SIST EN 60749-26:2007

Semiconductor devices - Mechanical and climatic test methods -- Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

This part of IEC 60749 establishes a standard procedure for testing and classifying semiconductor devices according to their susceptibility to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The objective is to provide reliable, repeatable HBM ESD test results so that accurate classifications can be performed. This test method is applicable to all semiconductor devices and is classified as destructive. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. The HBM and MM test methods produce similar but not identical results; unless otherwise specified, this test method is the one selected.

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren -- Teil 26: Prüfung der Empfindlichkeit gegen elektrostatische Entladungen (ESD) - Human Body Model (HBM)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques -- Partie 26: Essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain (HBM)

Etablit une procédure normalisée pour les essais et la classification des dispositifs à semiconducteurs en fonction de leu sensibilité aux dommagesou de leur dégradation suite à leur exposition à des déchargesélectrostatiques (DES) sur un modèle decorps humain (HBM). Le but de cette norme est de fournir des résultats d essai de DES HBM fiables et reproductibles de manière que des classifications précises puissent être réalisées. Cette méthode d essai est applicable à tous lesdispositifs à semiconducteurs et elle est classée destructive

Polprevodniški elementi - Mehanske in klimatske preskusne metode - 26. del: Preskušanje občutljivosti na elektrostatične izpraznitve (ESD) - Model človeškega telesa (HBM) (IEC 60749-26:2006)

General Information

• Status: Withdrawn
• Publication Date: 31-Dec-2006
• Withdrawal Date: 07-Mar-2017
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 08-Mar-2017
• Due Date: 31-Mar-2017
• Completion Date: 08-Mar-2017
• Ref Project: EN 60749-26:2006 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

Relations

• Revised: SIST EN 60749-26:2014 - Semiconductor devices - Mechanical and climatic test methods -- Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
• Effective Date: 06-May-2014
• Replaced By: SIST EN 60749-26:2014 - Semiconductor devices - Mechanical and climatic test methods -- Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-26:2014 - Semiconductor devices - Mechanical and climatic test methods -- Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-26:2014 - Semiconductor devices - Mechanical and climatic test methods -- Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
• Effective Date: 24-Sep-2013

Standards Content (Sample)

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EUROPEAN STANDARD
EN 60749-26

NORME EUROPÉENNE
August 2006
EUROPÄISCHE NORM

ICS 31.080.01


English version


Semiconductor devices -
Mechanical and climatic test methods
Part 26: Electrostatic discharge (ESD) sensitivity testing -
Human body model (HBM)
(IEC 60749-26:2006)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 26: Essai de sensibilité aux Teil 26: Prüfung der Empfindlichkeit
décharges électrostatiques (DES) - gegen elektrostatische Entladungen
Modèle du corps humain (HBM) (ESD) -
(CEI 60749-26:2006) Human Body Model (HBM)
(IEC 60749-26:2006)




This European Standard was approved by CENELEC on 2006-08-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-26:2006 E

---------------------- Page: 2 ----------------------

EN 60749-26:2006 - 2 -
Foreword
The text of document 47/1859/FDIS, future edition 2 of IEC 60749-26, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-26 on 2006-08-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-05-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-08-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-26:2006 was approved by CENELEC as a European
Standard without any modification.
__________

---------------------- Page: 3 ----------------------

- 3 - EN 60749-26:2006
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1) 2)
IEC 60749-27 - Semiconductor devices - Mechanical and EN 60749-27 2006
climatic test methods
Part 27: Electrostatic discharge (ESD)
sensitivity testing - Machine model (MM)


1) 2)
IEC 61340-3-1 - Electrostatics EN 61340-3-1 2002
Part 3-1: Methods for simulation of
electrostatic effects - Human body model
(HBM) - Component testing




1)
Undated reference.
2)
Valid edition at date of issue.

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NORME CEI
INTERNATIONALE
IEC



60749-26
INTERNATIONAL


Deuxième édition
STANDARD

Second edition

2006-07


Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques
et climatiques –
Partie 26:
Essai de sensibilité aux décharges
électrostatiques (DES) –
Modèle du corps humain (HBM)

Semiconductor devices –
Mechanical and climatic test methods –
Part 26:
Electrostatic discharge (ESD)
sensitivity testing –
Human body model (HBM)
 IEC 2006 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
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Pour prix, voir catalogue en vigueur
For price, see current catalogue

---------------------- Page: 5 ----------------------

60749-26  IEC:2006 – 3 –
CONTENTS
FOREWORD.5

1 Scope.9
2 Normative references .9
3 Terms and definitions .9
4 Equipment .11
4.1 HBM ESD waveform generator .11
4.2 Waveform verification equipment.11
5 HBM current waveform requirements .15
5.1 General .15
5.2 Waveform qualification and verification .19
6 Device specific evaluation considerations.19
6.1 Sample size and test conditions .19
6.2 Worst-case pin or standard qualification board .19
7 Test procedure for classification .23
7.1 Device requirements .23
7.2 Device selection .23
7.3 Device characterisation .23
7.4 Device stress levels .23
7.5 Pin combinations .23
7.6 Order of test.25
8 Failure criteria .25
9 Classification criteria .25
10 Summary.26

Figure 1 – HBM ESD waveform generator equivalent.13
Figure 2 – Typical current waveforms .17
Figure 3 – Typical current waveform through a 500 Ω resistor.19

Table 1 – Waveform specification .15
Table 2 – Pin combinations for integrated circuits .25

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60749-26  IEC:2006 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 26: Electrostatic discharge (ESD) sensitivity testing –
Human body model (HBM)


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-26 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition, published in 2003, and has been
revised in collaboration with technical committee 101. Whilst it does not contain any major
technical changes, reference is now made, where necessary, to IEC 61340-3-1.

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60749-26  IEC:2006 – 7 –
The text of this standard is based on the following documents:
FDIS Report on voting
47/1859/FDIS 47/1871RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

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60749-26  IEC:2006 – 9 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 26: Electrostatic discharge (ESD) sensitivity testing –
Human body model (HBM)



1 Scope
This part of IEC 60749 establishes a standard procedure for testing and classifying
semiconductor devices according to their susceptibility to damage or degradation by exposure
to a defined human body model (HBM) electrostatic discharge (ESD). The objective is to
provide reliable, repeatable HBM ESD test results so that accurate classifications can be
performed.
This test method is applicable to all semiconductor devices and is classified as destructive.
ESD testing of semiconductor devices is selected from this test method, the machine model
(MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series.
The HBM and MM test methods produce similar but not identical results; unless otherwise
specified, this test method is the one selected.
NOTE Certain clauses in this test method are in accordance with IEC 61340-3-1.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60749-27, Semiconductor devices – Mechanical and climatic test methods – Part 27:
Electrostatic discharge (ESD) sensitivity testing – Machine model (MM)
IEC 61340-3-1:Electrostatic
...