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SIST CECC 23 200-801:2002

(Main)

Capability Detail Specification: Single and double-sided printed boards with plated-through holes

Capability Detail Specification: Single and double-sided printed boards with plated-through holes

Supersedes EN 123200-800:1992 * D97/081: CECC/SC 52 disbanded

Bauartspezifikation zur Anerkennung der Befähigung: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten Löchern

Spécification particulière d'agrément: Cartes imprimées simple ou double face à trous métallisés

Capability Detail Specification: Single and double-sided printed boards with plated-through holes

General Information

Status
Published
Publication Date
30-Apr-2002
ICS
31.180 - Printed circuits and boards
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
01-May-2002
Due Date
01-May-2002
Completion Date
01-May-2002
Ref Project
CECC 23 200-801:1998 - Capability Detail Specification: Single and double-sided printed boards with plated-through holes
SIST CECC 23 200-801:2002SIST CECC 23 200-801:2002
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SIST CECC 23 200-801:2002
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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Capability Detail Specification: Single and double-sided printed boards with plated-through holesBauartspezifikation zur Anerkennung der Befähigung: Leiterplatten mit Leiterbildern auf einer oder auf beiden Seiten mit metallisierten LöchernSpécification particulière d'agrément: Cartes imprimées simple ou double face à trous métallisésCapability Detail Specification: Single and double-sided printed boards with plated-through holes31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:CECC 23 200-801:1998SIST CECC 23 200-801:2002en01-maj-2002SIST CECC 23 200-801:2002SLOVENSKI
STANDARD
SIST CECC 23
...

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