SIST EN IEC 61967-8:2023

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (IEC 61967-8:2023)

IEC 61967-8:2023 is available as IEC 61967-8:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61967-8:2023 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This edition includes the following significant technical changes with respect to the previous edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.

Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8: Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren (IEC 61967-8:2023)

Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI (IEC 61967-8:2023)

IEC 61967-8:2023 est disponible sous forme de IEC 61967-8:2023 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

L’IEC 61967-8:2023 définit une méthode de mesure des émissions électromagnétiques rayonnées d’un circuit intégré (CI) à l’aide d’une ligne TEM à plaques (stripline) pour circuit intégré. Le CI à évaluer est monté sur une carte d’essai CEM (carte à circuit imprimé) entre le conducteur actif et le plan de masse du dispositif de la stripline pour CI. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) la plage de fréquences de 150 kHz à 3 GHz a été retirée du domaine d’application;
b) la fréquence utile supérieure est étendue à 6 GHz ou plus dans la mesure où les exigences définies sont remplies.

Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega oddajanja - Metoda z IC na tračnem valovodu (IEC 61967-8:2023)

SIST EN IEC 61967-8:2023 je na voljo kot standard IEC 61967-8:2023, ki vsebuje mednarodni standard in njegovo različico z revizijami, ki prikazujejo vse spremembe tehnične vsebine v primerjavi s prejšnjo izdajo. Standard IEC 61967-8:2023 določa metodo za merjenje elektromagnetnega sevanega oddajanja iz integriranega vezja (IC) z uporabo tračnega valovoda. Integrirano vezje, ki se vrednoti, je nameščeno na plošči tiskanega vezja (PCB) za preskus elektromagnetne združljivosti (EMC) med aktivnim vodnikom in ozemljitveno ploščo v ureditvi tračnega valovoda. Ta izdaja v primerjavi s prejšnjo vključuje naslednje pomembne tehnične spremembe:
a) iz področja uporabe je bilo izbrisano frekvenčno območje med 150 kHz in 3 GHz;
b) razširitev zgornje uporabne frekvence na 6 GHz ali več, če so izpolnjene opredeljene zahteve.

General Information

• Status: Published
• Public Enquiry End Date: 20-Oct-2022
• Publication Date: 17-Aug-2023
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 14-Jun-2023
• Due Date: 19-Aug-2023
• Completion Date: 18-Aug-2023
• Directive: 2014/30/EU - Directive 2014/30/EU of the European Parliament and of the Council of 26 February 2014 on the harmonisation of the laws of the Member States relating to electromagnetic compatibility (recast)
• Ref Project: EN IEC 61967-8:2023 - Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

Relations

• Replaces: SIST EN 61967-8:2012 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 8: Measurement of radiated emissions - IC stripline method
• Effective Date: 01-Sep-2023

Overview

EN IEC 61967-8:2023 (equivalent to IEC 61967-8:2023) specifies the IC stripline method for measuring radiated electromagnetic emissions from integrated circuits (ICs). The standard defines how an IC is mounted on an EMC test board (PCB) between the active conductor and the ground plane of an IC stripline arrangement, and sets out test setup, equipment and reporting requirements. This edition supersedes EN 61967-8:2011 and is available as an RLV (Redline version) showing technical changes compared to the previous edition.

Key topics

• Scope and frequency limits
  • The previous scope reference to 150 kHz–3 GHz was removed.
  • The upper usable frequency is extended to 6 GHz or higher, provided the defined requirements are met.
• Test configuration and equipment
  • IC mounted in a stripline (TEM) arrangement on an EMC test board (PCB).
  • Required equipment includes RF measuring instruments, preamplifiers, the IC stripline, and 50 Ω termination.
• Test conditions and procedures
  • Requirements for supply voltage, ambient conditions, operational checks and verification of stripline RF characteristics.
  • Defined test technique, measurement methods and criteria for repeatability.
• Reporting and reference levels
  • Detailed test report content and IC emissions reference levels for characterization.
• Supporting material
  • Annex A: IC stripline description (geometry, characteristic impedance, examples).
  • Annex B: Specification and presentation of emission levels.

Applications

• Use this standard when performing laboratory measurements of radiated emissions from ICs to evaluate EMC behavior early in device design or for compliance characterization.
• Applicable to semiconductor device manufacturers, EMC test labs, PCB designers and compliance engineers who need a replicable, standardized method for IC-level radiated emissions testing.
• Useful for R&D and pre-compliance testing when assessing how an IC contributes to system-level emissions and when optimizing package, PCB layout or shielding.

Who should use it

• IC designers and manufacturers seeking repeatable radiated-emission data at the device level.
• EMC laboratories performing standardized IC emission characterization.
• System integrators and PCB designers who need to understand IC contribution to product EMC.

Related standards

• EN IEC 61967-1: General conditions and definitions for IC emission measurements.
• IEC 61000-4-20: EMC testing in TEM waveguides (referenced for related test techniques).
• Other parts of the IEC 61967 series for complementary IC emission measurement methods.

Keywords: EN IEC 61967-8:2023, IC stripline, radiated emissions, integrated circuits, EMC test board, PCB, measurement, 6 GHz, stripline method.

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2023
Integrirana vezja - Meritve elektromagnetnega sevanja - 8. del: Merjenje sevanega
oddajanja - Metoda z IC na tračnem valovodu (IEC 61967-8:2023)
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement
of radiated emissions - IC stripline method (IEC 61967-8:2023)
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen - Teil 8:
Messung der abgestrahlten Aussendungen - IC-Streifenleiterverfahren (IEC 61967-
8:2023)
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des
émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI (IEC 61967
-8:2023)
Ta slovenski standard je istoveten z: EN IEC 61967-8:2023
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61967-8

NORME EUROPÉENNE
EUROPÄISCHE NORM June 2023
ICS 31.200 Supersedes EN 61967-8:2011
English Version
Integrated circuits - Measurement of electromagnetic emissions -
Part 8: Measurement of radiated emissions - IC stripline method
(IEC 61967-8:2023)
Circuits intégrés - Mesure des émissions Integrierte Schaltungen - Messung von
électromagnétiques - Partie 8: Mesure des émissions elektromagnetischen Aussendungen - Teil 8: Messung der
rayonnées - Méthode de la ligne TEM à plaques (stripline) abgestrahlten Aussendungen - IC-Streifenleiterverfahren
pour circuit intégré (IEC 61967-8:2023)
(IEC 61967-8:2023)
This European Standard was approved by CENELEC on 2023-06-07. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61967-8:2023 E

European foreword
The text of document 47A/1152/FDIS, future edition 2 of IEC 61967-8, prepared by SC 47A
"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 61967-8:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-03-07
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-06-07
document have to be withdrawn
This document supersedes EN 61967-8:2011 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
This document has been prepared under a Standardization Request given to CENELEC by the
European Commission and the European Free Trade Association.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61967-8:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61967-2 NOTE Approved as EN 61967-2
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-131 - International Electrotechnical Vocabulary - - -
Part 131: Circuit theory
IEC 60050-161 - International Electrotechnical Vocabulary. - -
Chapter 161: Electromagnetic compatibility
IEC 61000-4-20 - Electromagnetic compatibility (EMC) - Part EN IEC 61000-4-20 -
4-20: Testing and measurement
techniques - Emission and immunity
testing in transverse electromagnetic
(TEM) waveguides
IEC 61967-1 - Integrated circuits - Measurement of EN IEC 61967-1 -
electromagnetic emissions - Part 1:
General conditions and definitions

IEC 61967-8 ®
Edition 2.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –

Part 8: Measurement of radiated emissions – IC stripline method

Circuits intégrés – Mesure des émissions électromagnétiques –

Partie 8: Mesure des émissions rayonnées – Méthode de la ligne TEM à plaques

(stripline) pour circuit intégré

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-6932-9

– 2 – IEC 61967-8:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General . 7
5 Test conditions . 7
5.1 General . 7
5.2 Supply voltage . 7
5.3 Frequency range . 7
6 Test equipment . 8
6.1 General . 8
6.2 RF measuring instrument . 8
6.3 Preamplifier . 8
6.4 IC stripline . 8
6.5 50 Ω termination . 8
7 Test set-up . 8
7.1 General . 8
7.2 Test configuration . 9
7.3 EMC test board (PCB) . 9
8 Test procedure . 9
8.1 General . 9
8.2 Ambient conditions. 9
8.3 Operational check . 10
8.4 Verification of IC stripline RF characteristic . 10
8.5 Test technique . 10
9 Test report . 11
9.1 General . 11
9.2 Measurement conditions . 11
10 IC Emissions reference levels . 11
Annex A (normative) IC stripline description . 12
A.1 General . 12
A.2 Characteristic impedance of stripline arrangements . 13
A.3 Conversion for different active conductor heights . 14
A.4 Example for IC stripline arrangement . 14
Annex B (informative) Specification of emission levels . 15
B.1 Scope . 15
B.2 General . 15
B.3 Specification of emission levels . 15
B.4 Presentation of results . 15
Bibliography . 17

Figure 1 – IC stripline test set-up . 9
Figure A.1 – Cross-section view of an example of an unshielded IC stripline . 12
Figure A.2 – Cross-section view of an example of an IC stripline with housing . 12
Figure A.3 – Example of IC stripline with housing . 14

IEC 61967-8:2023 © IEC 2023 – 3 –
Figure B.1 – Emission characterization levels . 16

Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version. 13
Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version . 13

– 4 – IEC 61967-8:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 8: Measurement of radiated emissions –
IC stripline method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61967-8 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition published in 2011. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements
are fulfilled.
IEC 61967-8:2023 © IEC 2023 – 5 –
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1152/FDIS 47A/1153/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts of the IEC 61967 series, under the general title Integrated circuits –
Measurement of electromagnetic emissions can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

– 6 – IEC 61967-8:2023 © IEC 2023
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 8: Measurement of radiated emissions –
IC stripline method
1 Scope
This part of IEC 61967 defines a method for measuring the electromagnetic radiated emission
from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an
EMC test board (PCB) between the active conductor and the ground plane of the IC stripline
arrangement.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-131, International Electrotechnical Vocabulary (IEV) – Part 131: Circuit theory
IEC 60050-161, International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-
magnetic compatibility
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General
conditions and definitions
IEC 61000-4-20, Electromagnetic compatibility (EMC) – Part 4-20: Testing and measurement
techniques – Emission and immunity testing in transverse electromagnetic (TEM) waveguides
3 Terms and definitions
For the purposes of
...