IEC 61189-5-1:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-1: Méthodes d'essai générales pour les matériaux et les assemblages - Lignes directrices pour les assemblages de cartes à circuit imprimé

L'IEC 61189-5-1:2016 est un catalogue de méthodes d'essai qui représentent les méthodologies et les modes opératoires qui peuvent être appliqués aux assemblages de cartes à circuit imprimé. La présente partie de l'IEC 61189 récapitule le contenu de la série IEC 61189-5, ainsi que les documents et manuels avec les lignes directrices relatives aux assemblages de cartes à circuit imprimé.

General Information

• Status: Published
• Publication Date: 04-Jul-2016
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 15-Sep-2016
• Completion Date: 05-Jul-2016

Standards Content (Sample)

IEC 61189-5-1 ®
Edition 1.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-1: General test methods for materials and assemblies – Guidance for
printed board assemblies
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 5-1: Méthodes d'essai générales pour les matériaux et les assemblages –
Lignes directrices pour les assemblages de cartes à circuit imprimé

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IEC 61189-5-1 ®
Edition 1.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 5-1: General test methods for materials and assemblies – Guidance for

printed board assemblies
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 5-1: Méthodes d'essai générales pour les matériaux et les assemblages –

Lignes directrices pour les assemblages de cartes à circuit imprimé

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-3506-5

– 2 – IEC 61189-5-1:2016 © IEC 2016
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references. 8
3 Accuracy, precision and resolution . 8
3.1 General . 8
3.2 Accuracy . 8
3.3 Precision . 9
3.4 Resolution. 10
3.5 Report . 10
3.6 Student’s t distribution . 10
3.7 Suggested uncertainty limits . 11
4 Catalogue of approved test methods . 12
5 List of contents of the IEC 61189-5 series . 12
Annex A (informative) Tests . 13
Annex B (informative) Guidance documents and handbooks . 15
B.1 General . 15
B.2 Handbook and guide to supplement IPC-J-STD-001 . 15
B.3 Guidelines for Electrically Conductive Surface Mount Adhesives (IPC-3406) . 15
B.4 Users Guide for Cleanliness of Unpopulated Printed Boards (IPC-5701) . 15
B.5 Guidelines for OEM’s in Determining Acceptable Levels of Cleanliness of
Unpopulated Printed Boards (IPC-5702) . 15
B.6 Surface Insulation Resistance Handbook (IPC-9201) . 16
B.7 Material and Process Characterisation / Qualification Test Protocol for
Assessing Electrochemical Performance (IPC-9202) . 16
B.8 User Guide for the IPC/IEC B52 Process Qualification Test Vehicle
(IPC-9203) . 16
B.9 PWB Assembly Soldering Process Guideline for Electronic Components
(IPC-9502) . 16
B.10 Aqueous Post Solder Cleaning Handbook (IPC-AC-62A) . 17
B.11 Guidelines for Cleaning of Printed Boards and Assemblies (IPC-CH-65A) . 17
B.12 Handbook (IPC-J-STD-005) . 17
B.13 Acceptability of Electronic Assemblies (IPC-HDBK-610) . 18
B.14 Guidelines for Design, Selection and Application of Conformal Coatings
(IPC-HDBK-830) . 18
B.15 Solder mask Handbook (IPC-HDBK-840) . 18
B.16 Guidelines and Requirements for Electrical Testing of Unpopulated Printed
Boards (IPC-9252) . 19
B.17 In-Process DPMO and Estimated Yield for PCAs (IPC-9261A) . 19
B.18 Assembly Soldering Process Guideline for Electronic Components
(IPC-9502 PWB) . 20
B.19 Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection
Reflow Assembly Simulation (IPC-9631) . 20
B.20 High Temperature Printed Board Flatness Guideline (IPC-9641) . 20
B.21 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament
(CAF) Resistance Test (Electrochemical Migration Testing) (IPC-9691A) . 21

B.22 Mechanical Shock Test Guidelines for Solder Joint Reliability (IPC-JEDEC-
9703) . 21
B.23 Printed Circuit Assembly Strain Gage Test Guideline (IPC-JEDEC-9704A) . 22
Bibliography . 23

Table 1 – Student’s t distribution . 11
Table A.1 – General test methods for materials and assemblies . 13

– 4 – IEC 61189-5-1:2016 © IEC 2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION
STRUCTURES AND ASSEMBLIES –
Part 5-1: General test methods for materials and assemblies –
Guidance for printed board assemblies

FOREWORD
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