oSIST prEN ISO 11553-2:2017

Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO/DIS 11553-2:2016)

2018-11-13: WI abandoned due to cancellation of equivalent ISO WI (ISO notification to dataservice on 2018-11-12).

Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 2: Sicherheitsanforderungen an handgeführte Laserbearbeitungsgeräte (ISO/DIS 11553-2:2016)

Sécurité des machines - Machines à laser - Partie 2: Exigences de sécurité pour dispositifs de traitement laser portatifs (ISO/DIS 11553-2:2016)

Varnost strojev - Laserski obdelovalni stroji - 2. del: Varnostne zahteve za ročne laserske obdelovalne naprave (ISO/DIS 11553-2:2016)

General Information

• Status: Not Published
• Public Enquiry End Date: 19-Feb-2017
• ICS: 13.110 - Safety of machinery
• ICS: 31.260 - Optoelectronics. Laser equipment
• Technical Committee: VAZ - Healthcare
• Current Stage: 98 - Abandoned project (Adopted Project)
• Start Date: 13-Dec-2018
• Due Date: 18-Dec-2018
• Completion Date: 13-Dec-2018
• Directive: 2006/42/EC - Directive 2006/42/EC of the European Parliament and of the Council of 17 May 2006 on machinery, and amending Directive 95/16/EC (recast)
• Mandate: M/396 - Mandate to CEN and Cenelec for standardisation in the field of machinery
• Ref Project: prEN ISO 11553-2 - Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO/DIS 11553-2:2016)

Relations

• Revised: SIST EN ISO 11553-2:2009 - Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO 11553-2:2007)
• Effective Date: 18-Jan-2023
• Revised: SIST EN ISO 11553-2:2009 - Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO 11553-2:2007)
• Effective Date: 01-Feb-2017

Overview

prEN ISO 11553-2 (ISO/DIS 11553-2:2016) addresses the safety of machinery - laser processing machines, specifically safety requirements for hand‑held laser processing devices. Prepared as a Draft International Standard, it is a technical revision of ISO 11553‑2:2007 and focuses on identifying hazards from hand‑held laser devices and defining safety measures, verification and user information to prevent personal injury. Note: the CEN working item was abandoned in 2018 following cancellation of the equivalent ISO working item; the document circulated as an ISO DIS for comment and approval.

Key Topics and Requirements

The standard lays out a structured safety approach and technical requirements, including:

• Hazard identification and risk assessment for hand‑held laser processing, including inherent hazards and those induced by external effects (interferences).
• Specific hazard conditions such as working in confined spaces, working at heights and environmental effects.
• Design and protective measures, for example:
  • protective enclosures and provisions for isolation of the laser beam
  • authorizing control devices, emission warning devices and alignment lasers
  • safety devices for scanning beams and emergency stop controls
  • control means and safety‑related control circuits
  • protections against hazards generated by processed materials and effluents (disposal units, filtration, ventilation)
• Verification and classification, including verification of safety measures, safety‑related control circuit classification and laser classification in line with IEC/ISO laser product rules.
• Information for use and labelling requirements to ensure operators receive necessary instructions, warnings and PPE guidance.
• Annexes providing risk assessment examples, types of hand‑held machines, design examples for technical safety measures (Annex C), and PPE selection guidance (Annex D).

Applications and Who Uses It

This standard is applicable to manufacturers, integrators and users of hand‑held laser processing devices used for cutting, welding, marking, surface treatment and related tasks. Primary audiences:

• Machine builders and OEMs designing hand‑held laser tools
• Safety engineers and compliance officers conducting risk assessments
• Testing and certification laboratories assessing conformity to laser safety norms
• Occupational safety professionals, maintenance teams and PPE suppliers
• Regulatory bodies referencing safe‑design practices for laser equipment

Related Standards

Key referenced standards and normative documents include:

• ISO 11553‑1 (General safety requirements)
• ISO 11553‑3 (Noise measurement and reduction)
• ISO 12100 (Risk assessment and reduction)
• IEC 60825‑1 / IEC/TR 60825‑14 / IEC 60825‑4 (Laser product classification and guards)
• ISO 13849‑1, ISO 13850, ISO 14118, ISO 14119 (control systems, E‑stop, interlocks)

This document is useful for ensuring that laser safety, risk mitigation and operator protection are integrated into the design, testing and use of portable laser processing equipment.

Standards Content (Sample)

SLOVENSKI STANDARD
01-februar-2017
9DUQRVWVWURMHY/DVHUVNLREGHORYDOQLVWURMLGHO9DUQRVWQH]DKWHYH]DURþQH
ODVHUVNHREGHORYDOQHQDSUDYH,62',6
Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-
held laser processing devices (ISO/DIS 11553-2:2016)
Sicherheit von Maschinen - Laserbearbeitungsmaschinen - Teil 2:
Sicherheitsanforderungen an handgeführte Laserbearbeitungsgeräte (ISO/DIS 11553-
2:2016)
Sécurité des machines - Machines à laser - Partie 2: Exigences de sécurité pour
dispositifs de traitement laser portatifs (ISO/DIS 11553-2:2016)
Ta slovenski standard je istoveten z: prEN ISO 11553-2
ICS:
13.110 Varnost strojev Safety of machinery
31.260 Optoelektronika, laserska Optoelectronics. Laser
oprema equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

DRAFT INTERNATIONAL STANDARD
ISO DIS 11553-2
ISO/TC 172/SC 9 Secretariat: DIN
Voting begins on: Voting terminates on:
2016-12-06 2017-02-27
Safety of machinery — Laser processing machines —
Part 2:
Safety requirements for hand-held laser processing devices
Sécurité des machines — Machines à laser —
Partie 2: Exigences de sécurité pour dispositifs de traitement laser portatifs
ICS: 13.110; 31.260
Member bodies are requested to consult relevant national interests in IEC/TC
76 before casting their ballot to the e-Balloting application.
THIS DOCUMENT IS A DRAFT CIRCULATED
This document is circulated as received from the committee secretariat.
FOR COMMENT AND APPROVAL. IT IS
THEREFORE SUBJECT TO CHANGE AND MAY
NOT BE REFERRED TO AS AN INTERNATIONAL
STANDARD UNTIL PUBLISHED AS SUCH.
IN ADDITION TO THEIR EVALUATION AS
ISO/CEN PARALLEL PROCESSING
BEING ACCEPTABLE FOR INDUSTRIAL,
TECHNOLOGICAL, COMMERCIAL AND
USER PURPOSES, DRAFT INTERNATIONAL
STANDARDS MAY ON OCCASION HAVE TO
BE CONSIDERED IN THE LIGHT OF THEIR
POTENTIAL TO BECOME STANDARDS TO
WHICH REFERENCE MAY BE MADE IN
Reference number
NATIONAL REGULATIONS.
ISO DIS 11553-2:2016(E)
RECIPIENTS OF THIS DRAFT ARE INVITED
TO SUBMIT, WITH THEIR COMMENTS,
NOTIFICATION OF ANY RELEVANT PATENT
RIGHTS OF WHICH THEY ARE AWARE AND TO
©
PROVIDE SUPPORTING DOCUMENTATION. ISO 2016

ISO DIS 11553-2:2016(E)
© ISO 2016, Published in Switzerland
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized otherwise in any form
or by any means, electronic or mechanical, including photocopying, or posting on the internet or an intranet, without prior
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ii © ISO 2016 – All rights reserved

ISO DIS 11553-2:2016(E)
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 2
4 Hazards . 2
4.1 Inherent hazards . 2
4.2 Hazards induced by external effects (interferences) . 3
4.3 Further hazards related to the use of hand-held laser processing devices . 3
4.3.1 Confined spaces . 3
4.3.2 Working at heights . 4
4.3.3 Environmental effects . 4
5 Safety requirements and measures . 4
5.1 General requirements . 4
5.2 Risk assessment . 5
5.3 Implementation of corrective measures . 5
5.3.1 General requirements . 5
5.3.2 Protection against laser radiation hazards . 5
5.4 Design requirements . 6
5.4.1 Design . 6
5.4.2 Protective enclosure . 7
5.4.3 Authorizing control device . 7
5.4.4 Emission warning device . 7
5.4.5 Alignment laser . 7
5.4.6 Safety devices for scanning laser radiation . 7
5.4.7 Emergency stop control . 7
5.4.8 Control means and circuits . 8
5.4.9 Provisions for isolation of the laser beam .10
5.4.10 Protection against hazards generated by materials and substances .11
6 Verification of safety requirements and measures .11
6.1 General conformance.11
6.2 Classification of safety related control circuit .12
6.3 Laser classification .12
7 Information for use .12
7.1 Additional required information .12
7.2 Further information that should be included.13
8 Labelling .14
Annex A (informative) Risk assessment examples .15
Annex B (informative) Types of hand-held laser processing machines .17
Annex C (informative) Examples for the design of technical safety measures for hand-held
laser processing devices .19
Annex D (informative) Recommendations for the selection of personal protective clothing
for use with HLD .22
Annex ZA (informative) Relationship between this European Standard and the essential
requirements of Directive 2006/42/EC aimed to be covered .25
Bibliography .26
ISO DIS 11553-2:2016(E)
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www.iso.org/directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of
any patent rights identified during the development of the document will be in the Introduction and/or
on the ISO list of patent declarations received (see www.iso.org/patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation on the meaning of ISO specific terms and expressions related to conformity assessment,
as well as information about ISO’s adherence to the World Trade Organization (WTO) principles in the
Technical Barriers to Trade (TBT) see the following URL: www.iso.org/iso/foreword.html.
ISO 11553-2 was prepared by Technical Committee ISO/TC 172, Optics and photonics, Subcommittee
SC 9, Electro-optical systems in collaboration with IEC/TC 76, Optical radiation safety and laser equipment.
This Draft International Standard 11553-2 is a revision of ISO 11553-2:2007 and includes the following
changes:
— The document has been technically revised.
— Annex C “Examples for the design of technical safety measures for hand-held laser processing
devices “ and Annex D “Recommendations for the selection of personal protective clothing for use
with HLD “ were added.
— An Annex ZA was added.
ISO 11553 consists of the following parts, under the general title Safety of machinery — Laser processing
machines:
— Part 1: General safety requirements
— Part 2: Safety requirements for hand-held laser processing devices
— Part 3: Noise reduction and noise measurement methods for laser processing machines and hand-held
processing devices and associated auxiliary equipment (accuracy grade 2)
iv © ISO 2016 – All rights reserved

ISO DIS 11553-2:2016(E)
Introduction
This document is a type C standard as stated in ISO 12100:2010.
The machinery concerned and the extent to which hazards, hazardous situations and events are covered
are indicated in the scope of this document. When provisions of this type C standard are different from
those which are stated in type A or B standards, the provisions of this type C standard take precedence
over the provisions of the other standards, for machines that have been designed and built according to
the provisions of this type C standard.
It is applicable to machines using laser radiation to process materials. The purpose of this part of
ISO 11553 is to prevent injuries to persons:
— by listing potential hazards generated by lasers;
— by specifying safety measures and verifications necessary for reducing the risk caused by specific
hazardous conditions;
— by providing references to pertinent standards;
— by specifying the information which is to be supplied to the users so that they can establish proper
procedures and precautions.
DRAFT INTERNATIONAL STANDARD ISO DIS 11553-2:2016(E)
Safety of machinery — Laser processing machines —
Part 2:
Safety requirements for hand-held laser processing devices
1 Scope
This part of ISO 11553 specifies the requirements for laser processing devices, as defined in ISO 11553-1,
which are hand-held or hand-operated.
The purpose of this part of ISO 11553 is to draw attention to the particular hazards related to hand-
held and hand-operated laser processing devices and to prevent personal injury. This includes both the
areas of hazard analysis and risk assessment as well as protective measures.
Requirements dealing with noise as a hazard are covered by ISO 11553-3.
This part of ISO 11553 does not apply to laser products or equipment manufactured solely or expressly
for applications which are excluded from the scope of ISO 11553-1.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments) applies.
ISO 3864-1, Graphical symbols — Safety colours and safety signs — Part 1: Design principles for safety
signs and safety markings
ISO 3864-2, Graphical symbols — Safety colours and safety signs — Part 2: Design principles for product
safety labels
ISO 3864-3, Graphical symbols — Safety colours and safety signs — Part 3: Design principles for graphical
symbols for use in safety signs
ISO 3864-4, Graphical symbols — Safety colours and safety signs — Part 4: Colorimetric and photometric
properties of safety sign materials
ISO 11145, Optics and photonics — Lasers and laser-related equipment — Vocabulary and symbols
ISO 11252, Lasers and laser-related equipment — Laser device — Minimum requirements for documentation
ISO 11553-1, Safety of machinery — Laser processing machines — Part 1: General safety requirements
ISO 12100, Safety of machinery — General principles for design — Risk assessment and risk reduction
ISO 13849-1, Safety of machinery — Safety-related parts of control systems — Part 1: General principles
for design
ISO 13850, Safety of machinery — Emergency stop function — Principles for design
ISO 14118, Safety of machinery — Prevention of unexpected start-up
ISO 14119, Safety of machinery — Interlocking devices associated with guards — Principles for design and
selection
ISO 13851, Safety of machinery — Two-hand control devices — Functional aspects and design principles
ISO DIS 11553-2:2016(E)
IEC 60204-1, Safety of machinery — Electrical equipment of machines — Part 1: General requirements
IEC 60825-1:2014, Safety of laser products — Part 1: Equipment classification and requirements
IEC/TR 60825-14, Safety of laser products — Part 14: A user’s guide
IEC 60825-4, Safety of laser products — Part 4: Laser guards
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 11145, ISO 11553-1.
ISO 12100, IEC 60825-4 and the following apply. ISO and IEC maintain terminological databases for use
in standardization at the following addresses:
— IEC Electropedia: available at http://www.electropedia.org/
— ISO Online browsing platform: available at http://www.iso.org/obp
3.1
confined spaces
working areas surrounded on all sides, or for the most part, by solid walls where they, on account of
their confinement or containment of materials, preparation or equipment, augment or can augment
particular hazards that considerably exceed the hazard potential normally prevailing at workplaces
3.2
disposal unit
equipment that captures and removes effluents and by-products during laser material processing by
passing these on for filtration (e.g. capture devices, pipes, filtration systems, ventilation systems)
3.3
hand-held laser processing device
device in which a laser provides sufficient energy/power to melt, evaporate or cause a phase transition
in a part of the workpiece and where the laser output or workpiece to be processed is guided manually
or hand-held during the laser process
3.4
supply unit
all devices that provide the process energies and operating material supply direct to the point of action
and are absolutely necessary for the operation of the hand-held laser processing device (e.g. cooling
system, power and gas supply)
4 Hazards
4.1 Inherent hazards
The following hazards (see ISO 12100) may be generated by a laser-processing device:
a) mechanical hazards,
b) electrical hazards,
c) thermal hazards,
d) vibration hazards,
e) radiation hazards; for example:
1) hazards generated by direct or reflected laser beams, (also take into account that radiation can
occur on the back of the workpiece, e.g. when cutting or due to transparency of the workpiece),
2 © ISO 2016 – All rights reserved

ISO DIS 11553-2:2016(E)
2) hazards generated by ionizing radiation,
3) hazards generated by collateral (UV, microwave, etc.) radiation produced, for example, by flash
lamps, discharge tubes or RF-power sources,
4) hazards generated by secondary radiation re-emitted by targets due to beam effects (the
wavelength of the re-emitted radiation may be different from that of the beam).
f) hazards generated by materials and substances; for example:
1) hazards due to products which are used in the laser-processing device (e.g. laser gases, laser
dyes, solvents),
2) hazards resulting from interaction between the beam and the material (e.g. fumes, particles,
vapours, debris), fire or explosion,
3) hazards from associated gases used to assist laser target interactions; these hazards include
explosion, fire, toxic effects and oxygen depletion,
4) hazards due to the leakage of liquids (e.g. coolant).
g) hazards generated by neglecting ergonomic principles in the design of the laser-processing device.
4.2 Hazards induced by external effects (interferences)
Power conditions and the environment in which the laser-processing device operates can cause the
hand held laser processing device to malfunction thus giving rise to hazardous conditions and/or
making intervention necessary within hazard area.
Additional environmental interferences include
a) Temperature,
b) Humidity,
c) external shock/vibration,
d) vapours, dust or gases from the environment,
e) electromagnetic interference,
f) lightning strike,
g) source voltage interruption/fluctuation,
h) insufficient hardware/software compatibility and integrity,
i) hand-held laser processing devices capable of being separated from the radiation source (example
given in Annex B, Figures B.1),
j) non-observance of interface specification (including power limits, control signals).
4.3 Further hazards related to the use of hand-held laser processing devices
4.3.1 Confined spaces
Hand-held laser processing devices can be used in confined spaces. Additional hazards may be created
including
a) concentration of harmful substances in the air,
b) enrichment of process gases (nitrogen, argon, helium, oxygen) in the air,
ISO DIS 11553-2:2016(E)
c) oxygen depletion,
d) electrical current,
e) increased radiation hazard through direct as well as directly or diffusely reflected laser radiation,
f) increased tripping and impact (mechanical shock) hazard.
4.3.2 Working at heights
Hand-held laser processing devices can be used at heights above the ground or other load bearing
surfaces. Hazards are
a) falling objects,
b) fall of the user.
4.3.3 Environmental effects
Hazards that can directly affect the user due to the operating environmental conditions. This applies in
particular when hand-held laser processing machines are used outdoors.
This includes the following environmental effects due to
a) temperature (cold, heat),
b) humidity (rain, fog, hail),
c) mechanical effects (vibration, wind pressure),
d) electromagnetic effects (lightning strike),
e) visibility (sunlight, lighting).
5 Safety requirements and measures
5.1 General requirements
Machinery shall comply, as appropriate, with ISO 12100 for hazards that are not covered by this part of
ISO 11553.
Manufacturers shall ensure the safety of hand-held laser processing devices by
a) hazard identification and risk assessment,
b) implementation of safety measures,
c) verification of the implemented safety measures,
d) provision of appropriate information for the user.
Based on the hazard identification (see 5.2), appropriate safety measures shall be incorporated into the
hand-held laser processing device by design and manufacture.
The following requirements shall be satisfied:
e) each manufacturer shall comply with the safety requirements and measures stipulated in this clause,
f) the manufacturer of a hand-held laser processing device is responsible for compliance of
the complete hand-held laser processing device with the requirements, including associated
components (e.g. handling unit, laser assembly).
4 © ISO 2016 – All rights reserved

ISO DIS 11553-2:2016(E)
NOTE The information given in Annexes A and B should be taken into account.
5.2 Risk assessment
A risk assessment shall be performed:
a) for all phases of hand-held laser processing device ”life” (as applicable); for examples see ISO 12100,
b) after each modification of the hand-held laser processing device by the person or organization
responsible for the modification,
c) for each use/operation not included by the intended use.
A risk assessment involves a hazard identification, which includes but is not limited to:
d) hazards listed in 4.1 and 4.3,
e) danger zones, particularly those associated with
1) the laser system,
2) the laser beam path/propagation, beam delivery system,
3) the process zone, and
4) interferences listed in 4.2.
The results of the risk assessment shall be duly documented.
5.3 Implementation of corrective measures
5.3.1 General requirements
Manufacturers shall ensure the safety of hand-held laser processing devices by
a) hazard analysis and risk assessment,
b) integration of safety measures,
c) verification of safety measures, and
d) provision of appropriate information for the user.
5.3.2 Protection against laser radiation hazards
5.3.2.1 General
The possibility of people being exposed to levels of laser radiation exceeding the Maximum Permissible
Exposure (MPE) limits for an exposure time of 3×10 s, as defined in standards IEC 60825-1 and
IEC/TR 60825-14, shall be eliminated during operation.
To satisfy this, the following requirements shall be met:
a) Risk assessment shall be performed,
b) The hand held laser processing device shall only be operated by trained and authorized persons.
Unauthorized human access to a danger zone should be prevented by engineering controls as
specified in IEC 60825-1.
ISO DIS 11553-2:2016(E)
c) If access cannot be prevented, exposure above the ocular MPE shall be eliminated by use of
engineering or administrative controls, including Personal Protective Equipment, satisfying the
following requirements:
1) The design of protective devices, such as shutters, guards, beam dissipation devices, trip
devices and deterring/impeding devices shall meet the requirements specified in IEC 60825-1.
2) In cases of ambiguity or difference of interpretation between ISO 12100 and IEC 60825-1, the
first two sentences of 5.3.2.1.1, 5.3.2.1.2 and 5.3.2.1.3 of ISO 11553-1 shall be definitive.
NOTE 1 The same protective device may be used to provide simultaneous protection against more than
one hazard.
NOTE 2 Exposure limits for the eye and the skin of employees in the workplace and the general public are in
many countries specified in national laws. These legally-binding national exposure limits might differ from the
MPEs used is this standard.
5.3.2.2 Protection during operation and maintenance
The principal danger zone is usually the process zone, but the danger zone shall be defined as a result of
the risk assessment.
In the danger zone, human exposure shall be limited during operation and maintenance to levels of
laser radiation not exceeding the Maximum Permissible Exposure (MPE) limits for an exposure time of
3×10 s by use of engineering or administrative controls (for example local protection using a protective
enclosure), or the use of Personal Protective Equipment (for example laser protective eyewear and
clothing).
5.3.2.3 Protection during service
During service procedures, human access to laser radiation exceeding the Accessible Emission limit
(AEL) for Class 1 is sometimes unavoidable. During servicing it shall be ensured that only authorized
persons are allowed access to zones exposed to levels of laser radiation that exceed the AEL values
for Class 1. Hand-held laser-processing devices shall therefore be designed and appropriate safety
measures provided, with respect to the following four situations listed in order of preference.
a) Servicing takes place outside danger zones.
b) Servicing takes place in danger zones to which access is controlled in the same manner as during
production (e.g. interlocked cover).
c) Servicing takes place in a danger zone (e.g. with open guards that are normally closed during
production) but accessible laser radiation does not exceed the AEL for Class 1.
d) Servicing takes place in danger zones, e.g. because opening of guards (normally closed during
production) is necessary. In this case, accessible laser radiation exceeds the AEL for Class 1.
The manufacturer shall indicate the class of accessible laser radiation and recommended safety
procedures for each of these situations (as applicable).
When servicing hand-held laser processing devices, the laser device should be switched off. For activities
(e.g. adjustment), where this is not possible, a nominal ocular hazard area should be established.
5.4 Design requirements
5.4.1 Design
The design of the hand-held laser processing devices shall take place according to ergonomic principles.
6 © ISO 2016 – All rights reserved

ISO DIS 11553-2:2016(E)
5.4.2 Protective enclosure
The technical design requirements for the protective enclosure shall be determined on the basis of risk
assessment.
5.4.3 Authorizing control device
For hand-held laser processing devices connected to an external laser device via a beam delivery
system, the prevention of unauthorized operation (e.g. by a key-operated switch) shall be provided by
engineering measures at the hand-held laser processing device or in the immediate vicinity of the hand-
held laser processing device.
5.4.4 Emission warning device
For every hand-held laser processing devices, the following radiation warning devices shall be provided
in the field of vision of the operator:
a) visible laser ready indicator (e.g. LED); and
b) with an optical and/or acoustic indication device, which indicates laser radiation emissions above
Class 2 (e.g. LED).
The warning devices shall also be clearly visible when wearing personal eye protection (laser eye-
protectors).
5.4.5 Alignment laser
The beam power of the alignment laser (if available) shall not exceed the AEL values for Class 2 at the
beam exit. The beam cross-section of the alignment laser shall have a defined position with respect to
the processing laser.
5.4.6 Safety devices for scanning laser radiation
The requirements for safety devices for scanning laser radiation shall be determined by risk assessment.
Areas in which laser radiation can exceed the appropriate ocular MPE shall be designated nominal
ocular hazard areas.
For hand-held laser processing devices where the laser passes freely between the beam exit aperture
and target and is not enclosed, the beam propagation should be restricted with respect to the degrees of
freedom (or the solid angle traversed by the laser beam) to the extent necessary for normal operation.
This may be controlled by the laser system software or hardware. The degrees of freedom should
also be restricted by screens (for example shields in the vicinity of the beam exit or laser guards) that
restrict beam propagation in specific spatial directions.
A minimum performance is that the laser shutter shall close if the intended beam scanning angle is to
be exceeded.
NOTE Exposure limits for the eye and the skin of employees in the workplace and the general public are in
many countries specified in national laws. These legally-binding national exposure limits might differ from the
MPEs used is this standard.
5.4.7 Emergency stop control
An emergency stop control is required. The emergency stop device shall comply with IEC 60204-1 and
ISO 13850.
The emergency stop control shall
a) terminate laser emission; and
ISO DIS 11553-2:2016(E)
b) deactivate the hand-held laser processing device. The stop category described in IEC 60204-1 and
ISO 13850 shall be determined by the risk assessment.
The Emergency Stop control shall be in the form of a red pushbutton with yellow background. The
actuator shall be quickly and easily accessible and in the immediate vicinity of the user of the hand-held
laser processing device.
In the case of hand-held laser processing devices connected to an external laser device via a beam
delivery system and the emergency stop, unexpected start-up shall be prevented by compliance with
ISO 14118.
5.4.8 Control means and circuits
5.4.8.1 General
Control means and circuits shall comply with IEC 60204-1.
NOTE 1 Control means should take into account all environmental aspects of use and potential single fault
conditions.
The design of the safety-related control systems shall comply with ISO 13849-1 and IEC 62061.
NOTE 2 Typically, this risk assessment for damage to sight leads to a required Performance Level PL = d or in
r
a Savety Integrity Level SIL = 2.
5.4.8.2 Start/stop controls
If a laser device is used for several hand-held laser processing devices capable of operating separately
to each other, the start/stop control shall be separate for each hand-held laser processing device.
a) Start control: monitored start-up of the hand-held laser processing device shall be ensured.
b) Stop control: in the case of partly mechanized hand-held laser processing devices for supporting
manual guidance or positioning, the stop control shall stop the motorized drive for feed motions
and/or manipulation of the beam propagation and shaping system (beam delivery) and either
isolate the laser beam or deactivate the laser beam generation.
c) Laser stop control: the laser stop control shall terminate the laser beam emission.
d) Device for control feed of motions and laser beam emission: hand-held laser processing device shall
be provided with a device for monitoring feed motions (in the case of partly mechanized hand-held
laser processing devices for supporting manual guidance or positioning) and laser beam emission,
designed for user operation within the hazardous zone.
The following requirements apply to this device:
— The device shall be a “hold to run” control in conformity to ISO 12100 and ISO 13849-1.
— The device shall be provided with a control device with automatic reset facility designed to maintain
operational laser radiation only as long as it is activated. When deactivated, it shall automatically
reduce the accessible laser radiation level below the AEL values for Class 2.
If the hand-held laser processing device is controlled with this control device, all feed motions and laser
beam emissions shall be controllable solely from this device.
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ISO DIS 11553-2:2016(E)
5.4.8.3 Control and operating devices
For hand-held laser processing devices connected to an external laser device via a beam delivery system
and located more than two metres away from the laser device and/or laser devices that are not quickly
and easily accessible to the user;
a) All the control and operating devices shall be integrated into the hand-held laser processing device, or
b) the essential control and operating devices shall be integrated into the hand-held laser processing
devices, or
c) the control and operating devices shall also be placed in the immediate vicinity of the hand-held
laser processing device or user (e.g. in a unit attached to the body of the user).
The minimum requirements relating to the essential control elements to be integrated shall be:
— control of beam emission (for example, shutter operation – open/close), see the requirements for
5.4.8.2;
— Emergency Stop device.
All other controls not safety related, e.g. parameter settings, etc., are not subject to the requirements of
5.4.8.3.
NOTE For occupational safety reasons, two-hand control devices should preferably be used (according
to ISO 13851) if the beam propagation area can be accessed with one hand during normal use. The use of foot
switches is recommended only in exceptional cases and these should be protected against accidental activation.
5.4.8.4 Interfaces/supply
5.4.8.4.1 General
The complete supply of the hand-held laser processing device (power, gas, water, beam delivery unit)
shall be of a construction to comply with the requirements for normal use and reasonably foreseeable
misuse of the hand-held laser processing device, e.g.:
a) resistance to mechanical loads,
b) resistance to thermal loads,
c) resistance to dust and humidity,
d) resistance to laser radiation,
e) other reasonably foreseeable hazards.
5.4.8.4.2 Beam delivery system
For hand-held laser processing devices connected to an external laser device via a beam delivery
system, the interface between the hand-held laser processing device and the beam delivery system is
subjected to arduous operating conditions. The interface shall be designed so that the beam delivery
system and hand-held laser processing device are compatible with respect to:
a) optical elements;
b) mechanical elements.
All beam delivery systems shall require a tool for disconnection or be interlocked to prevent access to
hazardous laser radiation. The laser shall be shut off prior to laser radiation emission (in the area of the
interface). Appropriate engineering measures shall ensure that no laser radiation is emitted from the
beam delivery system (e.g. fibre monitoring A fibre control shall be designed according to ISO 13849-1).
ISO DIS 11553-2:2016(E)
5.4.8.4.3 Power supply/electrical connections
The electrical equipment shall be in accordance with IEC 60204-1.
5.4.8.4.4 Gas supply
If the hand-held laser processing device has a gas supply (e.g. for process gases), this shall be
appropriately designed to prevent endangering persons throughout its intended life by sound
engineering practices.
5.4.8.4.5 Supply with liquid media
If the hand-held laser processing device is supplied with liquid media (e.g. for cooling), hazards through
liquid media (operational interruptions, slipping hazard in the working area) can be prevented by
appropriate design measures.
5.4.8.5 Interlocks and guard control
When guards (in accordance with ISO 12100 and ISO 14119) are opened or displaced, or safety
interlocks are defeated, automatic operation of the laser processing device shall be impossible.
If the design of the laser processing device requires occasional procedures to be carried out with
one or more guards open (normally closed during production) and with power supplied to the hand-
held processing device actuators, then an operating mode shall be provided to make overriding of the
guard(s) possible.
The selection of this operating mode shall
a) be by means of a lockable mode selector (for example, using key-lock, password protection or RFID
techniques),
b) automatically isolate the laser beam,
c) prevent automatic operation of the laser processing device.
When malfunction of password protection or RFID control circuit causes hazardous situation, the
control circuit shall comply with ISO 13849-1 or IEC 62061.
Discrete, deliberate, interlock override mechanisms on removable access panels with safety interlocks
(defeatable safety interlocks) shall meet the requirements of IEC 60825-1 for such override mechanisms.
This applies to hand-held laser processing device and/or in conjunction with the laser assembly.
Interlocking systems shall comply with the requirements of ISO 14119.
The operation mode selected shall be clearly indicated. After the interlock override mode has been
selected, it shall be possible to override the beam isolation (i.e. “open” the beam stop) for service
procedures.
5.4.9 Provisions for isolation of the laser beam
Isolation of the laser beam shall be achieved by blocking and/or deflecting the laser beam or by the
safe removal of electrical power from the laser to prevent laser radiation from entering the beam
delivery system.
Beam isolation shall be alternatively accomplished using:
a) a fail-safe laser beam stop (shutter) located inside or immediately outside the laser. A position
indicator shall show when the beam stop is in the closed position (i.e. preventing the beam from
proceeding); or
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ISO DIS 11553-2:2016(E)
b) a fail-safe deflector located inside or immediately outside the laser. A position indicator shall show,
when the beam is deflected in the dump (preventing the beam from proceeding); or
c) an electrical switch that terminates the emission of laser radiation thus preventing human access
to laser radiation in excess of the AEL for Class 1M or Class 2M. The switch shall be considered
part of the safety-related control system and following a suitable risk assessment shall comply with
ISO 13849-1 or IEC 62061. An indicator shall show when the laser radiation has been terminated.
Suitable easily accessible means shall be provided for locking the laser beam stop or isolator in the
closed or OFF position. A key-control shall be permitted for this purpose.
Additional beam stops or isolation devices may be provided by the laser processing device manufacturer,
for example in the following situations:
d) when there are maintenance/cleaning areas present along the beam path (beam delivery system),
e) when one laser device supplies more than one beam path and there is a need for human intervention
in one path when the beam is following one of the other paths.
5.4.10 Protection against hazards generated by materials and substances
The manufacturer shall ensure either by engineering measures or by technical measures that harmful
gaseous and particulate substances generated during laser processing are removed from the working
area and passed to an air cleaning system and disposal unit. The design of the disposal unit shall be
determined by the risk assessment.
NOTE 1 Hazardous substances should be captured near the origin of generation.
The manufacturer shall provide priority for suitable engineering measures for protection against
these hazards (see Clause 4). If the hazard is unable to be excluded by engineering measures, the
manufacturer shall provide the customer/user with information relating to the hazards and threshold
limits for the maximum exposure (or exposure at the workplace) and, if necessary, information to allow
the selection of appropriate personal protective equipment.
NOTE 2 See also Annex A and Bibliography of ISO 11553-1.
Attention shall be given to the hazards from associated gases (e.g. oxygen) used to assist laser/workpiece
interactions and from any fumes that are produced. Related hazards may include explosion, fire, toxic
effects, oxygen excess and oxygen depletion.
NOTE 3 Additional information is given in Annex B of ISO 11553-1.
6 Verification of safety requirements and measures
6.1 General conformance
General conformance with the requirements of this International Standard, particularly those clauses
relating to the presence and positioning of guards and control devices, shall be confirmed by visual
inspection.
Correct functioning of control devices for each product unit shall be verified according to functional
tests specified by the manufacturer. System reaction time for the laser stop shall be verified.
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