Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-1: Méthodes d'essai générales pour les matériaux et les assemblages - Lignes directrices pour les assemblages de cartes à circuit imprimé

L'IEC 61189-5-1:2016 est un catalogue de méthodes d'essai qui représentent les méthodologies et les modes opératoires qui peuvent être appliqués aux assemblages de cartes à circuit imprimé. La présente partie de l'IEC 61189 récapitule le contenu de la série IEC 61189-5, ainsi que les documents et manuels avec les lignes directrices relatives aux assemblages de cartes à circuit imprimé.

General Information

Status
Published
Publication Date
04-Jul-2016
Current Stage
PPUB - Publication issued
Completion Date
05-Jul-2016
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IEC 61189-5-1
Edition 1.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-1: General test methods for materials and assemblies – Guidance for
printed board assemblies
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 5-1: Méthodes d'essai générales pour les matériaux et les assemblages –
Lignes directrices pour les assemblages de cartes à circuit imprimé
IEC 61189-5-1:2016-07(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 61189-5-1
Edition 1.0 2016-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-1: General test methods for materials and assemblies – Guidance for
printed board assemblies
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 5-1: Méthodes d'essai générales pour les matériaux et les assemblages –
Lignes directrices pour les assemblages de cartes à circuit imprimé
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-3506-5

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 61189-5-1:2016 © IEC 2016
CONTENTS

FOREWORD ......................................................................................................................... 4

INTRODUCTION ................................................................................................................... 6

1 Scope ............................................................................................................................ 8

2 Normative references..................................................................................................... 8

3 Accuracy, precision and resolution ................................................................................. 8

3.1 General ................................................................................................................. 8

3.2 Accuracy ............................................................................................................... 8

3.3 Precision ............................................................................................................... 9

3.4 Resolution........................................................................................................... 10

3.5 Report ................................................................................................................ 10

3.6 Student’s t distribution ......................................................................................... 10

3.7 Suggested uncertainty limits ................................................................................ 11

4 Catalogue of approved test methods ............................................................................ 12

5 List of contents of the IEC 61189-5 series .................................................................... 12

Annex A (informative) Tests ............................................................................................... 13

Annex B (informative) Guidance documents and handbooks ............................................... 15

B.1 General ............................................................................................................... 15

B.2 Handbook and guide to supplement IPC-J-STD-001 ............................................. 15

B.3 Guidelines for Electrically Conductive Surface Mount Adhesives (IPC-3406) ......... 15

B.4 Users Guide for Cleanliness of Unpopulated Printed Boards (IPC-5701) ............... 15

B.5 Guidelines for OEM’s in Determining Acceptable Levels of Cleanliness of

Unpopulated Printed Boards (IPC-5702) .............................................................. 15

B.6 Surface Insulation Resistance Handbook (IPC-9201) ........................................... 16

B.7 Material and Process Characterisation / Qualification Test Protocol for

Assessing Electrochemical Performance (IPC-9202) ............................................ 16

B.8 User Guide for the IPC/IEC B52 Process Qualification Test Vehicle

(IPC-9203) .......................................................................................................... 16

B.9 PWB Assembly Soldering Process Guideline for Electronic Components

(IPC-9502) .......................................................................................................... 16

B.10 Aqueous Post Solder Cleaning Handbook (IPC-AC-62A) ...................................... 17

B.11 Guidelines for Cleaning of Printed Boards and Assemblies (IPC-CH-65A) ............. 17

B.12 Handbook (IPC-J-STD-005) ................................................................................. 17

B.13 Acceptability of Electronic Assemblies (IPC-HDBK-610) ....................................... 18

B.14 Guidelines for Design, Selection and Application of Conformal Coatings

(IPC-HDBK-830) ................................................................................................. 18

B.15 Solder mask Handbook (IPC-HDBK-840) ............................................................. 18

B.16 Guidelines and Requirements for Electrical Testing of Unpopulated Printed

Boards (IPC-9252) .............................................................................................. 19

B.17 In-Process DPMO and Estimated Yield for PCAs (IPC-9261A) .............................. 19

B.18 Assembly Soldering Process Guideline for Electronic Components

(IPC-9502 PWB) ................................................................................................. 20

B.19 Users Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection

Reflow Assembly Simulation (IPC-9631) .............................................................. 20

B.20 High Temperature Printed Board Flatness Guideline (IPC-9641) .......................... 20

B.21 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament

(CAF) Resistance Test (Electrochemical Migration Testing) (IPC-9691A) .............. 21

---------------------- Page: 4 ----------------------
IEC 61189-5-1:2016 © IEC 2016 – 3 –
B.22 Mechanical Shock Test Guidelines for Solder Joint Reliability (IPC-JEDEC-

9703) .................................................................................................................. 21

B.23 Printed Circuit Assembly Strain Gage Test Guideline (IPC-JEDEC-9704A) ........... 22

Bibliography ....................................................................................................................... 23

Table 1 – Student’s t distribution ......................................................................................... 11

Table A.1 – General test methods for materials and assemblies ........................................... 13

---------------------- Page: 5 ----------------------
– 4 – IEC 61189-5-1:2016 © IEC 2016
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION
STRUCTURES AND ASSEMBLIES –
Part 5-1: General test methods for materials and assemblies –
Guidance for printed board assemblies
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

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with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 61189-5-1 has been prepared by IEC technical committee 91:

Electronics assembly technology.
The text of this standard is based on the following documents:
CDV Report on voting
91/1273/CDV 91/1354/RVC

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 6 ----------------------
IEC 61189-5-1:2016 © IEC 2016 – 5 –

A list of all parts in the IEC 61189 series, published under the general title Test methods for

electrical materials, printed boards and other interconnection structures and assemblies, can

be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 7 ----------------------
– 6 – IEC 61189-5-1:2016 © IEC 2016
INTRODUCTION

IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as

related materials or component robustness, irrespective of their method of manufacture.

The standard is divided into separate parts, covering information for the designer and the test

methodology engineer or technician. Each part has a specific focus. Methods are grouped

according to their application and numbered sequentially as they are developed and released.

In some instances test methods developed by other technical committees (for example, TC

104) have been reproduced from existing IEC standards in order to provide the reader with a

comprehensive set of test methods. When this situation occurs, it will be noted on the specific

test method. If the test method is reproduced with minor revisions, those paragraphs that are

different are identified.

This part of IEC 61189 contains test methods for evaluating printed board assemblies as well

as materials used in the manufacture of electronic assemblies. The methods are self-

contained, with sufficient detail and description so as to achieve uniformity and reproducibility

in the procedures and test methodologies.

It was decided by TC 91 that the contents of IEC 61189-5 and IEC 61189-6 be merged into a

series of documents in the following way:
IEC 61189-5-1, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-1: General test methods for materials and

assemblies – Guidance for printed board assemblies

IEC 61189-5-2:2015, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-2: General test methods for materials and

assemblies – Soldering flux for printed board assemblies

IEC 61189-5-3:2015, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-3: General test methods for materials and

assemblies – Soldering paste for printed board assemblies

IEC 61189-5-4:2015, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-4: General test methods for materials and

assemblies – Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

IEC 61189-5-501:—, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-501: General test methods for materials

and assemblies – Surface insulation resistance (SIR) testing of solder fluxes

IEC 61189-5-502:—, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-502: General test methods for materials

and assemblies – SIR testing of assemblies

IEC 61189-5-503:—, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-503: General test methods for materials

and assemblies – Conductive Anodic Filaments (CAF) testing of circuit boards

IEC 61189-5-504:—, Test methods for electrical materials, printed boards and other

interconnection structures and assemblies – Part 5-504: General test methods for materials

and assemblies – Process ionic contamination testing
____________
Under consideration.
---------------------- Page: 8 ----------------------
IEC 61189-5-1:2016 © IEC 2016 – 7 –

The tests shown in this standard are grouped according to the following principles:

P: preparation/conditioning methods
V: visual test methods
D: dimensional test methods
C: chemical test methods
M: mechanical test methods
E: electrical test methods
N: environmental test methods

X: miscellaneous test methods including process control tests for the assembly process

To facilitate reference to the tests, to retain consistency of presentation and to provide for

future expansion, each test is identified by a number (assigned sequentially) added to the

prefix (group code) letter showing the group to which the test method belongs.

The test method numbers have no significance with respect to an eventual test sequence.

This responsibility rests with the relevant specification that calls for the method being

performed. The relevant specification, in most instances, also describes pass/fail criteria.

The letter and number combinations are for reference purposes to be used by the relevant

specification. Thus, "5-2C01" represents the first chemical test method described in

IEC 61189-5-2.

In short, in this example, 5-2 is the number of the part of IEC 61189, C is the group of

methods, and 01 is the test number.

A list of all test methods included in the above-mentioned documents, is given in Annex A.

This annex will be reissued whenever new tests are introduced.
---------------------- Page: 9 ----------------------
– 8 – IEC 61189-5-1:2016 © IEC 2016
TEST METHODS FOR ELECTRICAL MATERIALS,
PRINTED BOARDS AND OTHER INTERCONNECTION
STRUCTURES AND ASSEMBLIES –
Part 5-1: General test methods for materials and assemblies –
Guidance for printed board assemblies
1 Scope

This part of IEC 61189 is a catalogue of test methods representing methodologies and

procedures that can be applied to test printed board assemblies.

This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as

guidance documents and handbooks for printed board assemblies.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
There are no normative references in this document.
3 Accuracy, precision and resolution
3.1 General

Measurement errors and uncertainties are inherent in all measurement processes. The

information given below enables valid estimates of the amount of error and uncertainty to be

taken into account.
Test data serve a number of purposes which include
• monitoring of a process;
• enhancing of confidence in quality conformance;
• arbitration between customer and supplier.

In any of these circumstances, it is essential that confidence can be placed upon the test data

in terms of
• accuracy: calibration of the test instruments and/or system;
• precision: the repeatability and uncertainty of the measurement;
• resolution: the suitability of the test instrument and/or system.
3.2 Accuracy

The regime by which routine calibration of the test equipment is undertaken shall be clearly

stated in the quality documentation of the supplier or agency conducting the test and shall

meet the requirements of ISO 9001 or equivalent (see Bibliography).
---------------------- Page: 10 ----------------------
IEC 61189-5-1:2016 © IEC 2016 – 9 –

The calibration shall be conducted by an agency having accreditation to a national or

international measurement standards institute. There should be an uninterrupted chain of

calibration to a national or international standard.

Where calibration to a national or international standard is not possible, round-robin

techniques may be used and documented to enhance confidence in measurement accuracy.

The calibration interval shall normally be one year. Equipment consistently found to be

outside acceptable limits of accuracy shall be subject to shortened calibration intervals.

Equipment consistently found to be well within acceptable limits may be subject to relaxed

calibration intervals.

A record of the calibration and maintenance history shall be maintained for each instrument.

These records should state the uncertainty of the calibration technique (in ±% deviation) in

order that uncertainties of measurement can be aggregated and determined.

A procedure shall be implemented to resolve any situation where an instrument is found to be

outside calibration limits.
3.3 Precision

The uncertainty budget of any measurement technique is made up of both systematic and

random uncertainties. All estimates shall be based upon a single confidence level, the

minimum being 95 %.

Systematic uncertainties are usually the predominant contributor and will include all

uncertainties not subject to random fluctuation. These include
• calibration uncertainties;

• errors due to the use of an instrument under conditions which differ from those under

which it was calibrated;
• errors in the graduation of a scale of an analogue meter (scale shape error).

Random uncertainties result from numerous sources but can be deduced from repeated

measurement of a standard item. Therefore, it is not necessary to isolate the individual

contributions. These may include

• random fluctuations such as those due to the variation of an influence parameter.

Typically, changes in atmospheric conditions reduce the repeatability of a measurement;

• uncertainty in discrimination, such as setting a pointer to a fiducial mark or interpolating

between graduations on an analogue scale.

Aggregation of uncertainties: Geometric addition (root-sum-square) of uncertainties may be

used in most cases. An interpolation error is normally added separately and may be accepted

as being 20 % of the difference between the finest graduations of the scale of the instrument.

2 2
U = ± (U + U ) + U
t s r i
where
U is the total uncertainty;
U is the systematic uncertainty;
U is the random uncertainty;
U is the interpolation error.
---------------------- Page: 11 ----------------------
– 10 – IEC 61189-5-1:2016 © IEC 2016

Determination of random uncertainties: Random uncertainty can be determined by repeated

measurement of a parameter and subsequent statistical manipulation of the measured data.

The technique assumes that the data exhibits a normal (Gaussian) distribution.
t × σ
U =
where
U is the random uncertainty;
n is the sample size;
t is the percentage point of the t distribution as shown in Table 1;
σ is the standard deviation (σ ).
n–1
3.4 Resolution

It is paramount that the test equipment used is capable of sufficient resolution. Measurement

systems used should be capable of resolving 10 % (or better) of the test limit tolerance.

It is accepted that some technologies will place a physical limitation upon resolution (for

example, optical resolution).
3.5 Report

In addition to requirements detailed in the test specification, the report shall detail

a) the test method used;
b) the identity of the sample(s);
c) the test instrumentation;
d) the specified limit(s);

e) an estimate of measurement uncertainty and resultant working limit(s) for the test;

f) the detailed test results;
g) the test date and operators’ signature.
3.6 Student’s t distribution

Table 1 gives values of the factor t for 95 % and 99 % confidence levels, as a function of the

number of measurements.
---------------------- Page: 12 ----------------------
IEC 61189-5-1:2016 © IEC 2016 – 11 –
Table 1 – Student’s t distribution
Sample t value t value Sample t value t value
size 95 % 99 % size 95 % 99 %
2 12,7 63,7 14 2,16 3,01
3 4,3 9,92 15 2,14 2,98
4 3,18 5,84 16 2,13 2,95
5 2,78 4,6 17 2,12 2,92
6 2,57 4,03 18 2,11 2,9
7 2,45 3,71 19 2,1 2,88
8 2,36 3,5 20 2,09 2,86
9 2,31 3,36 21 2,08 2,83
10 2,26 3,25 22 2,075 2,82
11 2,23 3,17 23 2,07 2,81
12 2,2 3,11 24 2,065 2,8
13 2,18 3,05 25 2,06 2,79
3.7 Suggested uncertainty limits
The following target uncertainties are suggested:
a) Voltage < 1 kV: ± 1,5 %
b) Voltage > 1 kV: ± 2,5 %
c) Current < 20 A: ± 1,5 %
d) Current > 20 A: ± 2,5 %
Resistance
e) Earth and continuity: ± 10 %
f) Insulation: ± 10 %
g) Frequency: ± 0,2 %
Time
h) Interval < 60 s: ± 1 s
i) Interval > 60 s: ± 2 %
j) Mass < 10 g: ± 0,5 %
k) Mass 10 g to 100 g: ± 1 %
l) Mass > 100 g: ± 2 %
m) Force: ± 2 %
n) Dimension < 25 mm: ± 0,5 %
o) Dimension > 25 mm: ± 0,1 mm
p) Temperature < 100 °C: ± 1,5 %
q) Temperature > 100 °C: ± 3,5 %
r) Humidity (30 – 75) % RH: ± 5 % RH
Plating thicknesses
s) Back
...

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