IEC 61189-2:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

General Information

• Status: Published
• Publication Date: 29-May-2006
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 31-Jan-2006
• Completion Date: 30-May-2006

Relations

• Revises: IEC 61189-2:1997 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
• Effective Date: 05-Sep-2023
• Revises: IEC 61189-2:1997/AMD1:2000 - Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
• Effective Date: 05-Sep-2023

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 61189-2
Second edition
2006-05
Test methods for electrical materials, printed
boards and other interconnection structures
and assemblies –
Part 2:
Test methods for materials
for interconnection structures
Reference number
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60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
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edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
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INTERNATIONAL IEC
STANDARD 61189-2
Second edition
2006-05
Test methods for electrical materials, printed
boards and other interconnection structures
and assemblies –
Part 2:
Test methods for materials
for interconnection structures

 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XF
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 61189-2  IEC:2006(E)
CONTENTS
FOREWORD.6
INTRODUCTION.8

1 Scope.9
2 Normative references.9
3 Accuracy, precision and resolution .9
3.1 Accuracy .10
3.2 Precision .10
3.3 Resolution .11
3.4 Report .11
3.5 Student’s "t" distribution.11
3.6 Suggested uncertainty limits .12
4 Catalogue of approved test methods .13
5 P: Preparation/conditioning test methods .13
5.1 Test 2P01: Dry heat (under consideration) .13
5.2 Test 2P02: Solder float stress (under consideration) .13
6 V: Visual test methods .13
7 D: Dimensional test methods .13
7.1 Test 2D01: Thickness of base materials and rigid boards .13
8 C: Chemical test methods .15
8.1 Test 2C01: Resistance to sodium hydroxide of base materials.15
8.2 Test 2C02: Gel time of epoxy based prepreg materials.16
8.3 Test 2C03: Resin content of prepreg materials by treated weight.17
8.4 Test 2C04: Volatile content of prepreg materials .19
8.5 Test 2C05: Blistering during heat shock .21
8.6 Test 2C06: Flammability, vertical burning test for rigid materials .23
8.7 Test 2C07: Flammability; horizontal burning test for rigid materials.26
8.8 Test 2C08: Flammability, flex material .29
8.9 Test 2C09: Melting viscosity of prepreg materials.33
8.10 Test 2C10: Resin content of prepreg materials by sublimation.35
8.11 Test 2C11: UV blocking characteristics of laminates .37
8.12 Test 2C12: Total halogen content in base materials .38
9 M: Mechanical test methods.42
9.1 Test 2M01: Test method for bow and twist .42
9.2 Test 2M02: Bow/twist after etching and heating.43
9.3 Test 2M03: Cure factor of base materials by differential scanning calorimetry
(DSC) or thermomechanical analysis (TMA) .45
9.4 Test 2M04: Twist after heating (under consideration) .46
9.5 Test 2M05: Pull-off strength.46
9.6 Test 2M06: Peel strength after exposure to solvent vapour.48
9.7 Test 2M07: Peel strength after immersion in solvent .50
9.8 Test 2M08: Flexural strength (under consideration).51
9.9 Test 2M09: Resin flow of prepreg material .51
9.10 Test 2M10: Glass transition temperature of base materials by differential
scanning calorimetry (DSC) .53

61189-2  IEC:2006(E) – 3 –
9.11 Test 2M11: Glass transition temperature of base materials by
thermomechanical analysis (TMA) .55
9.12 Test 2M12: Surface waviness .58
9.13 Test 2M13: Peel strength as received .59
9.14 Test 2M14: Peel strength after heat shock .60
9.15 Test 2M15: Peel strength after dry heat.63
9.16 Test 2M16: Peel strength after simulated plating .64
9.17 Test 2M17: Peel strength at high temperature .66
9.18 Test 2M18: Surface quality (under consideration).68
9.19 Test 2M19: Punching (under consideration) .68
9.20 Test 2M20: Flexural strength .68
9.21 Test 2M21: Rolling fatigue of flexible base materials .69
9.22 Test 2M22: Weight of foil after lamination .71
9.23 Test method 2M23: Rectangularity of cut panels .73
9.24 Test 2M24: Coefficient of thermal expansion (under consideration) .74
9.25 Test 2M25: Time to delamination by thermomechanical analysis (TMA).74
9.26 Test 2M26: Scaled flow test for prepreg materials .75
9.27 Test 2M27: The resin flow properties of coverlay films, bonding films and
adhesive cast films used in the fabrication of flexible printed boards .78
10 Electrical test methods.83
10.1 Test 2E01: Surface tracking, moisture condition (under consideration) .83
10.2 Test 10.2 2E02: Dielectric breakdown of base materials parallel to
laminations .83
10.3 Test 2E03: Surface resistance after damp heat, steady state .85
10.4 Test 2E04: Volume resistivity and surface resistivity.90
10.5 Test 2E05: Permittivity and dielectric dissipation (under consideration).94
10.6 Test 2E06: Volume and surface resistivity, 3 electrodes (under consideration).94
10.7 Test 2E07: Surface and volume resistivity, elevated temperature (under
consideration).94
10.8 Test 2E08: Surface corrosion.94
10.9 Test 2E09: Comparative tracking index (CTI) .96
10.10 Test 2E10: Permittivity and dissipation factor (under consideration). 100
10.11 Test 2E11: Electric strength (under consideration) . 100
10.12 Test 2E12: Resistance of foil (under consideration). 100
10.13 Test 2E13: Corrosion at edge (under consideration). 100
10.14 Test 2E14: Arc resistance. 100
10.15 Test 2E15: Dielectric break-down (under consideration) . 104
10.16 Test 2E16: Contact resistance of printed circuit keypad cont (under
consideration). 104
10.17 Test 2E17: Insulation resistance of printed board materials . 104
10.18 Test 2E18: Fungus resistance of printed board materials . 105
11 N: Environmental test methods . 109
11.1 Test 2N01: Pressure cooker test (under consideration) . 109
11.2 Test 2N02: Water absorption . 109
12 X: Miscellaneous test methods. 110
12.1 Test 2X02: Dimensional stability of thin laminates . 110

– 4 – 61189-2  IEC:2006(E)
Annex A (informative) Worked examples . 114
Annex B (informative) Conversion table. 116
Annex C (informative) Laboratory pro forma (form) . 121
Annex D (informative) Laboratory pro forma . 122

Figure 1 – Thickness measuring points.14
Figure 2 – Position of specimens.20
Figure 3 – Fluidized sand bath.22
Figure 4 – Test fixture .28
Figure 5 – V method (Vertical flammability method) .32
Figure 6 – VTM method (vertical flammability method for recaltrant specimens).32
Figure 7 – Example of prepreg melting viscosity .35
Figure 8 – Position of specimens for resin content.36
Figure 9 – Absorption of combustion gas using a combustion flask set-up.40
Figure 10 – Composition of ion exchange chromatograph .
...