SIST EN 62228-2:2017

Integrated circuit - EMC Evaluation of transceivers - Part 2: LIN transceivers (IEC 62228-2:2016)

This part of IEC 62228 specifies test and measurement methods for EMC evaluation of LIN
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for
standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers
• the emission of RF disturbances,
• the immunity against RF disturbances,
• the immunity against impulses and
• the immunity against electrostatic discharges (ESD).

Integrierte Schaltungen - Bewertung der elektromagnetischen Verträglichkeit von Sende-Empfangsgeräten - Teil 2: LIN-Sende-Empfangsgeräte

Circuits intégrés - Évaluation de la CEM des émetteurs-récepteurs - Partie 2: Emetteurs-récepteurs LIN (IEC 62228-2:2016)

L'IEC 62228-2:2016 spécifie les méthodes d'essai et de mesure pour l'évaluation de la compatibilité électromagnétique (CEM) des circuits intégrés émetteurs-récepteurs LIN placés en réseau. Il définit les configurations d'essai, les conditions d'essai, les signaux d'essai, les critères de défaillance, les modes opératoires d'essai, les dispositions d'essai et les cartes d'essai. Il s'applique aux circuits intégrés émetteurs-récepteurs LIN standard et aux circuits intégrés avec émetteur-récepteur LIN intégré, et couvre:
- l'émission de perturbations radioélectriques;
- l'immunité aux perturbations radioélectriques;
- l'immunité aux transitoires électriques;
- l'immunité aux décharges électrostatiques (DES).

Integrirana vezja - Ocenjevanje elektromagnetne združljivosti (EMC) oddajnikov-sprejemnikov - 2. del: Oddajniki-sprejemniki za krajevno medvezalno omrežje (IEC 62228-2:2016)

Ta del standarda IEC 62228 določa preskusne in merilne metode za ocenjevanje elektromagnetne združljivosti integriranih vezij oddajnikov-sprejemnikov za krajevno medvezalno omrežje pri omrežnih pogojih. Opredeljuje konfiguracije preskusov, preskusne pogoje, preskusne signale, merila za neuspešno opravljen preskus, preskusne postopke, nastavitve preskusa in preskusne plošče. Uporablja se za standardna integrirana vezja oddajnikov-sprejemnikov za krajevno medvezalno omrežje in integrirana vezja z vgrajenim oddajnikom-sprejemnikom za krajevno medvezalno omrežje ter zajema
• oddajanje radiofrekvenčnih motenj,
• odpornost proti radiofrekvenčnim motnjam,
• odpornost proti impulzom in
• odpornost proti elektrostatični razelektritvi (ESD).

General Information

• Status: Published
• Publication Date: 19-Feb-2017
• ICS: 31.200 - Integrated circuits. Microelectronics
• ICS: 33.100.01 - Electromagnetic compatibility in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 09-Feb-2017
• Due Date: 16-Apr-2017
• Completion Date: 20-Feb-2017
• Ref Project: EN 62228-2:2017 - Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62228-2:2017
01-april-2017
Integrirana vezja - Ocenjevanje elektromagnetne združljivosti (EMC) oddajnikov-
sprejemnikov - 2. del: Oddajniki-sprejemniki za krajevno medvezalno omrežje (IEC
62228-2:2016)
Integrated circuit - EMC Evaluation of transceivers - Part 2: LIN transceivers (IEC 62228-
2:2016)
Circuits intégrés - Évaluation de la CEM des émetteurs-récepteurs - Partie 2: Emetteurs-
récepteurs LIN (IEC 62228-2:2016)
Ta slovenski standard je istoveten z: EN 62228-2:2017
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
33.100.01 Elektromagnetna združljivost Electromagnetic compatibility
na splošno in general
SIST EN 62228-2:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62228-2:2017

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SIST EN 62228-2:2017


EUROPEAN STANDARD EN 62228-2

NORME EUROPÉENNE

EUROPÄISCHE NORM
February 2017
ICS 31.200

English Version
Integrated circuits - EMC evaluation of transceivers -
Part 2: LIN transceivers
(IEC 62228-2:2016)
Circuits intégrés - Évaluation de la CEM des émetteurs- Integrierte Schaltungen - Bewertung der
récepteurs - Partie 2: Émetteurs-récepteurs LIN elektromagnetischen Verträglichkeit von Sende-
(IEC 62228-2:2016) Empfangsgeräten - Teil 2: LIN-Sende-Empfangsgeräte
(IEC 62228-2:2016)
This European Standard was approved by CENELEC on 2016-12-23. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62228-2:2017 E

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SIST EN 62228-2:2017
EN 62228-2:2017
European foreword
The text of document 47A/994/FDIS, future edition 1 of IEC 62228-2, prepared by SC 47A "Integrated
circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 62228-2:2017.

The following dates are fixed:
(dop) 2017-09-23
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2019-12-23
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 62228-2:2016 was approved by CENELEC as a European
Standard without any modification.
2

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SIST EN 62228-2:2017
EN 62228-2:2017
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu

Publication Year Title EN/HD Year

IEC 61967-1 -  Integrated circuits - Measurement of EN 61967-1 -
electromagnetic emissions,
150 kHz to 1 GHz -
Part 1: General conditions and definitions
IEC 61967-4 -  Integrated circuits - Measurement of EN 61967-4 -
electromagnetic emissions, 150 kHz to
1 GHz -
Part 4: Measurement of conducted
emissions - 1 ohm/150 ohm direct coupling
method
IEC 62132-1 -  Integrated circuits - Measurement of EN 62132-1 -
electromagnetic immunity -
Part 1: General conditions and definitions
IEC 62132-4 -  Integrated circuits - Measurement of EN 62132-4 -
electromagnetic immunity, 150 kHz to
1 GHz -
Part 4: Direct RF power injection method
IEC 62215-3 -  Integrated circuits - Measurement of EN 62215-3 -
impulse immunity - Part 3: Non-
synchronous transient injection method
ISO 7637-2 -  Road vehicles - Electrical disturbances - -
from conduction and coupling -
Part-2: Electrical transient conduction
along supply lines only
ISO 10605 -  Road vehicles - Test methods for electrical - -
disturbances from electrostatic discharge
ISO 17987-6 -  Road vehicles - Local Interconnect - -
Network (LIN) -
Part 6: Protocol conformance test
specification

3

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SIST EN 62228-2:2017

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SIST EN 62228-2:2017




IEC 62228-2

®


Edition 1.0 2016-11




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Integrated circuits – EMC evaluation of transceivers –

Part 2: LIN transceivers




Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –

Partie 2: Émetteurs-récepteurs LIN
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.200 ISBN 978-2-8322-3776-2



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62228-2:2017
– 2 – IEC 62228-2:2016 © IEC 2016
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviations . 8
3.1 Terms and definitions . 8
3.2 Abbreviations . 8
4 General . 8
5 Test and operating conditions . 9
5.1 Supply and ambient conditions. 9
5.2 Test operation modes . 10
5.3 Test configuration . 10
5.3.1 General test configuration for functional test . 10
5.3.2 General test configuration for unpowered ESD test . 11
5.3.3 Coupling ports and coupling networks for functional tests . 11
5.3.4 Coupling ports and coupling networks for unpowered ESD tests . 12
5.4 Test signals . 13
5.4.1 General . 13
5.4.2 Test signals for normal operation mode . 13
5.4.3 Test signal for wake-up from sleep mode . 14
5.5 Evaluation criteria . 14
5.5.1 General . 14
5.5.2 Evaluation criteria in functional operation modes during exposure to
disturbances . 15
5.5.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 16
5.5.4 Status classes . 17
6 Test and measurement . 17
6.1 Emission of RF disturbances . 17
6.1.1 Test method . 17
6.1.2 Test setup . 17
6.1.3 Test procedure and parameters . 18
6.2 Immunity to RF disturbances . 19
6.2.1 Test method . 19
6.2.2 Test setup . 19
6.2.3 Test procedure and parameters . 20
6.3 Immunity to impulses . 22
6.3.1 Test method . 22
6.3.2 Test setup . 23
6.3.3 Test procedure and parameters . 23
6.4 Electrostatic Discharge (ESD) . 26
6.4.1 Test method . 26
6.4.2 Test setup . 26
6.4.3 Test procedure and parameters . 28
7 Test report . 28
Annex A (normative) LIN test circuits . 29
A.1 General . 29

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SIST EN 62228-2:2017
IEC 62228-2:2016 © IEC 2016 – 3 –
A.2 LIN test circuit for standard LIN transceiver ICs for functional tests . 29
A.3 LIN test circuit for IC with embedded LIN transceiver for functional tests . 31
A.4 LIN test circuit for LIN transceiver ICs for unpowered ESD test . 32
Annex B (normative) Test circuit boards. 33
B.1 Test circuit board for functional tests . 33
B.2 ESD test . 33
Annex C (informative) Examples for test limits for LIN transceiver in automotive
application . 35
C.1 General . 35
C.2 Emission of RF disturbances . 35
C.3 Immunity to RF disturbances . 36
C.4 Immunity to impulses . 37
C.5 Electrostatic Discharge (ESD) . 37
Annex D (informative) Test of indirect ESD discharge . 38
D.1 General . 38
D.2 Test setup . 38
D.3 Typical current wave form for indirect ESD test . 39
D.4 Test procedure and parameters . 39

Figure 1 – General test configuration for tests in functional operation modes . 10
Figure 2 – General test configuration for unpowered ESD test . 11
Figure 3 – Coupling ports and networks for functional tests . 11
Figure 4 – Coupling ports and networks for unpowered ESD tests . 12
Figure 5 – Principal drawing of the maximum deviation on an I-V characteristic . 16
Figure 6 – Test setup for measurement of RF disturbances . 18
Figure 7 – Test setup for DPI tests. 19
Figure 8 – Test setup for impulse immunity tests . 23
Figure 9 – Test setup for direct ESD tests . 27
Figure A.1 – General drawing of the circuit diagram of test network for standard LIN
transceiver ICs for functional test . 30
Figure A.2 – General drawing of the circuit diagram of the test network for ICs with
embedded LIN transceiver for functional test . 32
Figure A.3 – General drawing of the circuit diagram for direct ESD tests of LIN
transceiver ICs in unpowered mode . 32
Figure B.1 – Example of IC interconnections of LIN signal . 33
Figure B.2 – Example of ESD test board for LIN transceiver ICs . 34
Figure C.1 – Example of limits for RF emission . 36
Figure C.2 – Example of limits for RF immunity for functional status class A . 36
IC
Figure C.3 – Example of limits for RF immunity for functional status class C or D . 37
IC IC
Figure D.1 – Test setup for indirect ESD tests . 38
Figure D.2 – Example of ESD current wave form for indirect ESD test at V = -8 kV . 39
ESD

Table 1 – Overview of required measurements and tests . 9
Table 2 – Supply and ambient conditions for functional operation . 10
Table 3 – Definition of coupling ports and coupling network component values for
functional tests . 12

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SIST EN 62228-2:2017
– 4 – IEC 62228-2:2016 © IEC 2016
Table 4 – Definitions of coupling ports for unpowered ESD tests . 13
Table 5 – Communication test signal TX1 . 13
Table 6 – Communication test signal TX2 . 14
Table 7 – Wake-up test signal TX3 . 14
Table 8 – Evaluation criteria for Standard LIN transceiver IC in functional operation
modes . 15
Table 9 – Evaluation criteria for ICs with embedded LIN transceiver in functional
operation modes . 16
Table 10 – Definition of functional status classes . 17
Table 11 – Parameters for emission measurements . 18
Table 12 – Settings of the RF measurement equipment . 19
Table 13 – Specifications for DPI tests . 20
Table 14 – Required DPI tests for functional status class A evaluation of standard
IC
LIN transceiver ICs . 21
Table 15 – Required DPI tests for functional status class A evaluation of ICs with
IC
embedded LIN transceiver . 22
Table 16 – Required DPI tests for functional status class C or D evaluation of
IC IC
standard LIN transceiver ICs and ICs with embedded LIN transceiver . 22
Table 17 – Specifications for impulse immunity tests . 24
Table 18 – Parameters for impulse immunity test . 24
Table 19 – Required impulse immunity tests for functional status class A evaluation
IC
of standard LIN transceiver ICs . 25
Table 20 – Required impulse immunity tests for functional status class A evaluation
IC
of ICs with embedded LIN transceiver . 25
Table 21 – Required impulse immunity tests for functional status class C or D
IC IC
evaluation of standard LIN transceiver ICs and ICs with embedded LIN transceiver . 26
Table 22 – Recommendations for direct ESD tests. 28
Table B.1 – Parameter ESD test circuit board . 34
Table C.1 – Example of limits for impulse immunity for functional status class C or
IC
D 37
IC
Table D.1 – Specifications for indirect ESD tests . 40

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SIST EN 62228-2:2017
IEC 62228-2:2016 © IEC 2016 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –

Part 2: LIN transceivers

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62228-2 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/994/FDIS 47A/998/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 62228-2:2017
– 6 – IEC 62228-2:2016 © IEC 2016
A list of all parts in the IEC 62228 series, published under the general title Integrated
circuits – EMC evaluation of transceivers, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 62228-2:2017
IEC 62228-2:2016 © IEC 2016 – 7 –
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –

Part 2: LIN transceivers



1 Scope
This part of IEC 62228 specifies test and measurement methods for EMC evaluation of LIN
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for
standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers
• the emission of RF disturbances,
• the immunity against RF disturbances,
• the immunity against impulses and
• the immunity against electrostatic discharges (ESD).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions 150 kHz to
1 GHz – Part 4: Measurement of conducted emissions – 1 Ω /150 Ω direct coupling method
IEC 62132-1, Integrated circuits – Measurement of electromagnetic immunity – Part 1:
General conditions and definitions
IEC 62132-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to
1 GHz – Part 4: Direct RF power injection method
IEC 62215-3, Integrated circuits – Measurement of impulse immunity – Part 3: Non-
synchronous transient injection method
ISO 7637-2, Road vehicles — Electrical disturbances from conduction and coupling – Part 2:
Electrical transient conduction along supply lines only
ISO 10605, Road vehicles – Test methods for electrical disturbances from electrostatic
discharge
1
ISO 17987-6.2 , Road vehicles – Local interconnect network (LIN) – Part 6: Protocol
conformance test specification
___________
1
To be published.

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SIST EN 62228-2:2017
– 8 – IEC 62228-2:2016 © IEC 2016
3 Terms, definitions and abbreviations
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 61967-1,
IEC 62132-1, as well as the following apply.
3.1.1
global pin
pin that carries a signal or power, which enters or leaves the application board without any
active component in between
3.1.2
standard LIN transceiver IC
stand alone LIN transceiver according to ISO 17987 or IC with integrated LIN transceiver cell
with access to LIN RxD and TxD signal
3.1.3
IC with embedded LIN transceiver
IC with integrated LIN transceiver cell and LIN protocol handler but without access to LIN RxD
or TxD signal
3.2 Abbreviations
DUT Device under test
DPI Direct RF power injection
Inhibit
INH
LIN Local interconnect network
PCB Printed circuit board
RxD Receive data
SBC System base chip
TxD Transmit data

4 General
The intention of this document is to evaluate the EMC performance of LIN transceiver ICs
under application conditions in a minimal network. LIN transceiver ICs are in general available
in two types as standard LIN transceiver IC and as IC with embedded LIN transceiver.
The evaluation of the EMC characteristics of LIN transceivers shall be performed in functional
operation modes under network condition for RF emission, RF immunity and impulse immunity
tests and on a single unpowered transceiver IC for electrostatic discharge tests.
The aim of these tests is to determine the EMC performance on dedicated global pins of the
LIN
...