SIST EN 61967-6:2005/A1:2008
(Amendment)Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 6: Measurement of conducted emissions - Magnetic probe method
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 6: Measurement of conducted emissions - Magnetic probe method
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz -- Teil 6: Messung der leitungsgeführten Aussendungen - Magnetsondenverfahren
Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz -- Partie 6: Mesure des émissions conduites - Méthode de la sonde magnétique
Integrirana vezja - Meritve elektromagnetnega sevanja od 150 kHz do 1 GHz - 6. del: Meritve prevajanega sevanja - Metoda z magnetno sondo (IEC 61967-6:2002/A1:2008)
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Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 61967-6:2005/A1:2008
01-julij-2008
Integrirana vezja - Meritve elektromagnetnega sevanja od 150 kHz do 1 GHz - 6.
del: Meritve prevajanega sevanja - Metoda z magnetno sondo (IEC 61967-
6:2002/A1:2008)
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part
6: Measurement of conducted emissions - Magnetic probe method (IEC 61967-
6:2002/A1:2008)
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im
Frequenzbereich von 150 kHz bis 1 GHz - Teil 6: Messung der leitungsgeführten
Aussendungen - Magnetsondenverfahren (IEC 61967-6:2002/A1:2008)
Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz - Partie
6: Mesure des émissions conduites - Méthode de la sonde magnétique (CEI 61967-
6:2002/A1:2008)
Ta slovenski standard je istoveten z: EN 61967-6:2002/A1:2008
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 61967-6:2005/A1:2008 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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EUROPEAN STANDARD
EN 61967-6/A1
NORME EUROPÉENNE
May 2008
EUROPÄISCHE NORM
ICS 31.200
English version
Integrated circuits -
Measurement of electromagnetic emissions, 150 kHz to 1 GHz -
Part 6: Measurement of conducted emissions -
Magnetic probe method
(IEC 61967-6:2002/A1:2008)
Circuits intégrés - Integrierte Schaltungen -
Mesure des émissions électromagnétiques, Messung von elektromagnetischen
150 kHz à 1 GHz - Aussendungen im Frequenzbereich
Partie 6: Mesure des émissions conduites - von 150 kHz bis 1 GHz -
Méthode de la sonde magnétique Teil 6: Messung der leitungsgeführten
(CEI 61967-6:2002/A1:2008) Aussendungen -
Magnetsondenverfahren
(IEC 61967-6:2002/A1:2008)
This amendment A1 modifies the European Standard EN 61967-6:2002; it was approved by CENELEC on
2008-04-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this amendment the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61967-6:2002/A1:2008 E
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EN 61967-6:2002/A1:2008 - 2 -
Foreword
The text of document 47A/781/FDIS, future amendment 1 to IEC 61967-6:2002, prepared by SC 47A,
Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel
vote and was approved by CENELEC as amendment A1 to EN 61967-6:2002 on 2008-04-01.
The following dates were fixed:
– latest date by which the amendment has to be
implemented at national level by publication of
an identical national standard or by endorsement (dop) 2009-01-01
– latest date by which the national standards conflicting
with the amendment have to be withdrawn (dow) 2011-04-01
__________
Endorsement notice
The text of amendment 1:2008 to the International Standard IEC 61967-6:2002 was approved by
CENELEC as an amendment to the European Standard without any modification.
__________
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IEC 61967-6
Edition 1.0 2008-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method
Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
R
CODE PRIX
ICS 31.200 ISBN 2-8318-9641-X
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– 2 – 61967-6 Amend. 1 © IEC:2008
FOREWORD
This amendment has been prepared by subcommittee 47A: Integrated circuits, of IEC
technical committee 47: Semiconductor devices.
The text of this amendment is based on the following documents:
FDIS Report on voting
47A/781/FDIS 47A/784/RVD
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Page 49
Add the following new Annex E:
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61967-6 Amend. 1 © IEC:2008 – 3 –
Annex E
(informative)
Advanced magnetic probe
E.1 General
The miniature magnetic probe (advanced magnetic probe) has a high spatial resolution, and it
enables accurate measurement of near magnetic fields of IC packages and dense PCBs. It
should be made of a low temperature co-fired ceramics (LTCC) board and its detecting part
(detecting loop) should be about 2 mm wide and 1 mm thick. The miniaturization may cause a
decrease of probe sensitivity of magnetic field, due to the reduction of loop size. The details
of probe design are shown in Figures E.1, E.2, E.3 and E.4. However, the lower sensitivity to
magnetic field is compensated by the decrease of necessary gain, resulting from the
possibility of placement of the new probe loop edge closer to the microstrip line than it was
before.
E.2 Advanced magnetic probe fixture
The previous model of magnetic field probe is a shielded loop probe, made by using
multilayer FR4-PCB. The loop part of the previous magnetic field probe cannot be made small
enough to measure current at short trace on PCB. The new model is made by precise glass
ceramic multi-layer board, enabling both compactness and high spatial resolution.
Figures E.1 and E.2 show an external view of the probe. The size of the magnetic detecting
loop is reduced to 2 mm width x 1 mm thickness. The advanced magnetic probe should be a
tri-plate strip line composed of a three-layer LTCC board. Recommended probe construction
details are shown in Figures E.3, E.4, E.5, E.6, E.7 and E.8. In all figures, braces ( ) indicate
that the enclosed values are examples. Other dimensions shall be within tolerances described
below. If the loop part does not fall within tolerance limits, measurement error will increase.
A semi-rigid cable can be attached at the junction area which is shown as Figures E.1 and E.2.
Junction for the connection should have characteristic impedance of 50 Ω up to 3 GHz. The
connection construction which is shown in the figures is one example of connection between
LTCC board and semi-rigid coaxial cable. Other constructions which provide good high-
frequency connectivity are acceptable.
In Figures E.4, E.5, E.6 and E.7, the relative dielectric constant of the board material is 7,1,
and the printed pattern on an LTCC board is formed with Ag-Pd paste. In these figures,
finished dimensions of printed pattern of loop portion may have a tolerance rating of ±2,5
percent. Dimensions with braces also may have a tolerance rating of ±10 percent. The
conductors are 15 μm thick with a tolerance of ±5 μm. The insulators (dielectric) are 120 μm
thick with a tolerance rating of ±10 percent. The ground pads on the first layer and the fifth
layer are coated with about 30 μm (thickness) of gold (Au) plating. Therefore the thickness of
the ground pad may be increased, so as to solder the pads to conductor case. Unless
otherwise specified, dimensions of printed pattern may have a tolerance rating of ±10 percent.
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– 4 – 61967-6 Amend. 1 © IEC:2008
Shielded loop structure is used for detecting part for magnetic field. This part shall be
fabricated precisely using precise LTCC process. Figure E.3 shows the superimposed main
pattern of the magnetic field detector made by using a 5-layer glass ceramic board. The
second and forth layers are ground layers corresponding to the outer sheath of a coaxial
cable; the third layer is the signal layer, equivalent to the core conductor. The loop and lead
portion of the multilayer board of the new probe is symmetrical about the third layer except via
and signal pattern. The strip line was designed to have a characteristic impedance of 50 Ω, in
consideration of impedance matching with the measurement system. The end of the signal
line is passed through a via-hole and connected to ground.
The previous probe has apertures in the sides of the tri-plate strip line (lead portion), but both
sides of the ground pattern on the second layer are connected to the fourth layer by via-hole
as shown in Figure E.3. The via-hole shall be formed with a pitch of 0,25 mm or less. The loop
serving as the magnetic field detector is a rectangle 0,2 mm x 1 mm, and the spatial
resolution can be raised to 250 μm (typical) at the 6 dB degrading point. If the target of
measurement is a straight trace such as a microstrip line, the current calibration coefficient
can be used to convert measured magnetic field over a trace into current. About the pattern
on each layer of the LTCC board, the amount of deviation from perfect alignment shall be
within 10 μm. The performance of the probe will decrease when the alignment error increases,
because the characteristic impedance of the strip line of the probe deviates from 50 Ω. Taking
screening test by x-rays, nonconforming items where the alignment error exceeds 10 μm shall
be rejected. Furthermore, the front end face of the LTCC board shall be precisely cut and
polished flat.
The ground pads on the first layer and the fifth layer are shown in Figures E.4 and E.7. The
pad of the first layer is connected to the second layer by via-holes and the pad of the fifth
layer is connected to the fourth layer by enough number of vias, respectively. The ground pad
on the fifth layer is extended, when compared to that on the first layer. As shown in Figures
E.5 to E.6, the trace width is tapered down to a narrow trace. As shown in Figures E.4 and
E.7, the ground patterns are also tapered, because the second and fourth layer patterns are
tapered. Figure E.8 shows the configuration for connection of the LTCC board and the semi-
rigid coaxial cable. The joint construction consists of conductor case, step part of LTCC board
and semi-rigid coaxial cable. As shown in Figure E.8, the central conductor of the semi-rigid
coaxial cable is connected to the signal pad on the third layer of the LTCC board by solder.
LTCC board has a step, so the signal pattern on the third layer is exposed. The central
conductor of the semi-rigid cable can be mounted on signal pattern in parallel with signal
pattern. The outer conductor of the semi-rigid coaxial cable is contacted with the rear edge of
the LTCC board. Further, the conductor case (Cu) is connected to the ground pads on the
first and the fifth layers by solder so as to cover and surround a joint part of the central
conductor. The conductor case shall be connected to the outer conductor by solder. Here, the
ground pad, the outer conductor and the conductor case may preferably be solder-connected
to one another without any clearance. The shield performance of the joint section is enhanced
by the conductor case, so that electromagnetic interference of a sensor output signal with an
outcoming noise or another wiring signal can be suppressed. The characteristic impedance of
joint section including conductor case shall be designed by adjusting the dimensions of the
signal pads and the conductor case, a reflection loss due to impedance mismatching is
suppressed so that a high-frequency signal transmission characteristic can be made
satisfactory.
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61967-6 Amend. 1 © IEC:2008 – 5 –
SMA connector
Semi-rigid coaxial cable
LTCC board
(magnetic loop)
A
Conductor case
(metal)
IEC 234/08
Figure E.1 – Illustration of the assembled advanced magnetic probe
(Solder metal case to outer sheath
Metal case
of the semi-rigid coaxial cable)
(Solder metal case to the ground
pad on first and fifth layer)
Semi-rigid
coaxial cable
LTCC board Ground pad
Solder joint
IEC 235/08
Figure E.2 – Enlarged view of part A of Figure E.1
(an example of connection construction)
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– 6 – 61967-6 Amend. 1 © IEC:2008
Dimensions in millimetres
Outline of glass
ceramic board
Signal pattern on layer 3
Joint portion for
semi-rigid coaxial
cable, straight
connection is
Ground plane patterns
recommended
on layers 2 and 4
Blind via through
layers 2 and 4
(pitch is 0,25 or less)
Lead portion
50 Ω strip line
Loop portion
for magnetic
field detection
(2,0) (1,0)
Via through layers 2, 3, and 4
IEC 236/08
Figure E.3 – Main pattern (layer 2 to 4) of advanced magnetic probe
Dimensions in millimetres
Joint portion for
semi-rigid coaxial cable
0,6
Edge of the
LTCC board
(1,6)
Outline of glass
ceramic board
IEC 237/08
Figure E.4 – Layer 1 (ground pattern) of advanced magnetic probe
(5,0)
(5,0) (2,8) (0,2)
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61967-6 Amend. 1 © IEC:2008 – 7 –
Dimensions in millimetres
Joint portion for
semi-rigid coaxial
cable
Blind via (pitch is
0,6
0,25 or less)
Center of the
loop aperture
Edge of the
LTCC board
Via
0,25
∅ 0,1
0,05
Gap width
0,3 0,3
1,0
1,6
Outline of glass
ceramic board
IEC 238/08
Figure E.5 – Layer 2 and 4 (ground pattern) of advanced magnetic probe
Dimensions in millimetres
This pad is soldered
to center conductor of
semi-rigid coaxial cable
0,05
(line width)
Center of line
0,05
(line width)
Center of line
Edge of the
0,25
LTCC board
Via 0,9
∅0,1
Outline of glass
ceramic board
IEC 239/08
Figure E.6 – Layer 3 (signal pattern) of advanced magnetic probe
0,8
0,2
0,15 0,15
0,3 0,3
Center of line
0,05
(line width)
Center of line
(7,3) (1,8) (0,05)
(0,2)
(2,8)
(5,0)
0,45
(0,2)
0,5
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– 8 – 61967-6 Amend. 1 © IEC:2008
Dimensions in millimetres
Joint area for
semi-rigid
coaxial cable
0,6
Edge of the
LTCC board
(1,6)
Outline of glass
ceramic board
IEC 240/08
Figure E.7 – Layer 5 (ground pattern) of advanced magnetic probe
Dimensions in millimetres
A
Semi-rigid coaxial cable
Central conductor
of the semi-rigid
coaxial cable
Blind
via
Conductor case
Signal pad on third layer
First layer
(conductor thickness is about
Fifth layer (conductor
45 μm including plating)
thickness is 45 μm
including plating)
Second layer
(conductor thickness is 15 μm)
Fourth layer
(conductor thickness is 15 μm)
Third layer
(t ) t t (t )
2 1 1
2
(conductor thickness is 15 μm)
(1,0)
A’
Solder joint
(2,0)
t = 0,12 (Insulator thickness)
1
t = 0,38 (Insulator thickness)
2 IEC 241/08
(a) Top view (b) Section A-A’
Figure E.8 – Construction of advanced magnetic probe
(10)
(5,0) (4,8)
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61967-6 Amend. 1 © IEC:2008 – 9 –
The output voltage of the magnetic probe (V ) depends on the distance (D ) between the loop
p m
center and the surface of the strip conductor under measurement. In Figure E.9, the strip
conductor width is 1,0 mm, when the insulator thickness of the test board is 0,6 mm. The
characteristic impedance is 50 Ω ± 5 Ω. The thickness of copper film (strip conductor) shall be
standardized. The film could be standardized to a thickness between 18 μm to 35 μm, while
35 μm is recommended. As shown in Figure E.10, the loop center is defined as the
rectangular aperture of the ground patterns on the second layer and the fourth layer. This
makes it very critical to maintain a 0,47 mm (470 μm) ± 20 μm distance between the strip
conductor and the center of the aperture of loop during the measurement. Therefore, a probe
spacing fixture should be used to maintain 0,07 mm spacing between the bottom of the
rectangular loop portion of the probe and the probe tip. The value of D is 0,47 mm.
m
Dimensions in millimetres
Conductor of
the second layer
Conductor of
the third layer
Conductor of
the fourth layer
Probe (LTCC board)
Edge of the
ground pattern
Center of aperture
Surface of
strip conductor
1,0
Ground (Resist coating
Strip
plane Dielectric is optional)
conductor
*D = Distance between strip conductor surface and center
m
of rectangular aperture of loop (loop center)
IEC 242/08
...
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