SIST EN 61182-2-2:2012

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

This part of IEC 61182 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2. The IEC 61182-2 contains all the requirements necessary to build an electronic product. The cardinality indicated in the IEC 61182-2 may be superseded by a restriction of an attribute (enumerated string ID) or indication of a requirement that is noted as being optional in the generic standard. However, this standard renders the requirement mandatory based on the supply chain communication need. In order to assist the users of this standard, all the applicable XML schema elements that apply to the board fabrication function are listed in Annex A. The list is grouped by topics and shows the absolute path for the elements that pertain to the focus of this standard. If the parent element is not present no children are considered in the implementation either. However, all attributes identified for a particular element follow the cardinality of the IEC 61182-2, unless a restriction is stated in this standard.

Leiterplatten - Beschreibung und Transfer von Daten - Teil 2-2: Anforderungen für die Anwendung von Dokumentationsdaten der Leiterplattenfertigung

Produits pour cartes imprimées équipées - Données descriptives de fabrication et méthodologie de transfert -- Partie 2-2: Exigences intermédiaires pour la mise en oeuvre de cartes imprimées - Description des données de fabrication

La CEI 61182-2-2:2012 fournit les informations relatives aux exigences de construction utilisées pour fabriquer des cartes imprimées. La présente norme détermine les détails du schéma XML, défini dans la norme générique CEI 61182-2 et certaines des normes intermédiaires qui sont requises pour réaliser les tâches concernées. Lorsque d'autres normes sont associées, leurs exigences deviennent une partie obligatoire des détails de fabrication comme défini dans la CEI 61182-2.

Izdelki s sestavi tiskanih plošč - Podatki o izdelovanju in prenos metodologije - 2-2. del: Posamezne zahteve za uvajanje opisovanja podatkov o izdelavi tiskanih vezij

V tem delu standarda IEC 61182 so navedene informacije o zahtevah za izdelavo tiskanih vezij. Ta standard določa podrobnosti o shemi XML, ki je opredeljena v splošnem standardu IEC 61182-2 in nekaterih področnih standardih, ki se zahtevajo za izvedbo glavnih nalog. Ob sklicevanju na zahteve iz drugih standardov je treba te zahteve obvezno navesti v podrobnih podatkih o proizvodnji iz standarda IEC 61182-2. V standardu IEC 61182-2 so navedene vse potrebne zahteve za izdelavo elektronskih proizvodov. Kardinalnost iz standarda IEC 61182-2 se lahko nadomesti z omejitvijo atributa (našteti ID niza) ali zahtevo, ki je v splošnem standardu opredeljena kot neobvezna. Vendar je v skladu s tem standardom navedena zahteva obvezna zaradi potrebe komunikacije v dobavni verigi. Vsi zadevni elementi sheme XML, ki se uporabljajo pri funkciji izdelave vezij, so v pomoč uporabnikom tega standarda navedeni v dodatku A. Seznam je razporejen glede na teme in prikazuje absolutno pot elementov, na katere se osredotoča ta standard. Če ni osrednjega elementa, se pri izvedbi ne upoštevajo podrejeni elementi. Vendar vsi atributi, ki so opredeljeni za določen element, upoštevajo kardinalnost standarda IEC 61182-2, razen če je v tem standardu navedena omejitev.

General Information

• Status: Published
• Public Enquiry End Date: 27-Feb-2010
• Publication Date: 07-Aug-2012
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 04-Jul-2012
• Due Date: 08-Sep-2012
• Completion Date: 08-Aug-2012
• Ref Project: EN 61182-2-2:2012 - Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61182-2-2:2012
01-september-2012
,]GHONLVVHVWDYLWLVNDQLKSORãþ3RGDWNLRL]GHORYDQMXLQSUHQRVPHWRGRORJLMH
GHO3RVDPH]QH]DKWHYH]DXYDMDQMHRSLVRYDQMDSRGDWNRYRL]GHODYLWLVNDQLK
YH]LM
Printed board assembly products - Manufacturing description data and transfer
methodology - Part 2-2: Sectional requirements for implementation of printed board
fabrication data description
Leiterplatten - Beschreibung und Transfer von Daten - Teil 2-2: Anforderungen für die
Anwendung von Dokumentationsdaten der Leiterplattenfertigung
Produits pour cartes imprimées équipées - Données descriptives de fabrication et
méthodologie de transfert -- Partie 2-2: Exigences intermédiaires pour la mise en oeuvre
de cartes imprimées - Description des données de fabrication
Ta slovenski standard je istoveten z: EN 61182-2-2:2012
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
SIST EN 61182-2-2:2012 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61182-2-2:2012

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SIST EN 61182-2-2:2012

EUROPEAN STANDARD
EN 61182-2-2

NORME EUROPÉENNE
June 2012
EUROPÄISCHE NORM

ICS 31.180


English version


Printed board assembly products -
Manufacturing description data and transfer methodology -
Part 2-2: Sectional requirements for implementation
of printed board fabrication data description
(IEC 61182-2-2:2012)


Produits pour cartes imprimées équipées - Leiterplatten -
Données descriptives de fabrication Beschreibung und Transfer von Daten -
et méthodologie de transfert - Teil 2-2: Anforderungen für die
Partie 2-2: Exigences intermédiaires pour Anwendung von Dokumentationsdaten
la mise en oeuvre de cartes imprimées - der Leiterplattenfertigung
Description des données de fabrication (IEC 61182-2-2:2012)
(CEI 61182-2-2:2012)




This European Standard was approved by CENELEC on 2012-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61182-2-2:2012 E

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SIST EN 61182-2-2:2012
EN 61182-2-2:2012 - 2 -
Foreword
The text of document 91/1025/FDIS, future edition 1 of IEC 61182-2-2, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61182-2-2:2012.
The following dates are fixed:
(dop) 2013-03-01
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2015-06-01
• latest date by which the national
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61182-2-2:2012 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 61188-5-1 NOTE Harmonised as EN 61188-5-1.
IEC 61188-5-2 NOTE Harmonised as EN 61188-5-2.
IEC 61188-5-3 NOTE Harmonised as EN 61188-5-3.
IEC 61188-5-4 NOTE Harmonised as EN 61188-5-4.
IEC 61188-5-5 NOTE Harmonised as EN 61188-5-5.
IEC 61188-5-6 NOTE Harmonised as EN 61188-5-6.
IEC 61188-5-8 NOTE Harmonised as EN 61188-5-8.
ISO 10303-210 NOTE Harmonised as EN ISO 10303-210.

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SIST EN 61182-2-2:2012
- 3 - EN 61182-2-2:2012
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year
IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions


IEC 61182-2 - Printed board assembly products - - -
Manufacturing description data and transfer
methodology -
Part 2: Generic requirements

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SIST EN 61182-2-2:2012

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SIST EN 61182-2-2:2012




IEC 61182-2-2

®


Edition 1.0 2012-04




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Printed board assembly products – Manufacturing description data and transfer

methodology –

Part 2-2: Sectional requirements for implementation of printed board fabrication


data description



Produits pour cartes imprimées équipées – Données descriptives de fabrication


et méthodologie de transfert –

Partie 2-2: Exigences intermédiaires pour la mise en œuvre de cartes

imprimées – Description des données de fabrication










INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX X


ICS 31.180 ISBN 978-2-88912-058-1



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61182-2-2:2012
– 2 – 61182-2-2 © IEC:2012
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General principles . 7
4.1 Requirements . 7
4.2 Interpretation . 7
4.3 Categories and content . 8
5 General rules. 9
5.1 Overview . 9
5.2 File content descriptions . 10
5.3 Logistic descriptions . 10
5.4 File history descriptions . 10
5.4.1 General . 10
5.4.2 HistoryRecord use case – Initial design release . 11
5.4.3 Supply chain modifications . 12
5.4.4 OEM reviews modifications – HistoryRecord update . 14
5.5 BOM (board fabrication materials) . 14
5.6 AVL (board material suppliers) . 16
5.7 Documentation layers . 16
5.7.1 General . 16
5.7.2 Documentation layer restrictions . 16
5.7.3 Reference to documentation . 17
5.7.4 Step usage . 18
5.7.5 Set . 19
5.8 Design for excellence (Dfx) analysis . 19
5.8.1 General . 19
5.8.2 DfxMeasurement . 19
5.9 Miscellaneous image layers . 19
5.9.1 General . 19
5.9.2 Step usage . 20
5.10 Packages and land patterns . 20
5.10.1 General . 20
5.10.2 Step usage for component packages and land patterns . 20
5.10.3 Land pattern details . 21
5.11 Solder mask and legend layers . 21
5.11.1 General . 21
5.11.2 Solder mask details . 21
5.11.3 Legend details . 21
5.11.4 Step usage for solder mask and legend layers . 22
5.12 Drilling and routing (tooling) layers . 22
5.12.1 General . 22
5.12.2 Drilling details. 22
5.12.3 Routing details . 22
5.12.4 Step usage for drilling and routing . 23
5.13 Net list. 23

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SIST EN 61182-2-2:2012
61182-2-2 © IEC:2012 – 3 –
5.13.1 General . 23
5.13.2 Step usage for net list . 24
5.14 Outer conductive layers . 24
5.14.1 General . 24
5.14.2 Outer conductive layer details . 24
5.14.3 Step usage for outer conductive layers . 24
5.15 Inner conductive layers . 25
5.15.1 Requirement . 25
5.15.2 Inner conductive layer details . 25
5.15.3 Step usage for inner conductive layers . 25
5.16 Board construction . 25
5.16.1 Requirement . 25
5.16.2 Board construction details . 26
5.16.3 Step usage for board construction . 26
6 Modeling . 26
6.1 General . 26
6.2 Information models . 27
7 Report generators . 28
7.1 IEC 61182-2-2 format . 28
7.2 Hole usage report . 29
7.3 Pad usage report . 29
7.4 Conductor usage report . 29
8 Glossary . 29
Annex A (normative) Printed board fabrication schema . 30
Bibliography . 42

Figure 1 – Board fabrication data relationship . 9
Figure 2 – HistoryRecord use case . 11
Figure 3 – Documentation package grade requirements . 18
Figure 4 – Fabrication steps data model example . 27
Figure 5 – IPC-2584 UML data model . 28

Table 1 – Function relationship of an IEC 61182-2-2 fabrication file . 8
Table 2 – Bom restrictions . 15
Table 3 – Recommended reference designators for printed board material . 15
Table 4 – Avl restrictions . 16
Table 5 – Documentation layer restrictions . 17
Table 6 – General descriptions of documentation layer functions . 17
Table 7 – Relationship to documentation standard . 18
Table 8 – Miscellaneous layer restrictions . 20

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SIST EN 61182-2-2:2012
– 4 – 61182-2-2 © IEC:2012
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_____________

PRINTED BOARD ASSEMBLY PRODUCTS –
MANUFACTURING DESCRIPTION DATA
AND TRANSFER METHODOLOGY –

Part 2-2: Sectional requirements for implementation
of printed board fabrication data description


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61182-2-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/1025/FDIS 91/1038/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 61182-2-2:2012
61182-2-2 © IEC:2012 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

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SIST EN 61182-2-2:2012
– 6 – 61182-2-2 © IEC:2012
PRINTED BOARD ASSEMBLY PRODUCTS –
MANUFACTURING DESCRIPTION DATA
AND TRANSFER METHODOLOGY –

Part 2-2: Sectional requirements for implementation
of printed board fabrication data description



1 Scope
This part of IEC 61182 provides the information on the manufacturing requirements used for
fabricating printed boards. This standard determines the XML schema details, defined in the
generic standard IEC 61182-2 and some of the sectional standards that are required to
accomplish the focused tasks. When other standards are invoked, their requirements become
a mandatory part of the fabrication details as defined in the IEC 61182-2.
The IEC 61182-2 contains all the requirements necessary to build an electronic product. The
cardinality indicated in the IEC 61182-2 may be superseded by a restriction of an attribute
(enumerated string ID) or indication of a requirement that is noted as being optional in the
generic standard. However, this standard renders the requirement mandatory based on the
supply chain communication need.
In order to assist the users of this standard, all the applicable XML schema elements that
apply to the board fabrication function are listed in Annex A. The list is grouped by topics and
shows the absolute path for the elements that pertain to the focus of this standard. If the
parent element is not present no children are considered in the implementation either.
However, all attributes identified for a particular element follow the cardinality of the
IEC 61182-2, unless a restriction is stated in this standard.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61182-2, Printed board assembly products – Manufacturing description data and
transfer methodology – Part 2: Generic requirements
3 Terms and definitions
For the purposes of this document, the terms and definitions of IEC 60194 as well as the
following apply.
3.1
data
intelligent information that may be used directly by machine in order to accomplish a
particular manufacturing event

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SIST EN 61182-2-2:2012
61182-2-2 © IEC:2012 – 7 –
3.2
drawings
hard copy or un-intelligent documentation (e.g. PDF) to which all formatting criteria apply
3.3
printed circuit board
PCB
composite of organic and inorganic material with external and internal wiring allowing
electronic components to be mechanically supported and electrically connected
3.4
supplier
organization or company responsible for providing the goods and/or services required to
produce an electronic product which includes physical items as well as intellectual/software
characteristics and is documented as either user procurement, supplier data or contractual
agreements
3.5
user
individual, organization, company or agency responsible for the procurement of
electrical/electronic hardware, and having the authority to define the class of equipment and
any variation or restrictions (i.e., the originator/custodian of the contract detailing these
requirements)
3.6
via
opening in the dielectric layer(s) through which a conductor passes upwards or downwards to
subsequent chip or package conductive layers for electrical interconnections or for heat
transfer
4 General principles
4.1 Requirements
The requirements of IEC 61182-2 are a mandatory part of this standard. The generic details
specifically provide data related to design, printed board manufacturing, assembly and test.
The XML schema of the IEC 61182-2 consists of four major functions each of which have
several children who then become new parent elements. Several of these major elements and
their associated new parents are defined in other sectional specifications, thus the
requirements of those standards are also a mandatory part of the board fabrication standard
to the extent of their description and any restrictions contained in this standard.
Each of the standards and the elements defined therein has a specific function or task
respectively, and although they may at times be used independently, they become an
important addition to the requirements of the board fabrication descriptions. As such the
following paragraphs provide the total requirements for the three types of board fabrication
files that are supported by the principles of the IEC 61182-2.
Accordingly, the information interchange for the specific purpose of printed board fabrication
is only possible if all the XML instances have been properly prepared for such a purpose.
4.2 Interpretation
"Shall", the emphatic form of the verb, is used throughout this standard whenever a
requirement is intended to express a provision that is mandatory. Deviation from a "shall"
requirement is not permitted, and compliance testing is required in order to demonstrate that
the XML instances are correct according to the W3C directives and this standard. The XML

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SIST EN 61182-2-2:2012
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schema shall be the method to check syntax and semantics. Any appropriate software tool
that prompts the user, to correct the ambiguity or to insert missing information, may be used
for this purpose.
The words "should" and "may" are used whenever it is necessary to express non-mandatory
provisions.
"Will" is used to express a declaration of purpose.
4.3 Categories and content
Table 1 provides the major functions that shall be addressed by this standard. The
descriptions relate to the appropriate printed board fabrication processes. There are fifteen
(15) unique functions that can be defined by the use of the XML elements and the resulting
XML instances.
Table 1 indicates the relationships of the requirements for various elements and topics within
the descriptions for a particular process.
Table 1 – Function relationship of an IEC 61182-2-2 fabrication file
Fabrication
Name Comment and standard reference
1 2 3
File content descriptions M M M
Elements indicated in IEC 61182-2 according to their
Logistic descriptions M M M
cardinality and restrictions of this standard.
File history descriptions O M M

BOM M M M
Elements indicated in IEC 61182-2 according to their
cardinality and restrictions of this standard.
AVL – M M

Miscellaneous image layers – O O
Elements indicated in IEC 61182-2 according to their
Documentation layers O M M
cardinality and restrictions of this standard.
Design for excellence (Dfx) analysis O O O

a
Component packages – – O
a
Land patterns – – O
Soldermask, legend layers M M M
Elements indicated in this sectional standard, according to
Drilling and Routing (tooling) layers M M M
cardinality of IEC 61182-2 and any restrictions contained
a
Net list (soft tooling) O M M
in the following paragraphs of this standard.
Outer conductive layers M M M
Inner conductive layers M M M
Board construction M M M
Abbreviations:
BOM Board fabrication materials
AVL Board material suppliers
Dfx Design for eXcellence

Key:
M Mandadory
O Optional (may or may not be pertinent to the particular file or data interchan
...