Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN.

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion - Mesure de la puissance élastique et du facteur de rétention de la puissance élastique des matériaux diélectriques flexibles

L’IEC 61189-2-501:2022 établit une méthode mettant à l’essai la souplesse d’un stratifié flexible recouvert de cuivre (FCCL, Flexible Copper Clad Laminate) et des matériaux apparentés. Cette méthode détermine l’élasticité dans des conditions spécifiées. L’essai est effectué sur un échantillon tel que fabriqué et sans conditionnement. L’essai ne s’applique pas à une force élastique inférieure à 10 mN.

General Information

Status
Published
Publication Date
02-Feb-2022
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
28-Jan-2022
Completion Date
03-Feb-2022
Ref Project

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IEC 61189-2-501:2022 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
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IEC 61189-2-501 ®
Edition 1.0 2022-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention factor of
flexible dielectric materials
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion –
Mesure de la puissance élastique et du facteur de rétention de la puissance
élastique des matériaux diélectriques flexibles

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IEC 61189-2-501 ®
Edition 1.0 2022-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-501: Test methods for materials for interconnection structures –

Measurement of resilience strength and resilience strength retention factor of

flexible dielectric materials
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-501: Méthodes d’essai des matériaux pour structures d’interconnexion –

Mesure de la puissance élastique et du facteur de rétention de la puissance

élastique des matériaux diélectriques flexibles

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-1071-7

– 2 – IEC 61189-2-501:2022  IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test apparatus and materials . 8
5 Test specimens . 8
6 Procedure . 8
7 Calculation . 10
8 Report . 11
Annex A (informative) Example of test fixture . 12

Figure 1 – Test specimen . 8
Figure 2 – Schematic of compression jig with test specimen . 9
Figure 3 – Force curve . 10
Figure A.1 – A test fixture and a fixture with a sample . 12
Figure A.2 – General assembly drawing . 13
Figure A.3 – A detailed dimensional drawing for each part of an example test fixture . 15
Figure A.4 – Construction of a test fixture is using the parts shown in Figure A.3 . 16
Figure A.5 – Connector attachments . 16

Table 1 – Settings of distance between the clamps after compression . 9
Table A.1 – Parts list . 13

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-501: Test methods for materials for interconnection structures –
Measurement of resilience strength and resilience strength retention
factor of flexible dielectric materials

FOREWORD
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IEC 61189-2-501 has been prepared by IEC technical committee TC 91: Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1765/FDIS 91/1774/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 61189-2-501:2022  IEC 2022
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 61189 series, published under the general title Test methods for
electrical materials, printed boards and other interconnection structures and assemblies, can
be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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