SIST EN IEC 61837-2:2018/A2:2026

• Status: Published
• Public Enquiry End Date: 26-Feb-2026
• Publication Date: 26-Aug-2026
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 18-Aug-2026
• Due Date: 23-Oct-2026
• Completion Date: 27-Aug-2026
• Ref Project: EN IEC 61837-2:2018/A2:2026 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

• Amends: SIST EN IEC 61837-2:2018 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018)
• Effective Date: 01-Oct-2026

SIST EN IEC 61837-2:2018/A2:2026 is the Slovenian adoption of EN IEC 61837-2:2018/A2:2026, an IEC amendment issued through CENELEC and published by SIST. It covers surface mounted piezoelectric devices for frequency control and selection, focusing on standard outlines and terminal lead connections for ceramic enclosures. The document is for designers, manufacturers, and testers who need the package designation, dimensions, and land connections for these device types.

What does SIST EN IEC 61837-2:2018/A2:2026 specify?

SIST EN IEC 61837-2:2018/A2:2026 specifies updates to the standard outlines and terminal lead connections for ceramic enclosures used in surface mounted piezoelectric devices for frequency control and selection. In practice, it tells users how selected ceramic package types are designated, drawn, and connected on the PCB footprint.

The document is organized as an amendment to the existing European standard EN IEC 61837-2:2018. The foreword identifies the approval and implementation dates, and the technical content is concentrated in clause 8 and the associated tables and sheets.

What are the key requirements of SIST EN IEC 61837-2:2018/A2:2026?

SIST EN IEC 61837-2:2018/A2:2026 updates the package definition data for ceramic, welded, four-leadless SMD outlines. For a user, the practical effect is that drawings and land patterns for the affected types must follow the amended sheets, not the earlier versions.

1) Updated designation list in Table 1

SIST EN IEC 61837-2:2018/A2:2026 replaces and adds lines in Table 1 for ceramic enclosure designations. This matters because the type designation is what product drawings, part numbers, and library footprints are matched against.

2) New or revised outline sheets

SIST EN IEC 61837-2:2018/A2:2026 adds a revised Sheet 45 for type DCC-4/1210C and a new Sheet 48 for type DCC-4/0806C. These sheets provide the package outline and the associated terminal land connections, so PCB and component package data can be aligned to the same geometry.

3) Terminal land connections by device category

SIST EN IEC 61837-2:2018/A2:2026 gives terminal land connection tables for crystal unit, crystal oscillator, crystal filter, and SAW devices. This is important in layout work because each category can use the same package outline but different pad assignments.

4) Option-specific connections

SIST EN IEC 61837-2:2018/A2:2026 shows option-based connections for some terminal positions. In practice, users need to confirm which option applies to their device variant before fixing the footprint or checking a supplier drawing.

5) Dimensioned outline control

SIST EN IEC 61837-2:2018/A2:2026 supplies dimensioned outline drawings with nominal, minimum, and maximum values. That allows engineering, incoming inspection, and supplier approval to check whether the package matches the standard outline.

6) Traceable document status

SIST EN IEC 61837-2:2018/A2:2026 is an amendment to EN IEC 61837-2:2018 and is approved as a European Standard without modification. For buyers and quality teams, that means the amendment is intended to be used as part of the European standard set for this device family.

What terms does SIST EN IEC 61837-2:2018/A2:2026 define?

• SMD - A surface mounted device, meaning a package style intended for mounting on a board surface.
• SAW devices - Surface acoustic wave devices listed in the terminal land connection tables as one of the device categories covered.
• Crystal unit - A device category named in the terminal land connection tables for which land connections are specified.
• Crystal oscillator - A device category named in the terminal land connection tables with its own pad assignment.
• Crystal filter - A device category named in the terminal land connection tables with its own pad assignment.
• Ceramic enclosure - The package type covered by this part of the series and its amendment.
• Leadless - Used in the outline descriptions to indicate a package style without projecting leads.

Who uses SIST EN IEC 61837-2:2018/A2:2026?

SIST EN IEC 61837-2:2018/A2:2026 is used by component manufacturers, package designers, PCB designers, and test or quality engineers working with frequency-control piezoelectric devices. It is also relevant to buyers and suppliers who need to agree on a common outline and terminal connection scheme for ceramic packages.

In practice, users apply it when creating mechanical drawings, footprint libraries, supplier specifications, and inspection checks for ceramic-enclosed SMD devices.

What changed in SIST EN IEC 61837-2:2018/A2:2026 from the previous edition?

SIST EN IEC 61837-2:2018/A2:2026 modifies EN IEC 61837-2:2018 by updating the ceramic enclosure data in Table 1 and by introducing revised or new outline sheets.

• It replaces two existing Table 1 lines and adds one new Table 1 line.
• It replaces Sheet 45 for type DCC-4/1210C with a revised sheet.
• It adds Sheet 48 for type DCC-4/0806C.
• It updates the terminal land connections shown for these package types.

What does the SIST EN IEC 61837-2:2018/A2:2026 document contain?

SIST EN IEC 61837-2:2018/A2:2026 contains amendment text, a revised designation table, and dimensioned package sheets for specific ceramic enclosure types. The technical content is shown as outline drawings plus terminal land connection tables, which are used for component library creation, PCB footprint design, and inspection against the standard package geometry.

The document also includes the European foreword and endorsement notice, which record the approval route, implementation dates, and the fact that the IEC text was adopted without modification.

SLOVENSKI STANDARD
01-oktober-2026
Površinsko nameščeni piezoelektrični elementi za krmiljenje in izbiranje
(filtriranje) frekvenc - Standardne mere in priključni kontakti - 2. del: Keramični
okrovi - Dopolnilo A2 (IEC 61837-2:2018/AMD2:2026)
Surface mounted piezoelectric devices for frequency control and selection - Standard
outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-
2:2018/AMD2:2026)
Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -
selektion - Norm-Gehäusemaße und Anschlüsse - Teil 2: Keramikgehäuse (IEC 61837-
2:2018/AMD2:2026)
Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la
fréquence - Encombrements normalisés et connexions des sorties - Partie 2:
Enveloppes en céramique (IEC 61837-2:2018/AMD2:2026)
Ta slovenski standard je istoveten z: EN IEC 61837-2:2018/A2:2026
ICS:
31.140 Piezoelektrične naprave Piezoelectric devices
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61837-2:2018/A2

NORME EUROPÉENNE
EUROPÄISCHE NORM August 2026
ICS 31.140
English Version
Surface mounted piezoelectric devices for frequency control and
selection - Standard outlines and terminal lead connections -
Part 2: Ceramic enclosures
(IEC 61837-2:2018/AMD2:2026)
Dispositifs piézoélectriques à montage en surface pour la Oberflächenmontierbare piezoelektrische Bauteile zur
commande et le choix de la fréquence - Encombrements Frequenzstabilisierung und -selektion - Norm-
normalisés et connexions des sorties - Partie 2: Enveloppes Gehäusemaße und Anschlüsse - Teil 2: Keramikgehäuse
en céramique (IEC 61837-2:2018/AMD2:2026)
(IEC 61837-2:2018/AMD2:2026)
This amendment A1 modifies the European Standard EN IEC 61837-2:2018; it was approved by CENELEC on 2026-07-23. CENELEC
members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this amendment the
status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language made by translation under the
responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as
the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61837-2:2018/A2:2026 E

European foreword
The text of document 49/1523/CDV, future edition 3 of IEC 61837-2/AMD2, prepared by TC 49
"Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61837-2:2018/A2:2026.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2027-08-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2029-08-31
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61837-2:2018/AMD2:2026 was approved by CENELEC as
a European Standard without any modification.

IEC 61837-2 ®
Edition 3.0 2026-06
INTERNATIONAL
STANDARD
AMENDMENT 2
Surface mounted piezoelectric devices for frequency control and selection -
Standard outlines and terminal lead connections -
Part 2: Ceramic enclosures
ICS 31.140  ISBN 978-2-8327-1254-2

IEC 61837-2:2018-05/AMD2:2026-06(en)

IEC 61837-2/AMD2:2026 © IEC 2026
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Surface mounted piezoelectric devices for frequency control and
selection -
Standard outlines and terminal lead connections
Part 2: Ceramic enclosures
AMENDMENT 2
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with
...