Lifts, escalators and passenger conveyors — Comparison of worldwide standards on electromagnetic interference/electromagnetic compatibility

ISO/TR 16764:2003 consists of a comparison of electromagnetic interference/electromagnetic compatibility (EMI/EMC) worldwide standards of interest to the lift industry.

Ascenseurs, escaliers mécaniques et trottoirs roulants — Comparaison des normes mondiales relatives à l'interférence électromagnétique/la compatibilité électromagnétique

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Publication Date
07-Sep-2003
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9093 - International Standard confirmed
Completion Date
21-May-2013
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TECHNICAL ISO/TR
REPORT 16764
First edition
2003-09-15

Lifts, escalators and passenger
conveyors — Comparison of worldwide
standards on electromagnetic
interference/electromagnetic
compatibility
Ascenseurs, escaliers mécaniques et trottoirs roulants — Comparaison
des normes mondiales relatives à l'interférence électromagnétique/la
compatibilité électromagnétique




Reference number
ISO/TR 16764:2003(E)
©
ISO 2003

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ISO/TR 16764:2003(E)
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ii © ISO 2003 — All rights reserved

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ISO/TR 16764:2003(E)
Contents Page
Foreword. iv
0 Introduction . v
0.1 Background . v
0.2 Understanding electromagnetic interference/electromagnetic compatibility (EMI/EMC) . v
1 Scope. 1
2 Electromagnetic interference/electromagnetic compatibility standards . 1
2.1 Background . 1
2.2 CISPR/IEC . 1
2.3 National committees/standards. 3
2.4 CENELEC . 5
2.5 Military. 5
3 Sources of electromagnetic disturbances .5
3.1 General. 5
3.2 Classification of electromagnetic interference (EMI) . 6
3.3 Typical EMC phenomena. 7
4 EMI/EMC comparison . 11
4.1 Emissions standards comparison . 11
4.2 Susceptibility/immunity standards comparison. 11
5 Test and measurement requirements .11
6 Future development. 12
6.1 Europe. 12
6.2 China . 13
6.3 United States . 13
7 Observations and recommendations.13
7.1 General. 13
7.2 Emission . 14
7.3 Immunity . 14
Annex A (normative) Conducted and radiated emission limits. 15
Annex B (normative) Susceptibility/Immunity. 26
Annex C (normative) Emissions/Immunity . 30
Annex D (informative) EMI/EMC units . 34
Annex E (informative) Frequency spectrum . 35
Bibliography . 36

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ISO/TR 16764:2003(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards bodies
(ISO member bodies). The work of preparing International Standards is normally carried out through ISO
technical committees. Each member body interested in a subject for which a technical committee has been
established has the right to be represented on that committee. International organizations, governmental and
non-governmental, in liaison with ISO, also take part in the work. ISO collaborates closely with the
International Electrotechnical Commission (IEC) on all matters of electrotechnical standardization.
International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2.
The main task of technical committees is to prepare International Standards. Draft International Standards
adopted by the technical committees are circulated to the member bodies for voting. Publication as an
International Standard requires approval by at least 75 % of the member bodies casting a vote.
In exceptional circumstances, when a technical committee has collected data of a different kind from that
which is normally published as an International Standard (“state of the art”, for example), it may decide by a
simple majority vote of its participating members to publish a Technical Report. A Technical Report is entirely
informative in nature and does not have to be reviewed until the data it provides are considered to be no
longer valid or useful.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. ISO shall not be held responsible for identifying any or all such patent rights.
ISO/TR 16764 was prepared by Technical Committee ISO/TC 178, Lifts, escalators, passenger conveyors.
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ISO/TR 16764:2003(E)
0 Introduction
0.1 Background
International standardizing bodies such as IEC, ISO, CISPR, CENELEC, have been involved in drawing up
common normative and technical documents to bring international markets closer together.
At the 1996 plenary meeting of ISO/TC 178, it was decided to carry out a comparison between various
national and international electrical requirements applicable to lifts (elevators) and escalators. The first
objective was to identify and compare the major EMC requirements applicable in the countries of the Working
Group members (Resolution 1996/134).
The content of this Technical Report is based on the information provided by ISO/TC 178/WG 8 members.
0.2 Understanding electromagnetic interference/electromagnetic compatibility (EMI/EMC)
An electromagnetic disturbance (noise that is not sinusoidal or unwanted signal) is any electromagnetic
phenomenon which may degrade the performance of a device, equipment or system. Electromagnetic
interference (EMI) is the degradation in the performance of a device, equipment or system caused by an
electromagnetic disturbance. The cause of EMI is unplanned coupling between a source and a receptor by
means of a transmission path. Transmission paths may be conducted or radiated. See, for example, Figure 1.
The ability of the device, equipment or system to function satisfactorily in an electromagnetic environment,
without introducing intolerable disturbances to that environment is called electromagnetic compatibility (EMC).
EMC has three elements:
a) a source of energy
b) a receptor that is disrupted by this energy
c) a coupling path between the source of energy and receptor.
Methods of coupling electromagnetic energy from a source to a receptor fall into one of four categories:
a) conducted (electric current)
b) inductively coupled (magnetic field)
c) capacitively coupled (electric field)
d) radiated (electromagnetic field).
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ISO/TR 16764:2003(E)

Key
1 source
2 receptor
3 cable
4 power line
a
Path 1: direct radiation from source to receptor.
b
Path 2: direct radiation from source, picked up by cables (power, signal and control) connected to the receptor, which
reaches the receptor via conduction path.
c
Path 3: EMI radiated by cables (power, signal or control) of the source.
d
Path 4: EMI conducted from source to receptor via cables (common power supply, signal/control).
NOTE 1 Source: Engineering EMC-IEEE Press.
NOTE 2 EMI carried by power/signal/control cables that are connected to the source can be coupled to the
power/signal/control cables of the receptor, especially when cable harnesses are bundled, even when common
power/signal/control cables do not exist.
Figure 1 — Mechanisms of electromagnetic interference

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TECHNICAL REPORT ISO/TR 16764:2003(E)

Lifts, escalators and passenger conveyors —
Comparison of worldwide standards on electromagnetic
interference/electromagnetic compatibility
1 Scope
This Technical Report consists of a comparison of electromagnetic interference/electromagnetic compatibility
(EMI/EMC) worldwide standards of interest to the lift industry.
2 Electromagnetic interference/electromagnetic compatibility standards
2.1 Background
With the advent of radio broadcast transmission in the 1920s, the interference from radio noise (i.e.
electromagnetic noise) became a concern of engineers in Europe and North America and many technical
papers were beginning to be published dealing with electromagnetic interference (EMI). Early studies showed
that motor driven appliances, switches, automobile ignitions, electric traction and electrical power lines, among
other sources, caused radio interference.
2.2 CISPR/IEC
In 1933 the International Special Committee on Radio Interference (CISPR, Comité International Spécial de
Perturbations Radioélectriques) was formed as a result of a joint effort of the International Electrotechnical
Commission (IEC) and the International Union of Broadcasting. The first meeting of CISPR was held in 1934
to address limits of EMI and methods of measurement. Following World War II, the United States, Canada
and Australia started to participate in CISPR. Subsequently countries from Asia and other parts of the world
also started participating in CISPR. The emphasis initially was on getting agreement on measurement
procedures and instrumentation for the protection of radio services with particular emphasis on radio
broadcasting. The subject of acceptable performance limits was left to a later date. IEC/TC 65 was formed in
the early 1960s and was also concerned with EMC requirements. In 1974, the IEC established a new
technical committee (IEC/TC 77) to cover EMC subjects not generally dealt with by the CISPR, in particular,
immunity characteristics of all kinds of equipment and emission phenomena below 9 kHz, the lower end of the
radio frequency spectrum. The organization of these committees in the IEC is shown in Figure 2. In formal
structure, the CISPR is a separate organization from the IEC. However it should be noted that the plenary is
constituted of representation from various international organizations, as well as by the National Committees
of the IEC. In the IEC council, only the National Committees are represented. Also, the publications of the
CISPR are issued by the IEC, and the operational procedures are identical in most respects.
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ISO/TR 16764:2003(E)

Figure 2 — Organization of CISPR and IEC technical committees responsible for EMI/EMC standards
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ISO/TR 16764:2003(E)
2.3 National committees/standards
2.3.1 When the CISPR was organized, national regulatory agencies such as the Federal Communications
Commission (FCC) in the US, the British Standards Institution (BSI) in the UK, Fernmelde Technisches
Zentralamt (FTZ) in Germany, Voluntary Control Council for Interference (VCCI) in Japan and similar
institutions in other countries also started promulgating interference control limits applicable in their respective
countries.
2.3.2 The China Technical Committee of Standardization of Radio Interference (CTCSRI) was established
in 1981 under the leadership of the China State Bureau of Technical and Quality Supervision. One of its tasks
is to study the IEC/CISPR EMC/EMI standards and develop China’s own EMC/EMI standards. There are eight
subcommittees from A to G and S which concern respectively test instrument, ISM equipment, mobile, radio
receiver, household appliances and electric tools, office equipment, and radio and non-radio systems. In 1993,
GB/T13926 was published which is equivalent to IEC 60801. Currently, there are more than forty EMC/EMI
standards published covering limits, test methods and related aspects such as site requirements and personal
hazards. There is a concerted effort in China to move towards those of the IEC/CISPR.
2.3.3 In the United States commercial EMC standards activities are coordinated through the efforts of ANSI
Accredited Standards Committee C63 for which the Institute of Electrical & Electronic Engineers (IEEE) is the
secretariat. Several societies of the IEEE and trade organizations such as EIA, NEMA, SAE and others as
well as Accredited Standards Committee C63 have developed standards pertaining to EMC. Except for cases
in which commercial standards are referenced in federal (legal) documents, for example C63.4 is called out in
FCC requirements, the use of these standards is wholly voluntary in the US. See Figure 3. While there is a
concerted effort to move the C63 documents towards those of the IEC/CISPR differences between the
IEC/CISPR and the US National standards persist.
Emission requirements in the United States are specified by the Federal Communication Commission (FCC).
The FCC administers civilian use of the frequency spectrum in the USA. Title 47 of the Code of Federal
Regulations covers telecommunication and controls the intentional and incidental use of the frequency
spectrum. The parts relevant to EMC are contained in Chapter 1: Part 15 — Radio Frequency Devices and
Part 18 — Industrial, Scientific and Medical Equipment. FCC Part 15 has extended the measurement range
for digital devices or computers up to 5 GHz.
The FCC has participated in the development of CISPR 22, and its requirements are similar to but not
identical to those of CISPR 22. The FCC has adopted ANSI C63.4 measurement procedures for testing digital
devices and computers. There are two classifications of digital devices:
 Class A: for the use in a commercial, industrial or business environment;
 Class B: for use in a residential environment.
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ISO/TR 16764:2003(E)

Figure 3 — Structure of American National Standards Committee C63
Harmful interference is defined as any emission, radiation or induction that may endanger the functioning of
a radio navigation service or other safety services or which seriously degrades, obstructs or repeatedly
interrupts a radio communications service operating in accordance with the regulations.
Although there are no requirements for susceptibility the “parties responsible for equipment compliances”
are advised to consider susceptibility to interference (e.g. by proximity to high power broadcast stations).
Devices are required to bear the following statement (label):
“This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.”
ANSI standards: Although the American national standards are based on broad consensus of the
manufacturers and users, they are nevertheless only recommendations. There is no provision to enforce
compliance on a mandatory basis.
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ISO/TR 16764:2003(E)
2.4 CENELEC
Within the European Community, the European Standards Committee for Electrical Products [CENELEC
Comité Européen de Normalisation Électrotechnique], set up in 1973, is responsible for bringing out
harmonized European standards for electrical products. The CENELEC EMC standards are generally identical
to CISPR and IEC/TC77 recommendations or contain usually minor “common modifications”. CENELEC
implements IEC results in Europe in a uniform manner by common agreement of its members. The
subcommittee responsible for EMC is IEC/TC 210.
2.5 Military
Military interest in the field of electromagnetic interference and techniques to control it, has led to important
advances in understanding EMI and the technology to achieve EMC. Although the armed forces in several
countries documented and published their own standards for limiting EMI, the work by the US military (MIL
standards) continues to lead the way in this field.
3 Sources of electromagnetic disturbances
3.1 General
Electromagnetic disturbances can be generated intentionally (e.g. telecommunication equipment), non-
intentionally (e.g. interactions in circuits and systems) or by natural sources (e.g. atmospheric lightning,
electrostatic discharge).
Potential sources of electromagnetic compatibility problems include radio transmitters, power lines, electronic
circuits, lightning, lamp dimmers, electric motors, arc welders, solar flares and just about anything that utilizes
or creates electromagnetic energy.
An overview of electromagnetic sources is shown in Figure 4.

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ISO/TR 16764:2003(E)

Communication/ Oscillators Atmospherics Cosmic/Galactic
Radar/Navigation Switches Lightning noise
equipment Motors
Fluorescent tube Filters Electrostatic Solar noise
lights Relays discharge
Automobile ignition Nonlinear circuit
elements
Industrial Circuit breakers
equipment such as Magnetic armatures
arc welders, Latching contactors
heaters, etc. Logic and digital
Electric traction circuits
Arcing due to
Appliances such as improper contacts
microwave ovens, Corona
mixers, vacuum
cleaners, electric
shavers
Power supplies
Disk drives
NOTE Source: Engineering EMC-IEEE Press.
Figure 4 — Electromagnetic disturbance
3.2 Classification of electromagnetic interference (EMI)
3.2.1 As previously discussed, EMI can be either conducted or radiated.
Some typical examples of EMI are
 picking up a CB radio conversations on your stereo;
 telephone is damaged by lightning-induced surges on the phone line;
 the screen on video display jitters when the fluorescent lights are on;
 new memory board is destroyed by an unseen discharge as you install it;
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ISO/TR 16764:2003(E)
 the clock on VCR resets everytime your air conditioner kicks in;
 laptop computer interferes with your aircraft’s rudder control;
 the airport radar interferes with laptop computer display;
 pacemaker picks up cellular telephone calls;
 a hospital’s electrocardiogram machine picks up a television channel.
3.2.2 Conducted interferences are disturbances not intentionally generated and are commonly present on
lines connected to power supply networks. Conducted interferences may also appear on data, telephone lines
or other metallic paths connecting the source of the interference and the susceptor. Some complex equipment
can generate conducted interference well up into the gigahertz frequency range. Different types of equipment
that commonly generate conducted interference are shown in Table 1.
Table 1 — Sources of conducted interference
Source Spectrum
Circuit Breaker Cam Contacts 10 MHz to 20 MHz
Command Programmer
Signal lines 0,1 MHz to 25 MHz
Power lines 1 MHz to 25 MHz
Computer Logic Box 50 kHz to 20 MHz
Corona 0,1 MHz to 10 MHz
Fluorescent Lamps 0,1 MHz to 3 MHz
Heater Circuits (Contact Cycling) 50 kHz to 25 MHz
Latching Contactor 50 kHz-25 MHz
Motor Armatures 2 MHz to 4 MHz
Mercury Arc Lamps 0,1 MHz to 1,0 MHz
Power Controller 2 kHz to 15 kHz
Power Supply Switching Circuit 0,5 MHz to 25 MHz
Power Transfer Controller 50 kHz to 25 MHz
Vacuum Cleaner 0,1 MHz to1,0 MHz
NOTE Source: Leland H. Hemming. Architectural EM Shielding Handbook, IEEE Press.
3.2.3 Radiated interferences are disturbances appearing as electromagnetic fields.
Radiated interference is caused by atmospheric disturbances, cosmic noise, solar radiation, and manmade
sources such as automobiles, industrial, commercial and medical equipment.
3.3 Typical EMC phenomena
3.3.1 General
The following classifications of EMC phenomena provide information to define measurements for the test
requirements listed in Clause 5.
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ISO/TR 16764:2003(E)
3.3.2 Low frequency disturbances (dc to 10 kHz to 20 kHz)
The phenomena of low frequency is mainly present on power supply lines due to load disturbances (e.g. non-
linear loads, fluctuating loads, unbalanced three phase voltage system) and faults on power networks. Typical
EMC phenomena concerning conducted low frequency disturbances are shown in Table 2.
Table 2 — Low frequency disturbances
EMC phenomena EMC phenomena source EMC phenomena effect
Harmonics and • Discrete frequencies (e.g. static frequency • A short quasi-instantaneous effect; which
Interharmonics converters, cyclo-converters) may range from an occasional
malfunctioning up to damage of an
• Continuous spectrum (e.g. arc furnaces)
electronic component
• A long term effect such as excessive
substation
Signal voltages in the low • “audio frequencies” in the range 110 Hz to • The operation of sensitive electronic
voltage supply networks 2 000 Hz (triple control) equipment could be affected (e.g.
[from 100 Hz to 150 Hz ] electronic control device, computers)
• “medium frequencies” in the range 3 kHz
to 20 kHz (MF-power line carriers)
• “radio frequencies” in the range 20 kHz to
150 kHz (RF-power line carriers)
Voltage fluctuations • Randomly varying large loads (e.g. arc • The operation of sensitive electronic
furnaces) equipment could be affected (e.g.
electronic control device, computers)
• On-off switching of loads (e.g. motors)
• Step voltage changes (due to tap voltage
regulators of transformers)
Voltage dips and short • Faults in the low voltage (<1 000 V), • Tripping of contactors
interruptions medium voltage (1 000 V to 100 kV) or
• Incorrect operation of regulating devices
high voltage (>100 kV) networks (short
circuits or ground faults)
• Commutation failures in converters
• Loss of data in computer memories
Three-phase voltage • Unbalance in a three-phase voltage • Overheating of a.c. rotating machines
unbalance
system
• Generation of non-characteristic
harmonics in electronic power converters
Power frequency variations
• Frequency variation in main power • Measurement errors
network
• Loss of synchronization
3.3.3 Conducted transients (nanoseconds to a few milliseconds) and high-frequency disturbances
Conducted transients (nanoseconds to a few milliseconds in duration) are very common on signal and power
supply lines coming from atmospheric phenomena (e.g. lightning), switching of inductive or capacitive loads
(e.g. relays, capacitors, motors) and faults on power networks which cause interference by coupling with other
cables. High frequency conducted disturbances are frequently caused by radio transmitters, ISM (Industrial
Scientific and Medical) and emissions from digital processing equipment which are coupled to signal and
power cables. The level of electromagnetic interference (i.e. disturbances) is dependent on the shielding,
earthing (grounding), over voltage protection etc. of the installations. Typical EMC phenomena concerning
conducted transient and high frequency disturbances are shown in Table 3.
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ISO/TR 16764:2003(E)
Table 3 — Conducted transient and HF-disturbances
EMC phenomena EMC phenomena source EMC phenomena effect
Voltage/Current surge • Blowing of high amperage fuses in low • The operation of electronic equipment can be
(100/1300 µs) voltage (< 1 000 V) supply network affected
• The electronic equipment can be damaged
Voltage surge (1,2/50 µs) • Switching phenomena in the power • If the equipment has high impedance relative
network (e.g. switching of capacitor to that of the source, the surge will produce a
Current surge (8/20 µs)
banks) voltage pulse on the equipment terminals
• Faults in the power network • If the equipment has a relative low
impedance, the surge will produce a current
• Lightning strokes (direct or indirect
pulse
strokes)
10/700 µs voltage surge • Lightning discharges • The operation of electrical or electronic
equipment can be affected
• Any other surge disturbances
Fast transient bursts
• Switching of small inductive loads, e.g. • The operation of electronic equipment can be
relay contacts bouncing (conducted affected but generally does not cause
interferences) damage
• Switching of high-voltage switchgear
Ring wave • Oscillatory transients due to switching • The operation of electronic equipment can be
phenomena in residential and industrial affected due to the voltage polarity changes
low voltage underground cabling
network
Damped oscillatory wave • Oscillatory transients induced in the • The operation of electrical or electronic
low voltage circuits by phenomena in equipment can be affected
the high voltage or medium voltage
networks (e.g. switching phenomena,
faults, etc.)
High frequency induced Continuous (or quasi-continuous) voltages • The operation of electrical or electronic
voltages originated by: equipment can be affected (these
disturbances induce oscillatory transients in
• Switching operations
the secondary circuits despite protective
measures; further, they can appear as
• Faults in the high voltage, medium
residual voltages on the screen of shielded
voltage or low voltage networks
cables)
3.3.4 Electrostatic discharge (ESD)
The phenomena of electrostatic discharge results from the friction between two non-conductive materials (one
of these could be the “air”) which causes a static charge. The level of disturbance depends on the insta
...

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