oSIST prEN IEC 62228-3:2026

• Status: Not Published
• Public Enquiry End Date: 30-Nov-2026
• ICS: 31.200 - Integrated circuits. Microelectronics
• ICS: 33.100.01 - Electromagnetic compatibility in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 4020 - Public enquire (PE) (Adopted Project)
• Start Date: 07-Oct-2026
• Due Date: 24-Feb-2027
• Ref Project: prEN IEC 62228-3:2026 - Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

• Revises: SIST EN IEC 62228-3:2019 - Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers (IEC 62228-3:2019)
• Effective Date: 15-Oct-2024
• Revises: SIST EN IEC 62228-3:2019/AC:2023 - Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers (IEC 62228-3:2019/COR1:2023)
• Effective Date: 15-Oct-2024

oSIST prEN IEC 62228-3:2026 is a CLC draft standard for electromagnetic compatibility (EMC) evaluation of controller area network (CAN) transceiver integrated circuits. It specifies test and measurement methods for RF emission, RF immunity, impulse immunity, and electrostatic discharge (ESD) so users can assess CAN transceivers under network conditions. The document covers classical CAN transceivers, embedded CAN transceivers, and CAN HS, CAN FD, CAN PN, CAN SIC, and CAN XL functionality.

What does oSIST prEN IEC 62228-3:2026 specify?

oSIST prEN IEC 62228-3:2026 specifies how to evaluate CAN transceiver ICs in a minimal network and how to document the result. It defines the test configurations, test conditions, test signals, failure criteria, test procedures, test setups, and test boards needed for EMC evaluation.

The scope covers four test areas:

• emission of RF disturbances
• immunity against RF disturbances
• immunity against impulses
• immunity against electrostatic discharges (ESD)

The document is organized into general clauses, detailed test conditions, measurement clauses, a test report clause, and annexes that provide circuits, boards, example limits, characterization methods, and special-case procedures.

Annex	What it covers
A	CAN test circuits
B	Test circuit boards
C	Examples for test limits for CAN transceiver in automotive application
D	Characterization of common mode choke for CAN bus interfaces
E	Characterization of ESD suppression devices for CAN bus interfaces
F	Bit asymmetry definition for embedded CAN transceiver test
G	EMC tests for CAN transceiver with SIC and XL functionality

What are the key requirements of oSIST prEN IEC 62228-3:2026?

oSIST prEN IEC 62228-3:2026 is built around application-like EMC testing: functional tests are done in a minimal CAN network, while unpowered ESD is done on a single IC. In practice, that means the test setup, the bus filter, the board layout, and the operating mode all affect the result and must be chosen carefully.

Operating conditions and test modes

Clause 4 states that the evaluation is done under application conditions and that the same test board can be used for the conductive functional tests. It also says the test should focus on EMC-relevant pins such as CAN_H, CAN_L, V, and WAKE, with other pins considered when the IC implementation needs it.

Clause 5 sets default operating conditions for 12 V systems:

• VBAText: 14 V
• VCCext: 5 V
• VIOext: 3.3 V
• test temperature: 23 °C with tolerance

For RF emission, the ambient noise floor must be at least 6 dB below the target limit and recorded in the test report. For ESD, the climatic conditions of ISO 10605 apply. In practice, this means a lab cannot compare results reliably unless the power and ambient conditions are controlled and reported.

Clause 5 also distinguishes the operating modes used in the tests, including normal operation, low power standby, low power sleep, and the partial networking variants for CAN PN. For embedded CAN transceivers, the document uses indirect checks through a monitoring CAN communication controller because RxD and TxD are not accessible as pins.

RF emission and RF immunity

Clause 6 uses conductive EMC methods borrowed from the IC EMC test standards:

• RF emission uses the 150 Ω direct coupling method from IEC 61967-4
• RF immunity uses direct RF power injection (DPI) from IEC 62132-4
• impulse immunity uses the non-synchronous transient injection method from IEC 62215-3

This matters because the document does not rely on a single generic EMC setup. It links each disturbance type to a specific measurement method, so the lab can measure emission and immunity in a way that is comparable across parts and test sites.

For RF emission, the document defines which pins are measured and which test signals are used, including normal operation and low power PN standby cases. For RF immunity, it requires immunity threshold curves and specifies how to scan frequency and forward power while checking for malfunction. For status class A, the test looks for the highest disturbance level that causes no malfunction; for status class C or D, the test applies the defined level and checks the functional state after each step.

Impulse immunity and ESD

Clause 6 also defines impulse immunity tests and ESD tests. The impulse test uses pulse values referenced to ISO 7637-2, and the result is an impulse immunity level for the relevant operating mode.

The ESD part is split into unpowered damage testing and powered failure validation. The unpowered test uses contact discharge on a single transceiver IC, and the test setup is defined so that the discharge point, trace length, and board construction are controlled. In practice, this is the part that helps a buyer or lab separate a robust IC from one that only looks good in a loose setup.

Test hardware, filters, and special cases

Annex A and Annex B are central to the document because they define the test network and the PCB implementation. The board should be a soldered, minimum two-layer PCB with a GND layer, short interconnections, and decoupled peripheral connections. The document also defines mandatory and optional components, including the CAN bus filter, the decoupling networks, and the optional signal ringing network used for CAN transceivers with SIC functionality.

The annexes on common mode choke (CMC) and ESD suppression devices matter because these parts can change EMC results significantly. Annex D characterizes CMCs by leakage inductance mismatch, mixed mode S-parameters, ESD damage, and saturation under RF disturbance. Annex E does the same kind of support work for ESD suppression devices, including mixed mode S-parameters, ESD damage, discharge current effects, and RF clamping behavior.

Annex F is specific to embedded CAN transceivers. It defines bit asymmetry and phase margin so that transmitter and receiver behavior can be checked indirectly through a monitoring node. Annex G extends the document to CAN SIC and CAN XL functionality, including FAST TX mode test signals and additional evaluation masks.

What terms does oSIST prEN IEC 62228-3:2026 define?

• Global pin - A pin that carries a signal or power and leaves or enters the application board without any active component in between.
• Local pin - A pin that carries a signal or power and does not leave the application board.
• Classical CAN transceiver - A transceiver with pin access to RxD and TxD and functionality according to ISO 11898-2.
• CAN FD functionality - A transceiver capability for flexible data rate operation according to ISO 11898-2, with data rates up to 2 Mbit/s or 5 Mbit/s.
• CAN SIC functionality - A transceiver capability with additional signal improvement capability according to ISO 11898-2, with data rates up to 8 Mbit/s.
• Embedded CAN transceiver - An IC with an integrated CAN transceiver cell and CAN protocol handler, but without pin access to RxD and TxD.
• Signal ringing network - An added bus network used to simulate differential signal ringing.
• CAN XL functionality - A transceiver capability with FAST mode and data rates up to 20 Mbit/s according to ISO 11898-2.

Who uses oSIST prEN IEC 62228-3:2026?

oSIST prEN IEC 62228-3:2026 is used by designers and evaluators of CAN transceiver ICs, including classical CAN parts, embedded CAN parts, and transceivers inside SBCs or ASICs. It is also used by EMC test laboratories, automotive electronics suppliers, and quality or buyer teams that need to compare device behavior under the same test conditions.

In practice, users apply it to:

• set up CAN network EMC tests
• choose coupling and decoupling networks
• characterize bus filters, CMCs, and ESD suppression devices
• verify transmitter and receiver behavior under disturbance
• document test reports for product qualification or comparison

Which standards are used with oSIST prEN IEC 62228-3:2026?

• IEC 61967-1 - Gives general conditions and definitions for integrated circuit measurement of electromagnetic emissions.
• IEC 61967-4 - Provides the 1 ohm/150 ohm direct coupling method used for conducted RF emission measurements.
• IEC 62132-1 - Gives general conditions and definitions for integrated circuit measurement of electromagnetic immunity.
• IEC 62132-4 - Provides the direct RF power injection method used for RF immunity testing.
• IEC 62215-3 - Provides the non-synchronous transient injection method used for impulse immunity testing.
• IEC 62228-1 - Gives the general conditions and definitions for the IEC 62228 transceiver EMC series.
• ISO 7637-2 - Provides electrical transient conduction tests on supply lines used as the basis for impulse parameters.
• ISO 10605 - Provides the road-vehicle ESD test method used for direct discharge testing.
• ISO 11898-1 - Defines the CAN data link layer and physical signalling used for test signal framing.
• ISO 11898-2 - Defines the high-speed CAN physical medium attachment used throughout the transceiver tests.

What does the oSIST prEN IEC 62228-3:2026 document contain?

The document contains detailed test circuits, PCB layouts, test setups, and measurement procedures rather than only pass/fail statements. Annex A and Annex B show how to build the CAN test network and the test boards, while Annex C gives example limits for automotive applications.

It also includes test limits, parameter tables, and figures for RF emission, RF immunity, impulse immunity, and ESD. Annex D and Annex E add characterization methods for CMCs and ESD suppression devices, including S-parameter measurements, discharge current behavior, and saturation or clamping tests.

For embedded CAN transceivers, Annex F gives the bit asymmetry method and timing definitions used to check transmitter and receiver behavior indirectly. Annex G adds extended EMC test signals and evaluation masks for CAN SIC and CAN XL functionality, including FAST TX mode operation.

SLOVENSKI STANDARD
01-november-2026
Integrirana vezja - Vrednotenje elektromagnetne združljivosti (EMC) oddajnikov-
sprejemnikov - 3. del: Oddajniki-sprejemniki CAN
Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers
Circuits intégrés - Évaluation de la CEM des émetteurs-récepteurs - Partie 3 :
Émetteurs-récepteurs CAN
Ta slovenski standard je istoveten z: prEN IEC 62228-3:2026
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
33.100.01 Elektromagnetna združljivost Electromagnetic compatibility
na splošno in general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

47A/1227/CDV
COMMITTEE DRAFT FOR VOTE (CDV)

PROJECT NUMBER:
IEC 62228-3 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2026-10-02 2026-12-25
SUPERSEDES DOCUMENTS:
47A/1212/CD, 47A/1218A/CC
IEC SC 47A : INTEGRATED CIRCUITS
SECRETARIAT: SECRETARY:
Japan Mr Yoshinori FUKUBA
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):

ASPECTS CONCERNED:
Electromagnetic Compatibility
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TITLE:
Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

PROPOSED STABILITY DATE: 2032
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IEC CDV 62228-3 ED2 © IEC 2026

CONTENTS
CONTENTS . 1
FOREWORD . 8
1 Scope . 11
2 Normative references . 11
3 Terms, definitions and abbreviated terms . 12
3.1 Terms and definitions. 12
3.2 Abbreviated terms . 13
4 General . 14
5 Test and operating conditions . 15
5.1 Supply and ambient conditions . 15
5.2 Test operation modes . 15
5.3 Test configuration . 15
5.3.1 General test configuration for transceiver network . 15
5.3.2 General test configuration for unpowered ESD test . 16
5.3.3 Transceiver network tests - Coupling ports and networks. 17
5.3.4 Transceiver network tests - Signal ringing network . 19
5.3.5 Unpowered ESD tests - Coupling ports and networks . 20
5.4 Test signals . 21
5.4.1 General . 21
5.4.2 Test signals for normal operation mode . 21
5.4.3 Test signal for wake-up from low power mode . 23
5.5 Evaluation criteria . 26
5.5.1 General . 26
5.5.2 Evaluation criteria for functional operation modes . 27
5.5.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 38
5.5.4 Status classes . 39
6 Test and measurement . 39
6.1 Emission of RF disturbances . 39
6.1.1 Test method . 39
6.1.2 Test setup . 39
6.1.3 Test procedure and parameters . 40
6.2 Immunity to RF disturbances . 41
6.2.1 Test method . 41
6.2.2 Test setup . 41
6.2.3 Test procedure and parameters . 42
6.3 Immunity to impulses . 48
6.3.1 Test method . 48
6.3.2 Test setup . 48
6.3.3 Test procedure and parameters . 49
6.4 Electrostatic discharge (ESD) . 54
6.4.1 Test method . 54
6.4.2 Test setup for unpowered test . 54
6.4.3 Test procedure and parameters . 56
7 Test report . 57
Annex A (normative) CAN test circuits . 58
IEC CDV 62228-3 ED2 © IEC 2026

A.1 General . 58
A.2 Test circuit for classical CAN transceivers for functional tests . 58
A.3 Test circuit with signal ringing network for CAN transceiver with SIC
functionality . 63
A.4 Test circuit for embedded CAN transceivers for functional tests . 66
A.5 Test circuit for CAN transceiver for unpowered ESD test . 67
Annex B (normative) Test circuit boards . 69
B.1 Test circuit board for functional tests . 69
B.2 Test circuit board for CAN transceivers with SIC functionality . 69
B.3 Unpowered ESD test . 70
Annex C (informative) Examples for test limits for CAN transceiver in automotive
application . 72
C.1 General . 72
C.2 Emission of RF disturbances . 72
C.3 Immunity to RF disturbances . 73
C.4 Immunity to impulses . 76
C.5 Electrostatic discharge (ESD) . 76
Annex D (informative) Characterization of common mode choke for CAN bus
interfaces . 77
D.1 General . 77
D.2 Recommended tests . 77
D.2.1 General . 77
D.2.2 Leakage inductance mismatch measurement . 78
D.2.3 S-parameter measurement mixed mode . 81
D.2.4 ESD damage . 86
D.2.5 Saturation test at RF disturbances . 88
D.2.6 ESD saturation test . 91
Annex E (informative) Characterization of ESD suppression devices for CAN bus
interfaces . 96
E.1 General . 96
E.2 Test definitions . 97
E.2.1 General . 97
E.2.2 Mixed mode S-parameter measurement . 97
E.2.3 ESD damage . 102
E.2.4 ESD discharge current measurement . 105
E.2.5 Test of unwanted clamping effect at RF immunity tests . 110
Annex F (informative) Bit asymmetry definition for embedded CAN transceiver test . 115
F.1 General . 115
F.2 Bit timing definition . 115
F.3 Test procedure for embedded CAN transceivers using bit asymmetry . 117
Annex G (informative) EMC tests for CAN transceiver with SIC and XL functionality . 120
G.1 General . 120
G.2 Test operation modes . 120
G.3 Test configuration . 120
G.4 Test signals . 120
G.5 Evaluation criteria . 121
G.6 Test recommendations . 125
G.6.1 Conducted RF emission . 125
G.6.2 Conducted RF immunity. 126
IEC CDV 62228-3 ED2 © IEC 2026

G.6.3 Transient immunity . 127
G.6.4 Electrostatic discharge (ESD) . 128
Bibliography . 129

Figure 1 – General test configuration for tests in transceiver network . 16
Figure 2 – General test configuration for unpowered ESD test . 17
Figure 3 – Transceiver network tests - Coupling ports and networks . 18
Figure 4 – Signal ringing network for CAN SIC tests . 20
Figure 5 – Coupling ports and networks for ESD tests . 20
Figure 6 – Definition for trigger points and violation masks for CAN transceivers with
FD functionality . 30
Figure 7 – Principle drawing of the maximum deviation on an I-V characteristic . 39
Figure 8 – Test setup for measurement of RF disturbances . 40
Figure 9 – Test setup for DPI tests . 42
Figure 10 – Test setup for impulse immunity tests . 49
Figure 11 – Test setup for direct ESD tests - Principal arrangement . 55
Figure 12 – Test setup for direct ESD tests - Stimulation and monitoring . 56
Figure A.1 – General drawing of the circuit diagram of test network for CAN
transceivers for functional test . 61
Figure A.2 – General drawing of the circuit diagram of test network for CAN
transceivers with PN functionality for functional test. 63
Figure A.3 – General drawing of the circuit diagram of test network with signal ringing
network for CAN transceivers with SIC functionality . 66
Figure A.4 – General drawing of the circuit diagram of test network for embedded CAN
transceivers for functional test . 67
Figure A.5 – General drawing of the circuit diagram for direct ESD tests of CAN
transceivers in unpowered mode . 68
Figure B.1 – Example of IC interconnections of CAN signal . 69
Figure B.2 – Example of signal ringing network on CAN network . 70
Figure B.3 – Example of unpowered ESD test board for CAN transceivers . 71
Figure C.1 – Example of limits for RF emission - CAN with bus filter . 72
Figure C.2 – Example of limits for RF emission - Other global pins . 73
Figure C.3 – Example of limits for RF emission - Local supplies . 73
Figure C.4 – Example of limits for RF immunity for functional status class A - CAN
IC
with bus filter . 74
Figure C.5 – Example of limits for RF immunity for functional status class A - CAN . 74
IC
Figure C.6 – Example of limits for RF immunity for functional status class A - Other
IC
global pins . 75
Figure C.7 – Example of limits for RF immunity for functional status class C or D -
IC IC
CAN with bus filter . 75
Figure C.8 – Example of limits for RF immunity for functional status class C or D -
IC IC
Other global pins . 76
Figure D.1 – General electrical drawing of a CMC . 77
Figure D.2 – Test setup for 2-port S-parameter measurements for leakage inductance
evaluation . 78
IEC CDV 62228-3 ED2 © IEC 2026

Figure D.3 – Example of a two-port test board for CMC leakage inductance
characterization . 79
Figure D.4 – Example of CMC characterization measurement results . 81
Figure D.5 – Test setup for S-parameter measurements . 82
Figure D.6 – Example of the test board (top layer) for 4-port mixed mode S-parameter
measurement . 83
Figure D.7 – Example of the test board (top layer) for 3-port mixed mode S-parameter
measurement . 83
Figure D.8 – Recommended characteristics for S (IL) . 85
dd21
Figure D.9 – Recommended characteristic for S (CMR) . 85
cc21
Figure D.10 – Recommended characteristic for S and S (DCMR) . 86
sd21 sd12
Figure D.11 – Test setup for ESD damage tests. 86
Figure D.12 – Example test board ESD, top layer . 87
Figure D.13 – Test setup for RF saturation measurements of CMC . 89
Figure D.14 – Example RF saturation/S-parameter test board, top layer . 90
Figure D.15 – Test circuit for RF saturation tests at CMC . 91
Figure D.16 – Recommended test power levels for RF saturation tests of CMC . 91
Figure D.17 – Test setup for ESD saturation measurements at CMC. 92
Figure D.18 – Example of ESD saturation test board for CMC, top layer . 93
Figure D.19 – Example of ESD saturation tests results of different CMCs . 95
Figure E.1 – Arrangement of ESD suppression device within the CAN test network . 97
Figure E.2 – Test setup for S-parameter measurements at ESD suppression device . 98
Figure E.3 – Example of test board (top layer) for 4-port mixed mode S-parameter
measurement for ESD suppression device . 99
Figure E.4 – Example of test board (top layer) for 3-port mixed mode S-parameter
measurement for ESD suppression device . 99
Figure E.5 – Recommended characteristics for S (IL) for ESD suppression device . 102
dd21
Figure E.6 – Recommended characteristics for S (DCMR) for ESD suppression
sd21
device . 102
Figure E.7 – Test setup for ESD damage tests at ESD suppression device . 103
Figure E.8 – Example of ESD test board for ESD suppression device, top layer. 104
Figure E.9 – Test setup for ESD discharge current measurement at ESD suppression
device . 106
Figure E.10 – Example of ESD discharge current test board for ESD suppression
device, top and bottom layer . 107
Figure E.11 – Example of test results and recommended limits for remaining ESD
discharge current after the CAN test network for ESD suppression device . 109
Figure E.12 – Test setup for RF clamping test at ESD suppression device . 111
Figure E.13 – Example of test board RF clamping test at suppression device, top layer . 112
Figure E.14 – Recommended test power levels for RF clamping tests at ESD
suppression device used in automotive applications . 113
Figure F.1 – Example of bit timing for 2 Mbit/s, data field section 00 . 116
Figure F.2 – Definition of static asymmetric bit times, example 2 Mbit/s . 117
Figure F.3 – Implementation of static bit asymmetry, example for RxD signal . 119
IEC CDV 62228-3 ED2 © IEC 2026

Figure G.1 – Definition for trigger points and violation masks for tests of CAN
transceivers with SIC and XL functionality in FAST TX mode . 123

Table 1 – Overview of measurements and tests . 14
Table 2 – Supply and ambient conditions for functional operation . 15
Table 3 – Transceiver network tests - Component value definitions of coupling ports
and networks . 18
Table 4 – Definitions of coupling ports for ESD tests . 21
Table 5 – Communication test signal TX1 . 21
Table 6 – Communication test signal TX2c . 21
Table 7 – Communication test signal TX2a . 22
Table 8 – Communication test signal TX2b . 22
Table 9 – Communication test signal TX-SIC . 23
Table 10 – Wake-up test signal TX3 . 23
Table 11 – Communication test signal TX4a . 24
Table 12 – Communication test signal TX4b . 24
Table 13 – Communication test signal TX4c. 24
Table 14 – Communication test signal TX4d . 24
Table 15 – Communication test signal TX4e . 25
Table 16 – Communication test signal TX4f1 . 25
Table 17 – Communication test signal TX4f2 . 25
Table 18 – Communication test signal TX4g . 26
Table 19 – Communication test signal TX4h . 26
Table 20 – Communication test signal TX4i . 26
Table 21 – Evaluation criteria for CAN transceiver functions . 27
Table 22 – Evaluation criteria for CAN transceivers with partial networking functionality . 28
Table 23 – Specific definition for test procedure for evaluation of CAN transceiver
partial networking function . 28
Table 24 – Evaluation criteria for CAN transceivers with FD functionality . 29
Table 25 – Definitions for violation masks for CAN transceivers with FD functionality . 30
Table 26 – Evaluation criteria for CAN transceivers with SIC and FD functionality . 32
Table 27 – Definitions for violation masks for CAN transceivers with SIC and FD
functionality . 32
Table 28 – Evaluation criteria for CAN transceiver with SIC functionality under signal
ringing network conditions . 34
Table 29 – Procedure and parameter for signal ringing network validation . 35
Table 30 – Evaluation criteria for embedded CAN transceiver . 35
Table 31 – Specific definition for test procedure for evaluation of embedded CAN
transceivers with FD and SIC functionality. . 36
Table 32 – Definition of functional status classes . 39
Table 33 – Settings of the RF measurement equipment . 40
Table 34 – RF emission measurements for classical and embedded CAN transceivers . 41
Table 35 – Specifications for DPI tests . 43
Table 36 – DPI tests for functional status class A evaluation of classical CAN
IC
transceivers with HS functionality . 43
IEC CDV 62228-3 ED2 © IEC 2026

Table 37 – DPI tests for functional status class A evaluation of embedded CAN
IC
transceivers with HS , FD and SIC functionality . 45
Table 38 – DPI tests for functional status class A evaluation of classical CAN
IC
transceivers with PN functionality . 46
Table 39 – DPI tests for functional status class A evaluation of classical CAN
IC
transceivers with FD functionality . 47
Table 40 – DPI tests for functional status class A evaluation of classical CAN
IC
transceivers with SIC functionality . 48
Table 41 – DPI tests for functional status class C or D evaluation of all types of
IC IC
CAN transceivers . 48
Table 42 – Specifications for impulse immunity tests . 50
Table 43 – Parameters for impulse immunity test . 50
Table 44 – Impulse immunity tests for functional status class A evaluation of classical
IC
CAN transceivers with HS functionality . 50
Table 45 – Impulse immunity tests for functional status class A evaluation of
IC
embedded CAN transceivers with HS functionality . 51
Table 46 – Impulse immunity tests for functional status class A evaluation of classical
IC
CAN transceiver with PN functionality . 52
Table 47 – Impulse immunity tests for functional status class A evaluation of classical
IC
and embedded CAN transceivers with FD and SIC functionality . 53
Table 48 – Impulse immunity tests for functional status class C or D evaluation of
IC IC
all types of CAN transceivers . 54
Table 49 – Specifications for direct ESD tests in unpowered mode . 56
Table 50 – ESD tests in unpowered mode for functional status class D evaluation of
IC
CAN transceivers . 57
Table B.1 – Parameters of ESD test circuit board . 71
Table C.1 – Example of limits for impulse immunity for functional status class C or
IC
D 76
IC
Table D.1 – Test procedure and parameters for leakage inductance evaluation . 79
Table D.2 – Leakage inductance measurements . 80
Table D.3 – Leakage inductance mismatch classes . 80
Table D.4 – Test procedure and parameters for 3-port test board characterization . 82
Table D.5 – Test procedure and parameters for S-parameter measurements . 84
Table D.6 – Recommended S-parameter measurements . 84
Table D.7 – Test parameters for ESD damage tests . 88
Table D.8 – Recommended ESD tests for damage . 88
Table D.9 – Test procedure and parameters for RF saturation tests of CMC . 90
Table D.10 – Recommended RF saturation tests for CMC . 91
Table D.11 – Test procedure and parameters for ESD saturation tests at CMC . 93
Table D.12 – Recommended ESD saturation tests for CMC . 94
Table D.13 – ESD saturation voltage classes for CMC . 95
Table E.1 – Specification of ESD suppression device . 96
Table E.2 – Test procedure and parameters for 3-port test board characterization for
ESD suppression device . 100
IEC CDV 62228-3 ED2 © IEC 2026

Table E.3 – Test procedure and parameters for S-parameter measurements at ESD
suppression device . 100
Table E.4 – Recommended S-parameter measurements for ESD suppression device . 101
Table E.5 – Test parameters for ESD damage tests at ESD suppression device . 104
Table E.6 – Recommended ESD tests for damage for ESD suppression device . 105
Table E.7 – Test procedure and parameters for ESD discharge current measurement
test board characterization . 107
Table E.8 – Test parameters for ESD discharge current measurement at ESD
suppression device . 108
Table E.9 – Recommended current measurement for ESD suppression device . 109
Table E.10 – Recommended limits for remaining ESD discharge current after the CAN
test network for ESD suppression device . 109
Table E.11 – Limit classes and related applied ESD test voltages . 110
Table E.12 – Test procedure and parameters for RF clamping tests at ESD
suppression device . 112
Table E.13 – Required RF clamping tests for ESD suppression device . 113
Table F.1 – Bit timings . 115
Table F.2 – Test procedure and implementation of bit asymmetry . 118
Table G.1 – Communication test signal TX2d . 120
Table G.2 – Communication test signal TX2e . 121
Table G.3 – Communication test signal TX2f . 121
Table G.4 – Evaluation criteria for CAN transceivers with SIC and XL functionality in
normal FAST TX mode . 122
Table G.5 – Definitions for violation masks for tests of CAN transceivers with SIC and
XL functionality in FAST TX mode . 123
Table G.6 – Settings of the RF measurement equipment for measurements of CAN
transceivers with SIC and XL functionality in FAST TX mode . 125
Table G.7 – RF emission measurements of CAN transceivers with SIC and XL
functionality in FAST TX mode . 126
Table G.8 – DPI tests for functional status class A evaluation of CAN transceivers
IC
with SIC and XL functionality in FAST TX mode . 127
Table G.9 – Impulse immunity tests for functional status class A evaluation of CAN
IC
transceivers with SIC and XL functionality in FAST TX mode . 127

IEC CDV 62228-3 ED2 © IEC 2026

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Integrated circuits - EMC evaluation of transceivers -
Part 3: CAN transceivers
FOREWORD
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9) IEC draws attention to the possibility that the implementation of this document may involve
the use of (a) patent(s). IEC takes no position concerning the evidence, validity or applicability
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IEC CDV 62228-3 ED2 © IEC 2026

information, which may be obtained from the patent database available at https://patents.iec.ch.
IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62228-3 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition of IEC 62228 published in 2019. It
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) introduction of embedded CAN transceivers, test descriptions in the respective subclauses
of the document;
b) introduction of CAN transceiver with SIC functionality, test descriptions in the respective
subclauses of the document;
c) additional saturation of common mode chokes at ESD in Annex D;
d) additional informative Annex for characterization of ESD suppression devices for CAN bus
interfaces
e) additional informative Annex for Bit asymmetry definition for embedded CAN transceiver
test
f) additional informative Annex for EMC tests for CAN transceiver with XL functionality
The text of this International Standard is based on the following documents:
Draft Report on voting
XX/XX/FDIS XX/XX/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62228 series, published under the general title Integrated circuits -
EMC evaluation of transceivers, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
– reconfirmed,
– withdrawn, or
– revised.
IEC CDV 62228-3 ED2 © IEC 2026

IEC CDV 62228-3 ED2 © IEC 2026

1 Scope
This part of IEC 62228 specifies test and measurement methods for EMC evaluation of CAN
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for different
transceiver types as classical CAN transceiver and embedded CAN transceiver and for different
functionalities as CAN HS-, CAN FD
...