SIST EN 62047-21:2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

EN IEC 62047-21 specifies the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 μm.

/

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21: Méthode d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince

L'IEC 62047-21:2014 spécifie la détermination du coefficient de Poisson à partir des résultats obtenus par l'application d'essais de charges uniaxiales et biaxiales aux matériaux pour systèmes microélectromécaniques (MEMS, Micro-Electrical-Mechanical Systems) à couche mince dont les longueurs et les largeurs sont inférieures à 10 mm et les épaisseurs sont inférieures à 10 µm.

Polprevodniški elementi - Mikroelektromehanski elementi - 21. del: Preskusne metode za Poissonovo razmerje tankoplastnih materialov MEMS (IEC 62047-21:2014)

Standard EN IEC 62047-21 določa ugotavljanje Poissonovega razmerja na podlagi preskusnih rezultatov, pridobljenih z uporabo enoosnih in dvoosnih obremenitev pri tankoplastnih materialih mikroelektromehanskih sistemov (MEMS) z dolžinami in širinami pod 10 mm ter debelinami pod 10 μm.

General Information

• Status: Published
• Publication Date: 12-Oct-2014
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 09-Oct-2014
• Due Date: 14-Dec-2014
• Completion Date: 13-Oct-2014
• Ref Project: EN 62047-21:2014 - Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62047-21:2014
01-november-2014
Polprevodniški elementi - Mikroelektromehanski elementi - 21. del: Preskusne
metode za Poissonovo razmerje tankoplastnih materialov MEMS (IEC 62047-
21:2014)
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for
Poisson's ratio of thin film MEMS materials
/
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 21: Méthode
d'essai relative au coefficient de Poisson des matériaux MEMS en couche mince
Ta slovenski standard je istoveten z: EN 62047-21:2014
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-21:2014 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 62047-21:2014

---------------------- Page: 2 ----------------------

SIST EN 62047-21:2014


EUROPEAN STANDARD EN 62047-21

NORME EUROPÉENNE

EUROPÄISCHE NORM
September 2014
ICS 31.080.99

English Version
Semiconductor devices - Micro-electromechanical devices -
Part 21: Test method for Poisson's ratio of thin film MEMS
materials
(IEC 62047-21:2014)
Dispositifs à semiconducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Mikrosystemtechnik -
Partie 21: Méthode d'essai relative au coefficient de Teil 21: Prüfverfahren zur Querkontraktionszahl von
Poisson des matériaux MEMS en couche mince Dünnschichtwerkstoffen der Mikrosystemtechnik
(CEI 62047-21:2014) (IEC 62047-21:2014)
This European Standard was approved by CENELEC on 2014-07-24. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2014 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62047-21:2014 E

---------------------- Page: 3 ----------------------

SIST EN 62047-21:2014
EN 62047-21:2014 - 2 -
Foreword
The text of document 47F/185/FDIS, future edition 1 of IEC 62047-21, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-21:2014.

The following dates are fixed:
(dop) 2015-04-24
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2017-07-24
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.

Endorsement notice
The text of the International Standard IEC 62047-21:2014 was approved by CENELEC as a European
Standard without any modification.

---------------------- Page: 4 ----------------------

SIST EN 62047-21:2014
- 3 - EN 62047-21:2014
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu

Publication Year Title EN/HD Year

2011
IEC 62047-8 2011 Semiconductor devices - Micro- EN 62047-8
electromechanical devices -
Part 8: Strip bending test method for
tensile property measurement of thin films
-
ASTM E132-04 2010 Standard test method for Poisson's ratio -
at room temperature

---------------------- Page: 5 ----------------------

SIST EN 62047-21:2014

---------------------- Page: 6 ----------------------

SIST EN 62047-21:2014




IEC 62047-21

®


Edition 1.0 2014-06




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Semiconductor devices – Micro-electromechanical devices –

Part 21: Test method for Poisson's ratio of thin film MEMS materials




Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 21: Méthode d'essai relative au coefficient de Poisson des matériaux

MEMS en couche mince
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX M


ICS 31.080.99 ISBN 978-2-8322-1650-7



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN 62047-21:2014
– 2 – IEC 62047-21:2014 © IEC 2014
CONTENTS

FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions, symbols and designations . 5
3.1 Terms and definitions. 5
3.2 Symbols and designations . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of the test piece . 7
4.3 Measurement of dimensions . 7
5 Testing method and test apparatus . 7
5.1 Test principle . 7
5.2 Test machine . 7
5.3 Test procedure. 7
5.3.1 Test procedure for type 1 test piece . 7
5.3.2 Test procedure for type 2 test piece . 8
5.4 Test environment . 8
6 Test report . 8
Annex A (informative) Measurement example of Poisson's ratio using type 1 test piece . 9
A.1 Fabrication of the test piece . 9
A.2 Dimensions of the test piece . 9
A.3 Test procedures . 9
A.4 Test results . 10
Annex B (informative) Analysis of test results obtained from a type 2 test piece . 11
B.1 General . 11
B.2 Evaluation of stress and strain in circular and rectangular membranes . 11
B.3 Evaluation of Poisson’s ratio . 12
Bibliography . 13

Figure 1 – Two types of test pieces for the measurement of Poisson's ratio . 6
Figure A.1 − Optical images of markers for strain measurement by DIC . 9
Figure A.2 – Graphs of load and strain in the longitudinal and transverse directions . 10

Table 1 – Symbols and designations of a test piece . 6

---------------------- Page: 8 ----------------------

SIST EN 62047-21:2014
IEC 62047-21:2014 © IEC 2014 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 21: Test method for Poisson's ratio
of thin film MEMS materials

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-21 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/185/FDIS 47F/189/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 9 ----------------------

SIST EN 62047-21:2014
– 4 – IEC 62047-21:2014 © IEC 2014
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

---------------------- Page
...