SIST EN 61191-4:2019

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The
requirements pertain to those assemblies that are entirely terminal/wire interconnecting
structures or to the terminal/wire portions of those assemblies that include other related
technologies (i.e. surface mounting, through-hole mounting, chip mounting).

Elektronikaufbauten auf Leiterplatten - Teil 4: Rahmenspezifikation - Anforderungen an gelötete Baugruppen mit Lötstützpunkten

Ensembles de cartes imprimées - Partie 4: Spécification intermédiaire - Exigences relatives à l'assemblage de bornes par brasage

L’IEC 61191-4:2017 donne des exigences relatives à l'assemblage de bornes par brasage. Les exigences de la présente spécification s'appliquent aux ensembles entièrement constitués d'après des structures d'interconnexion borne/fil et aux portions borne/fil de ces ensembles incluant d'autres techniques associées (par exemple montage en surface, montage par trous traversants, montage à puce).
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
Mise à jour des exigences pour satisfaire aux critères d’acceptation décrits dans l’IPC‑A‑610F.

Sestavi plošč tiskanih vezij - 4. del: Področna specifikacija - Zahteve za sestave s spajkalnimi priključki

Ta del standarda IEC 61191 določa zahteve za sestave s spajkalnimi priključki. Zahteve se nanašajo na sestave, ki v celoti uporabljajo strukture za medsebojno povezovanje priključkov/žic, ali dele priključkov/žic teh sestavov, ki uporabljajo druge sorodne tehnologije (npr. nameščanje na površino, nameščanje skozi odprtine, nameščanje čipov).

General Information

• Status: Published
• Publication Date: 11-Mar-2019
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 18-Feb-2019
• Due Date: 25-Apr-2019
• Completion Date: 12-Mar-2019
• Ref Project: EN 61191-4:2017 - Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Relations

• Revised: SIST EN 61191-4:2001 - Printed board assemblies -- Part 4: Sectional specification - Requirements for terminal soldered assemblies
• Effective Date: 01-Nov-2016
• Replaces: SIST EN 61191-4:2001 - Printed board assemblies -- Part 4: Sectional specification - Requirements for terminal soldered assemblies
• Effective Date: 13-Nov-2017
• Replaces: SIST EN 61191-4:2001 - Printed board assemblies -- Part 4: Sectional specification - Requirements for terminal soldered assemblies
• Effective Date: 07-Jun-2022

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61191-4:2019
01-april-2019
1DGRPHãþD
SIST EN 61191-4:2001
6HVWDYLSORãþWLVNDQLKYH]LMGHO3RGURþQDVSHFLILNDFLMD=DKWHYH]DVHVWDYHV
VSDMNDOQLPLSULNOMXþNL
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal
soldered assemblies
Elektronikaufbauten auf Leiterplatten - Teil 4: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen mit Lötstützpunkten
Ensembles de cartes imprimées - Partie 4: Spécification intermédiaire - Exigences
relatives à l'assemblage de bornes par brasage
Ta slovenski standard je istoveten z: EN 61191-4:2017
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61191-4:2019 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61191-4:2019

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SIST EN 61191-4:2019


EUROPEAN STANDARD EN 61191-4

NORME EUROPÉENNE

EUROPÄISCHE NORM
October 2017
ICS 31.240 Supersedes EN 61191-4:1998
English Version
Printed board assemblies - Part 4: Sectional specification -
Requirements for terminal soldered assemblies
(IEC 61191-4:2017)
Ensembles de cartes imprimées - Partie 4: Spécification Elektronikaufbauten auf Leiterplatten - Teil 4:
intermédiaire - Exigences pour les assemblages soudés Rahmenspezifikation - Anforderungen an gelötete
des terminaux Baugruppen mit Lötstützpunkten
(IEC 61191-4:2017) (IEC 61191-4:2017)
This European Standard was approved by CENELEC on 2017-08-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 61191-4:2017 E

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SIST EN 61191-4:2019
EN 61191-4:2017

European foreword
The text of document 91/1399/CDV, future edition 2 of IEC 61191-4, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61191-4:2017.

The following dates are fixed:
• latest date by which the document has to be (dop) 2018-05-30
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2020-08-30
• latest date by which the national
standards conflicting with the
document have to be withdrawn

This document supersedes EN 61191-4:1998.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61191-4:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-20:2008 NOTE Harmonized as EN 60068-20:2008 (not modified).
IEC 60068-2-58:2015 NOTE Harmonized as EN 60068-2-58:2015 (not modified).
IEC 61188-5-1:2002 NOTE Harmonized as EN 61188-5-1:2002 (not modified).
IEC 61188-5-2:2003 NOTE Harmonized as EN 61188-5-2:2003 (not modified).
IEC 61188-5-3:2007 NOTE Harmonized as EN 61188-5-3:2007 (not modified).
IEC 61188-5-4:2007 NOTE Harmonized as EN 61188-5-4:2007 (not modified).
IEC 61188-5-5:2007 NOTE Harmonized as EN 61188-5-5:2007 (not modified).
IEC 61188-5-6:2003 NOTE Harmonized as EN 61188-5-6:2003 (not modified).
IEC 61188-7:2017 NOTE Harmonized as EN 61188-7:2017 (not modified).
IEC 61189-2:2006 NOTE Harmonized as EN 61189-2:2006 (not modified).
IEC 61190-1-2:2014 NOTE Harmonized as EN 61190-1-2:2014 (not modified).
IEC 61193-1:2001 NOTE Harmonized as EN 61193-1:2002 (not modified).
IEC 61193-3 NOTE Harmonized as EN 61193-3.
IEC 62326-1:2002 NOTE Harmonized as EN 62326-1:2002 (not modified).
IEC 62326-4:1996 NOTE Harmonized as EN 62326-4:1997 (not modified).
IEC 62326-4-1:1996 NOTE Harmonized as EN 62326-4-1:1997 (not modified).
ISO 9001:2015 NOTE Harmonized as EN ISO 9001:2015 (not modified).
2

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SIST EN 61191-4:2019
EN 61191-4:2017
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.

NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.

NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.

Publication Year Title EN/HD Year

IEC 60194 -  Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61191-1 2013 Printed board assemblies - Part 1: Generic EN 61191-1 2013
specification - Requirements for soldered
electrical and electronic assemblies using
surface mount and related assembly
technologies

3

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SIST EN 61191-4:2019

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SIST EN 61191-4:2019



IEC 61191-4

®


Edition 2.0 2017-07




INTERNATIONAL



STANDARD



















Printed board assemblies –

Part 4: Sectional specification – Requirements for terminal soldered assemblies



























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.240 ISBN 978-2-8322-4657-3



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

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SIST EN 61191-4:2019
– 2 – IEC 61191-4:2017 © IEC 2017

CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General requirements . 6
5 General terminal and part mounting requirements. 6
5.1 General . 6
5.2 Wire and cable preparation . 7
5.2.1 General . 7
5.2.2 Tinning of stranded wire . 7
5.3 Terminal installation . 7
5.3.1 General . 7
5.3.2 Terminal mounting (mechanical) . 7
5.3.3 Terminal shank discontinuities . 8
5.3.4 Flange discontinuities . 8
5.3.5 Terminal mounting (electrical) . 8
5.3.6 Flange angles . 9
5.3.7 Shank discontinuities . 9
5.3.8 Flared flange discontinuities . 9
5.4 Mounting to terminals . 10
5.4.1 General . 10
5.4.2 Wire and lead wrap-around . 10
5.4.3 Side route connection . 10
5.4.4 Top and bottom route connection . 11
5.4.5 Continuous runs . 12
5.4.6 Service loops . 13
5.4.7 Insulation clearance . 13
5.4.8 Orientation of wire wrap . 14
5.4.9 Stress relief . 14
5.4.10 Pierced or perforated terminals . 14
5.4.11 Cup and hollow cylindrical terminal soldering . 15
6 Acceptance requirements . 16
6.1 General . 16
6.2 Control and corrective actions . 16
6.3 Terminal soldering . 16
6.3.1 General . 16
6.3.2 Wire-terminal attachment . 16
6.4 Part marking and reference designations . 16
7 Rework of unsatisfactory soldered connections. 16
Bibliography . 18

Figure 1 – Rolled flange terminal . 8
Figure 2 – Rolled flange discontinuities . 8
Figure 3 – Flared flange terminals. 9
Figure 4 – Flared angles . 9

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SIST EN 61191-4:2019
IEC 61191-4:2017 © IEC 2017 – 3 –
Figure 5 – Wire and lead wrap around . 10
Figure 6 – Side route connections and wrap on bifurcated terminal . 11
Figure 7 – Top and bottom route terminal connection . 12
Figure 8 – Continuous run wire wraps . 13
Figure 9 – Service loop for lead wiring . 13
Figure 10 – Insulation clearance measurement (c) . 14
Figure 11 – Stress relief examples . 14
Figure 12 – Pierced or perforated terminal wire wrap . 15

Table 1 – Nicked or broken strand limits . 7
Table 2 – Plated through-holes with terminals, minimum acceptance conditions . 16
Table 3 – Defects for terminal attachment and soldering defects . 17

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SIST EN 61191-4:2019
– 4 – IEC 61191-4:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PRINTED BOARD ASSEMBLIES –

Part 4: Sectional specification –
Requirements for terminal soldered assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61191-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition published in 1998. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
• The requirements have been updated to be compliant with the acceptance criteria in
IPC-A-610F.

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SIST EN 61191-4:2019
IEC 61191-4:2017 © IEC 2017 – 5 –
The text of this International Standard is based on the following documents:
CDV Report on voting
91/1399/CDV 91/1434/RVC

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61191 series, published under the general title Printed board
assemblies, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

A bilingual version of this publication may be issued at a later date.

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SIST EN 61191-4:2019
– 6 – IEC 61191-4:2017 © IEC 2017
PRINTED BOARD ASSEMBLIES –

Part 4: Sectional specification –
Requirements for terminal soldered assemblies



1 Scope
This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The
requirements pertain to those assemblies that are entirely terminal/wire interconnecting
structures or to the terminal/wire portions of those assemblies that include other related
technologies (i.e. surface mounting, through-hole mounting, chip mounting).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61191-1:2013, Printed board assemblies – Part 1: Generic specification – Requirements
for soldered electrical and electronic assemblies using surface mount and related assembly
technologies
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 General requirements
Requirements of IEC 61191-1 are a mandatory part of this specification.
Workmansh
...