IEC TS 62647-23:2013

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

IEC/TS 62647-23:2013(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. The information contained within this document is based on the current knowledge of the industry at the time of publication.

General Information

• Status: Published
• Publication Date: 06-Oct-2013
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: WG 1 - TC 107/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 15-Jan-2014
• Completion Date: 07-Oct-2013

Relations

• Replaces: IEC PAS 62647-23:2011 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC/TS 62647-23
®

Edition 1.0 2013-10
TECHNICAL
SPECIFICATION

colour
inside


Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 23: Rework and repair guidance to address the implications of lead-free
electronics and mixed assemblies

IEC/TS 62647-23:2013(E)

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IEC/TS 62647-23

®


Edition 1.0 2013-10




TECHNICAL



SPECIFICATION








colour

inside










Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –

Part 23: Rework and repair guidance to address the implications of lead-free


electronics and mixed assemblies
























INTERNATIONAL

ELECTROTECHNICAL

COMMISSION

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ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-1162-5



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– 2 – TS 62647-23  IEC:2013(E)
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 14
4 Pb-free concerns . 16
4.1 General . 16
4.2 Reliability . 16
4.2.1 General . 16
4.2.2 Mixed metallurgy reliability. 16
4.3 Configuration management .
...