SIST EN 60749-15:2011

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010)

This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements of semiconductors, the clauses of this standard apply.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC 60749-15:2010)

Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15: Résistance à la température de soudage pour dispositifs par trous traversants (CEI 60749-15:2010)

La CEI 60749-15:2010 décrit un essai utilisé pour déterminer si les dispositifs à solide encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le soudage de leurs sorties en utilisant le brasage tendre à la vague ou le fer à braser. Cette seconde édition annule et remplace la première édition parue en 2003, dont elle constitue une révision technique. Les modifications importantes par rapport à l'édition antérieure comprennent:  - modification éditoriale dans le domaine d'application;  - ajout de spécification de la composition chimique de la soudure sans plomb.

Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del: Odpornost proti spajkalni temperaturi za elemente, montirane v skoznjih luknjah (IEC 60749-15:2010)

Ta del IEC 60749 opisuje preskus, ki se uporablja za ugotavljanje ali inkapsulirane naprave v trdnem stanju, ki se uporabljajo za montiranje v skoznjih luknjah, kljubujejo učinkom temperature, kateri so podvržene med spajkanjem njihovih vodnikov z uporabo valovitega spajkanja ali spajkanjem železa. Da bi se vzpostavil standardni preskusni postopek za najbolj ponovljive metode, se uporablja metoda spajkanja z namakanjem zaradi pogojev te metode, ki jih je lažje nadzorovati. Ta postopek določa, ali naprave lahko prenesejo spajkalno temperaturo pri postopkih montaže plošče tiskanega vezja, ne da bi se poslabšale njihove električne značilnosti ali notranji spoji. Ta preskus je porušitveni in se lahko uporabi za kvalifikacijo, sprejemljivost lotov in kontrolo proizvoda. Ta preskus ja na splošno v skladu z IEC 60068-2-20, vendar zaradi posebnih zahtev polprevodnikov veljajo klavzule tega standarda.

General Information

• Status: Withdrawn
• Publication Date: 26-Dec-2010
• Withdrawal Date: 24-Aug-2023
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 22-Aug-2023
• Due Date: 14-Sep-2023
• Completion Date: 25-Aug-2023
• Ref Project: EN 60749-15:2010 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Relations

• Replaces: SIST EN 60749-15:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 28-Jan-2023
• Replaced By: SIST EN IEC 60749-15:2020 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
• Effective Date: 07-Jun-2022
• Corrected By: SIST EN 60749-15:2011/AC:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60749-15:2011
01-februar-2011
1DGRPHãþD
SIST EN 60749-15:2004
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del:
Odpornost proti spajkalni temperaturi za elemente, montirane v skoznjih luknjah
(IEC 60749-15:2010)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to
soldering temperature for through-hole mounted devices (IEC 60749-15:2010)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15:
Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC
60749-15:2010)
Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15:
Résistance à la température de soudage pour dispositifs par trous traversants (CEI
60749-15:2010)
Ta slovenski standard je istoveten z: EN 60749-15:2010
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 60749-15:2011 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60749-15:2011

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SIST EN 60749-15:2011

EUROPEAN STANDARD
EN 60749-15

NORME EUROPÉENNE
December 2010
EUROPÄISCHE NORM

ICS 31.080.01 Supersedes EN 60749-15:2003


English version


Semiconductor devices -
Mechanical and climatic test methods -
Part 15: Resistance to soldering temperature for through-hole mounted
devices
(IEC 60749-15:2010)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d’essai mécaniques et Mechanische und klimatische
climatiques - Prüfverfahren -
Partie 15: Résistance à la température de Teil 15: Beständigkeit gegen
soudage pour dispositifs par trous Löttemperatur bei Bauelementen zur
traversants Durchsteckmontage
(CEI 60749-15:2010) (IEC 60749-15:2010)




This European Standard was approved by CENELEC on 2010-12-10. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-15:2010 E

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SIST EN 60749-15:2011
EN 60749-15:2010 - 2 -
Foreword
The text of document 47/2067/FDIS, future edition 2 of IEC 60749-15, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-15 on 2010-12-01.
This European Standard supersedes EN 60749-15:2003.
The significant changes with respect from EN 60749-15:2003 include:
– editorial change in the scope,
– addition of lead-free solder chemical composition specification.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2011-09-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-12-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-15:2010 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60068-2-20 NOTE  Harmonized as EN 60068-2-20.
__________

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SIST EN 60749-15:2011
IEC 60749-15
®
E
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