SIST EN 60749-15:2004

Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren -- Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 15: Résistance à la température de soudage pour dispositifs par trous traversants

Décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs, encapsulés, utilisés pour le montage par trous traversants, peuvent résister aux effets de la température à laquelle ils sont soumis pendant le soudage de leurs sorties, en utilisant le brasage tendre à la vague ou le fer à braser.

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2003)

General Information

• Status: Withdrawn
• Publication Date: 30-Jun-2004
• Withdrawal Date: 06-Jan-2014
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 06-Jan-2014
• Due Date: 29-Jan-2014
• Completion Date: 07-Jan-2014
• Ref Project: EN 60749-15:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Relations

• Revised: SIST EN 60749:2002 + A1:2002 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 13-May-2010
• Replaces: SIST EN 60749:2002 + A1:2002 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 28-Jan-2023
• Replaced By: SIST EN 60749-15:2011 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2010)
• Effective Date: 28-Jan-2023
• Replaces: SIST EN 60749:2002 + A1:2002 - Semiconductor devices - Mechanical and climatic test methods
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SIST EN 60749-15:2004SLOVENSKIjulij 2004
STANDARDSemiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2003)©
Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljenoReferenčna številkaSIST EN 60749-15:2004(en)ICS31.080.01







EUROPEAN STANDARD
EN 60749-15 NORME EUROPÉENNE EUROPÄISCHE NORM
April 2003 CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-15:2003 E
ICS 31.080.01
English version
Semiconductor devices –
Mechanical and climatic test methods Part 15: Resistance to soldering temperature
for through-hole mounted devices (IEC 60749-15:2003)
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques Partie 15: Résistance à la température
de soudage pour dispositifs
par trous traversants (CEI 60749-15:2003)
Halbleiterbauelemente –
Mechanische und klimatische Prüfverfahren Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen
zur Durchsteckmontage (IEC 60749-15:2003)
This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.



EN 60749-15:2003 - 2 - Foreword The text of document 47/1663/FDIS, future edition 1 of IEC 60749-15, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-15 on 2003-04-01. This mechanical and climatic test method, as it relates to resistance to soldering temperature for through-hole mounted devices, is a complete rewrite of the test contained in Subclause 2.2, Chapter 2 of EN 60749:1999. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2004-01-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2006-04-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 60749-15:2003 was approved by CENELEC as a European Standard without any modification. __________



- 3 - EN 60749-15:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications This European Standard incorporates by dated or undated reference, provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dated references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the publication referred to applies (including amendments). NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60068-2-20 - 1) Basic environmental testing proceduresPart 2: Tests - Test T: Soldering HD 323.2.20 S3 1988 2)
1) Undated reference. 2) Valid edition at date of issue.







NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD60749-15Première éditionFirst edition2003-02Dispositifs à semiconducteurs –Méthodes d'essais mécaniques et climatiques –Partie 15:Résistance à la température de soudagepour dispositifs par trous traversantsSemiconductor devices –Mechanical and climatic test methods –Part 15:Resistance to soldering temperaturefor through-hole mounted devicesPour prix, voir catalogue en vigueurFor price, see current catalogue IEC 2003
Droits de reproduction réservés
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Copyright - all rights reservedAucune partie de cette publication ne peut être reproduite niutilisée sous quelque forme que ce soit et par aucun procédé,électronique ou mécanique, y compris la photocopie et lesmicrofilms, sans l'accord écrit de l'éditeur.No part of this publication may be reproduced or utilized in anyform or by any means, electronic or mechanical, includingphotocopying and microfilm, without permission in writing fromthe publisher.International Electrotechnical Commission,
3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: [phone]
Telefax: [phone]
E-mail: [e-mail]
Web: www.iec.chCODE PRIXPRICE CODEFCommission Electrotechnique InternationaleInternational Electrotechnical CommissionМеждународная Электротехническая Комиссия



60749-15  IEC:2003– 3 –INTERNATIONAL ELECTROTECHNICAL COMMISSION____________SEMICONDUCTOR DEVICES –MECHANICAL AND CLIMATIC TEST METHODS –Part 15: Resistance to soldering temperaturefor through-hole mounted devicesFOREWORD1)The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprisingall national electrotechnical committees (IEC National Committees). The object of the IEC is to promoteinternational co-operation on all questions concerning standardization in the electrical and electronic fields. Tothis end and in addition to other activities, the IEC publishes International Standards. Their preparation isentrusted to technical committees; any IEC National Committee interested in the subject dealt with mayparticipate in this preparatory work. International, governmental and non-governmental organizations liaisingwith the IEC also participate in this preparation. The IEC collaborates closely with the InternationalOrganization for Standardization (ISO) in accordance with conditions determined by agreement between thetwo organizations.2)The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, aninternational consensus of opinion on the relevant subjects since each technical committee has representationfrom all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards, technical specifications, technical reports or guides and they are accepted by the NationalCommittees in that sense.4)
In order to promote international unification, IEC National Committees undertake to apply IEC Internationa
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