SIST EN IEC 61837-2:2018
(Main)Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018)
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply
to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures,
and is based on IEC 61240:2016.
Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -selektion - Norm-Gehäusemaße und Anschlüsse - Teil 2: Keramikgehäuse (IEC 61837-2:2018)
Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 2: Enveloppes en céramique (IEC 61837-2:2018)
L’IEC 61837-2:2018 traite des encombrements normalisés et des connexions des sorties des dispositifs à montage en surface pour la commande et le choix de la fréquence applicables aux enveloppes en céramique, et est basée sur l’IEC 61240:2016.
La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a. révision des figures pour correspondre à la notation des dessins de l'IEC 61240:2016;
b. ajout des 7 enveloppes suivantes: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
Površinsko nameščeni piezoelektrični elementi za krmiljenje in izbiranje (filtriranje) frekvenc - Standardne mere in priključni kontakti - 2. del: Keramični okrovi (IEC 61837-2:2018)
Ta del standarda IEC 61837 obravnava standardne mere in priključne kontakte, ki se uporabljajo pri površinsko nameščenih elementih (SMD) za regulacijo in izbiranje frekvence na keramičnih okrovih, ter temelji na standardu IEC 61240:2016.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 61837-2:2018
01-september-2018
1DGRPHãþD
SIST EN 61837-2:2011
SIST EN 61837-2:2011/A1:2016
3RYUãLQVNRQDPHãþHQLSLH]RHOHNWULþQLHOHPHQWL]DNUPLOMHQMHLQL]ELUDQMH ILOWULUDQMH
IUHNYHQF6WDQGDUGQHPHUHLQSULNOMXþQLNRQWDNWLGHO .HUDPLþQLRNURYL ,(&
Surface mounted piezoelectric devices for frequency control and selection - Standard
outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018)
Oberflächenmontierbare piezoelektrische Bauteile zur Frequenzstabilisierung und -
selektion - Norm-Gehäusemaße und Anschlüsse - Teil 2: Keramikgehäuse (IEC 61837-
2:2018)
Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la
fréquence - Encombrements normalisés et connexions des sorties - Partie 2: Enveloppes
en céramique (IEC 61837-2:2018)
Ta slovenski standard je istoveten z: EN IEC 61837-2:2018
ICS:
31.140 3LH]RHOHNWULþQHQDSUDYH Piezoelectric devices
SIST EN IEC 61837-2:2018 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 61837-2:2018
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SIST EN IEC 61837-2:2018
EUROPEAN STANDARD EN IEC 61837-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2018
ICS 31.140 Supersedes EN 61837-2:2011
English Version
Surface mounted piezoelectric devices for frequency control and
selection - Standard outlines and terminal lead connections -
Part 2: Ceramic enclosures
(IEC 61837-2:2018)
Dispositifs piézoélectriques à montage en surface pour la Oberflächenmontierbare piezoelektrische Bauteile zur
commande et le choix de la fréquence - Encombrements Frequenzstabilisierung und -selektion - Norm-
normalisés et connexions des sorties - Partie 2: Enveloppes Gehäusemaße und Anschlüsse - Teil 2: Keramikgehäuse
en céramique (IEC 61837-2:2018)
(IEC 61837-2:2018)
This European Standard was approved by CENELEC on 2018-06-12. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61837-2:2018 E
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SIST EN IEC 61837-2:2018
EN IEC 61837-2:2018
European foreword
The text of document 49/1252/CDV, future edition 3 of IEC 61837-2, prepared by
IEC/TC 49 "Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61837-2:2018.
The following dates are fixed:
• latest date by which the document has to be (dop) 2019-03-12
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2021-06-12
• latest date by which the national
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61837-2:2011.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 61837-2:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60122-3:2010 NOTE Harmonized as EN 60122-3:2010 (not modified).
IEC 60191-6:2009 NOTE Harmonized as EN 60191-6:2009 (not modified).
IEC 60368-1:2000 NOTE Harmonized as EN 60368-1:2000 (not modified).
IEC 60368-2-2:1996 NOTE Harmonized as EN 60368-2-2:1999 (not modified).
IEC 60368-3:2010 NOTE Harmonized as EN 60368-3:2010 (not modified).
IEC 60679-1:2017 NOTE Harmonized as EN 60679-1:2017 (not modified).
IEC 60679-3:2012 NOTE Harmonized as EN 60679-3:2013 (not modified).
IEC 60862-1:2015 NOTE Harmonized as EN 60862-1:2015 (not modified).
IEC 60862-2:2012 NOTE Harmonized as EN 60862-2:2012 (not modified).
IEC 60862-3:2003 NOTE Harmonized as EN 60862-3:2003 (not modified).
IEC 61019-1:2004 NOTE Harmonized as EN 61019-1:2005 (not modified).
IEC 61019-2:2005 NOTE Harmonized as EN 61019-2:2005 (not modified).
ISO 1101:2017 NOTE Harmonized as EN ISO 1101:2017 (not modified).
2
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SIST EN IEC 61837-2:2018
EN IEC 61837-2:2018
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61240 2016 Piezoelectric devices - Preparation of EN 61240 2017
outline drawings of surface-mounted
devices (SMD) for frequency control and
selection - General rules
3
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SIST EN IEC 61837-2:2018
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SIST EN IEC 61837-2:2018
IEC 61837-2
®
Edition 3.0 2018-05
INTERNATIONAL
STANDARD
Surface mounted piezoelectric devices for frequency control and selection –
Standard outlines and terminal lead connections –
Part 2: Ceramic enclosures
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.140 ISBN 978-2-8322-5673-2
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission
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SIST EN IEC 61837-2:2018
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CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Configuration of enclosures . 6
5 Designation of types . 6
6 Ceramic enclosure dimensions . 7
7 Lead connections . 7
8 Designation of ceramic enclosures . 7
Sheet 1 . 9
Sheet 2 . 11
Sheet 3 . 13
Sheet 4 . 15
Sheet 5 . 17
Sheet 6 . 19
Sheet 7 . 21
Sheet 8 . 23
Sheet 9 . 25
Sheet 10 . 27
Sheet 11 . 29
Sheet 12 . 31
Sheet 13 . 33
Sheet 14 . 35
Sheet 15 . 37
Sheet 16 . 39
Sheet 17 . 41
Sheet 18 . 43
Sheet 19 . 45
Sheet 20 . 47
Sheet 21 . 49
Sheet 22 . 51
Sheet 23 . 53
Sheet 24 . 55
Sheet 25 . 57
Sheet 26 . 59
Sheet 27 . 61
Sheet 28 . 63
Sheet 29 . 65
Sheet 30 . 67
Sheet 31 . 69
Sheet 32 . 71
Sheet 33 . 73
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IEC 61837-2:2018 © IEC 2018 – 3 –
Sheet 34 . 75
Sheet 35 . 77
Sheet 36 . 79
Sheet 37 . 81
Sheet 38 . 83
Sheet 39 . 85
Sheet 40 . 87
Sheet 41 . 89
Sheet 42 . 91
Sheet 43 . 93
Sheet 44 . 95
Sheet 45 . 97
Bibliography . 99
Table 1 – Designation of ceramic enclosures . 8
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR
FREQUENCY CONTROL AND SELECTION – STANDARD
OUTLINES AND TERMINAL LEAD CONNECTIONS –
Part 2: Ceramic enclosures
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses
arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61837-2 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection.
This third edition cancels and replaces the second edition published in 2011 and
Amendment 1:2014. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) revision of the figures to match the notation of the drawings of IEC 61240:2016;
b) addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C,
DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
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SIST EN IEC 61837-2:2018
IEC 61837-2:2018 © IEC 2018 – 5 –
This International Standard is to be read in conjunction with IEC 61240:2016.
The text of this International Standard is based on the following documents:
CDV Report on voting
49/1252/CDV 49/1276/RVC
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61837 series, published under the general title Surface mounted
piezoelectric devices for frequency control and selection – Standard outlines and terminal lead
connections , can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR
FREQUENCY CONTROL AND SELECTION – STANDARD
OUTLINES AND TERMINAL LEAD CONNECTIONS –
Part 2: Ceramic enclosures
1 Scope
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply
to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures,
and is based on IEC 61240:2016.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61240:2016, Piezoelectric devices – Preparation of outline drawings of surface-mounted
devices (SMD) for frequency control and selection – General rules
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Configuration of enclosures
The enclosures of the surface-mounted devices are made of ceramic materials with the
terminals of deposited metal film (leadless type) based on a descriptive designation system for
semiconductors – devices packages.
The configuration symbols are shown as follows:
• DCC (dual chip carrier);
• QCC (quad chip carrier).
5 Designation of types
The designation of types is shown on four parts as follows:
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IEC 61837-2:2018 © IEC 2018 – 7 –
B C D D’
A E
IEC
A: Configuration symbol of enclosures:
– DCC (dual chip carrier);
– QCC (quad chip carrier).
B: Structure of terminal leads: leadless type has no mark.
C: Number of terminal leads
D: Serial number of both figures
E: Arrangement of terminal land:
In the case of DCC types:
– A (arrangement in the width direction side or the width direction side and the corner);
– B (arrangement in the length direction side or the length direction side and the corner);
– C (arrangement in the corner only).
In the case of QCC types:
– A (arrangement in the side only);
– B (arrangement in the side and the corner).
6 Ceramic enclosure dimensions
The dimensions given in this document apply to all completed SMD-devices for frequency
control and selection. Only those dimensions which meet the requirements of IEC 61240 are
given.
7 Lead connections
Recommendations for the lead connections of all completed SMD-devices for frequency control
and selection are given in the following individual sheets. Lead connections shall always be
given in the detail specification.
8 Designation of ceramic enclosures
Table 1 is a list which includes all new enclosure types with their sheet numbers and brief
descriptions. Old enclosure names are also listed as references.
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Table 1 – Designation of ceramic enclosures
No. Type Old type Sheet No. Description
1 QCC-18/1809A QCC-18/01 Sheet 1 Ceramic, welded, eighteen leadless SMD outline
2 QCC-12/1407A Sheet 2 Ceramic, welded, twelve leadless SMD outline
3 DCC-4/1206A DCC-4/01 Sheet 3 Ceramic, four leadless SMD outline
4 DCC-2/1206A Sheet 4 Ceramic, two leadless SMD outline
5 QCC-10/9272A Sheet 5 Ceramic, welded, ten leadless SMD outline
6 DCC-4/9070A Sheet 6 Ceramic, welded, four leadless SMD outline
7 DCC-4/8045B DCC-04/02, 03 Sheet 7 Ceramic, welded, four leadless SMD outline
8 DCC-2/8045B Sheet 8 Ceramic, welded, two leadless SMD outline
9 DCC-6/7834B Sheet 9 Ceramic, welded, six leadless SMD outline
10 DCC-6/7050A Sheet 10 Ceramic, welded, six leadless SMD outline
11 DCC-4/7050A DCC-4/08 Sheet 11 Ceramic, welded, four leadless SMD outline
12 DCC-4/7050B DCC-4/04, 05 Sheet 12 Ceramic, welded, four leadless SMD outline
13 QCC-10/7050A Sheet 13 Ceramic, welded, ten leadless SMD outline
14 QCC-6/7050A QCC-6/01, 02 Sheet 14 Ceramic, welded, six leadless SMD outline
15 DCC-6/6035A DCC-4/06, 07 Sheet 15 Ceramic, welded, six leadless SMD outline
16 DCC-4/6035C Sheet 16 Ceramic, welded, four leadless SMD outline
17 DCC-2/6035C Sheet 17 Ceramic, welded, two leadless SMD outline
18 QCC-8/5050A QCC-8/02 Sheet 18 Ceramic, welded, eight leadless SMD outline
19 QCC-12/5045A QCC-12/02 Sheet 19 Ceramic, welded, twelve leadless SMD outline
20 QCC-8/5045A Sheet 20 Ceramic, welded, eight leadless SMD outline
21 DCC-6/5032A Sheet 21 Ceramic, welded, six leadless SMD outline
22 DCC-4/5032A Sheet 22 Ceramic, welded, four leadless SMD outline
23 DCC-4/5032C Sheet 23 Ceramic, welded, four leadless SMD outline
24 DCC-2/5032B DCC-2/01 Sheet 24 Ceramic, welded, two leadless SMD outline
25 DCC-2/4818C Sheet 25 Ceramic, welded, two leadless SMD outline
26 DCC-2/4115C Sheet 26 Ceramic, welded, two leadless SMD outline
27 DCC-4/4025C DCC-6/01 Sheet 27 Ceramic, welded, four leadless SMD outline
28 QCC-8/3838A Sheet 28 Ceramic, welded, eight leadless SMD outline
29 DCC-6/3838A Sheet 29 Ceramic, welded, six leadless SMD outline
30 DCC-6/3225A Sheet 30 Ceramic, welded, six leadless SMD outline
31 DCC-4/3225C Sheet 31 Ceramic, welded, four leadless SMD outline
32 DCC-4/3215C Sheet 32 Ceramic, welded, four leadless SMD outline
33 DCC-2/3215C Sheet 33 Ceramic, welded, two leadless SMD outline
34 QCC-8/3030B Sheet 34 Ceramic, welded, eight leadless SMD outline
35 DCC-6/3030A Sheet 35 Ceramic, welded, six leadless SMD outline
36 DCC-6/2520A Sheet 36 Ceramic, welded, six leadless SMD outline
37 DCC-4/2520C/01,02,03 Sheet 37 Ceramic, welded, four leadless SMD outline
38 DCC-4/2020C Sheet 38 Ceramic, welded, six leadless SMD outline
39 DCC-6/2016A Sheet 39 Ceramic, welded, four leadless SMD outline
40 DCC-4/2016C/01,02,03 Sheet 40 Ceramic, welded, four leadless SMD outline
41 DCC-2/2012C Sheet 41 Ceramic, welded, two leadless SMD outline
42 DCC-4/1612C/01,02 Sheet 42 Ceramic, welded, four leadless SMD outline
43 DCC-2/1612C Sheet 43 Ceramic, welded, two leadless SMD outline
44 DCC-2/1610C Sheet 44 Ceramic, welded, two leadless SMD outline
45 DCC-4/1210C Sheet 45 Ceramic, welded, four leadless SMD outline
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IEC 61837-2:2018 © IEC 2018 – 9 –
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A – (18,0) 18,30
B – (9,0) 9,30
G – – 2,00
K 0,50 – 1,10
L
Actual size 1,20 – 1,80 Note
B
IEC e – 2,54 –
y – – 0,10
A
14
15 13 12 11 10
16 9
17
8
18
7
1
2 3 4 5 6
s
y s
e
K
IEC
NOTE Dimension L max. can be increased to 2,10 mm for lead 1 to identity the orientation.
B
Ceramic, welded, eighteen leadless SMD outline – Scale
Type QCC-18/1809A 3: 1
Sheet 1
B
G
L
B
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Terminal land connections of Type QCC-18/1809A
Crystal
No. Crystal unit Crystal filter SAW devices
oscillator
1 Ground
2 Option
3 Option
4 Option
5 Option
6 Ground
7 Input/Output
8 Ground
9 Input/Output /Ground
10 Ground
11 Option
12 Option
13 Option
14 Option
15 Ground
16 Output/Input
17 Ground
18 Output/Input /Ground
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IEC 61837-2:2018 © IEC 2018 – 11 –
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A – (14,0) 14,30
B – (6,5) 6,80
G – – 2,00
Actual size K 0,50 – 1,10
IEC
L 1,70 – 2,30
B
e – 2,54 –
y – – 0,10
A
10 9 8
7
11 6
12 5
2 3 4
1
s
y s
e
K
IEC
Ceramic, welded, twelve leadless SMD outline – Scale
Type QCC-12/1407A 3: 1
Sheet 2
B
G
L
B
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Terminal land connections of Type QCC-12/1407A
No. Crystal unit Crystal oscillator Crystal filter SAW devices
1 Option
2 Option
3 Ground
4 Option
5 Output/Input
6 Output/Input /Ground
7 Option
8 Ground
9 Option
10 Option
11 Input/Output
12 Input/Output /Ground
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Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A – (12,0) 12,30
B – (5,5) 5,80
G – – 2,30
Actual size
K 1,80 – 2,20
IEC
L 1,30 – 1,90
...
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