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60194-1, Printed boards design, manufacture and assembly – Vocabulary – Part 1:
Common usage in printed board and electronic assembly technologies
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194-1 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
4 Preparation of test specimens
Unless otherwise specified, a minimum of two specimens shall be tested. These specimens
shall be taken from random locations of the material to be evaluated.
The test specimens shall be verified to be free of particles.
5 Test specimens
Test specimens shall be unclad laminate material or a printed circuit board. Multilayer printed
boards may be tested but no internal conductors are to be present in the specimen.
All copper shall be etched from the te
...