Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

IEC 62047-29:2017(E) specifies a relaxation test method for measuring electromechanical properties of freestanding conductive thin films for micro-electromechanical systems (MEMS) under controlled strain and room temperature. Freestanding thin films of conductive materials are extensively utilized in MEMS, opto-electronics, and flexible/wearable electronics products. Freestanding thin films in the products experience external and internal stresses which could be relaxed even under room temperature during a period of operation, and this relaxation leads to time-dependent variation of electrical performances of the products. This test method is valid for isotropic, homogeneous, and linearly viscoelastic materials.

General Information

Status
Published
Publication Date
21-Nov-2017
Current Stage
PPUB - Publication issued
Completion Date
22-Nov-2017
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IEC 62047-29
Edition 1.0 2017-11
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 29: Electromechanical relaxation test method for freestanding conductive
thin films under room temperature
IEC 62047-29:2017-11(en)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 62047-29
Edition 1.0 2017-11
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 29: Electromechanical relaxation test method for freestanding conductive
thin films under room temperature
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-5046-4

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC 62047-29:2017 © IEC 2017
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope .............................................................................................................................. 5

2 Normative references ...................................................................................................... 5

3 Terms and symbols ......................................................................................................... 5

3.1 Terms and definitions .............................................................................................. 5

3.2 Symbols and designations ...................................................................................... 6

4 Test piece ....................................................................................................................... 7

4.1 General ................................................................................................................... 7

4.2 Shape of a test piece .............................................................................................. 7

4.3 Measurement of dimensions ................................................................................... 7

5 Test principle and test apparatus ..................................................................................... 7

5.1 Test principle .......................................................................................................... 7

5.2 Test environment .................................................................................................... 7

5.3 Test machine .......................................................................................................... 7

5.4 Test procedure ........................................................................................................ 8

5.5 Data analysis .......................................................................................................... 8

6 Test report ....................................................................................................................... 9

Annex A (informative) Electromechanical relaxation test example of freestanding Au film .... 10

A.1 Testing overview ................................................................................................... 10

A.2 Testing results ...................................................................................................... 11

Figure 1 – Freestanding test piece .......................................................................................... 6

Figure 2 – Experimental setup ................................................................................................ 8

Figure A.1 – Photograph of test equipment and a schematic for experimental setup ............. 10

Figure A.2 – Electromechanical relaxation data of freestanding Au film with a thickness

of 1 μm ................................................................................................................................. 12

Table 1 – Symbols and designations of a test piece ................................................................ 6

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IEC 62047-29:2017 © IEC 2017 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 29: Electromechanical relaxation test method for freestanding
conductive thin films under room temperature
FOREWORD

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International Standard IEC 62047-29 has been prepared by subcommittee 47F:

Micro-electromechanical systems, of IEC technical committee 47: Semiconductor devices.

The text of this International Standard is based on the following documents:
FDIS Report on voting
47F/295/FDIS 47F/298/RVD

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

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– 4 – IEC 62047-29:2017 © IEC 2017

A list of all parts in the IEC 62047 series, published under the general title Semiconductor

devices – Micro-electromechanical devices, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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colour printer.
---------------------- Page: 6 ----------------------
IEC 62047-29:2017 © IEC 2017 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 29: Electromechanical relaxation test method for freestanding
conductive thin films under room temperature
1 Scope

This part of IEC 62047 specifies a relaxation test method for measuring electromechanical

properties of freestanding conductive thin films for micro-electromechanical systems (MEMS)

under controlled strain and room temperature. Freestanding thin films of conductive materials

are extensively utilized in MEMS, opto-electronics, and flexible/wearable electronics products.

Freestanding thin films in the products experience external and internal stresses which could

be relaxed even under room temperature during a period of operation, and this relaxation

leads to time-dependent variation of electrical performances of the products. This test method

is valid for isotropic, homogeneous, and linearly viscoelastic materials.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 62047-2:2006, Semiconductor devices – Micro-electromechanical devices – Part 2:

Tensile testin
...

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