SIST EN 61182-2-2:2012

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

IEC 61182-2-2:2012 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2.

Leiterplatten - Beschreibung und Transfer von Daten - Teil 2-2: Anforderungen für die Anwendung von Dokumentationsdaten der Leiterplattenfertigung

Produits pour cartes imprimées équipées - Données descriptives de fabrication et méthodologie de transfert -- Partie 2-2: Exigences intermédiaires pour la mise en oeuvre de cartes imprimées - Description des données de fabrication

La CEI 61182-2-2:2012 fournit les informations relatives aux exigences de construction utilisées pour fabriquer des cartes imprimées. La présente norme détermine les détails du schéma XML, défini dans la norme générique CEI 61182-2 et certaines des normes intermédiaires qui sont requises pour réaliser les tâches concernées. Lorsque d'autres normes sont associées, leurs exigences deviennent une partie obligatoire des détails de fabrication comme défini dans la CEI 61182-2.

Izdelki s sestavi tiskanih plošč - Podatki o izdelovanju in prenos metodologije - 2-2. del: Posamezne zahteve za uvajanje opisovanja podatkov o izdelavi tiskanih vezij

V tem delu standarda IEC 61182 so navedene informacije o zahtevah za izdelavo tiskanih vezij. Ta standard določa podrobnosti o shemi XML, ki je opredeljena v splošnem standardu IEC 61182-2 in nekaterih področnih standardih, ki se zahtevajo za izvedbo glavnih nalog. Ob sklicevanju na zahteve iz drugih standardov je treba te zahteve obvezno navesti v podrobnih podatkih o proizvodnji iz standarda IEC 61182-2. V standardu IEC 61182-2 so navedene vse potrebne zahteve za izdelavo elektronskih proizvodov. Kardinalnost iz standarda IEC 61182-2 se lahko nadomesti z omejitvijo atributa (našteti ID niza) ali zahtevo, ki je v splošnem standardu opredeljena kot neobvezna. Vendar je v skladu s tem standardom navedena zahteva obvezna zaradi potrebe komunikacije v dobavni verigi. Vsi zadevni elementi sheme XML, ki se uporabljajo pri funkciji izdelave vezij, so v pomoč uporabnikom tega standarda navedeni v dodatku A. Seznam je razporejen glede na teme in prikazuje absolutno pot elementov, na katere se osredotoča ta standard. Če ni osrednjega elementa, se pri izvedbi ne upoštevajo podrejeni elementi. Vendar vsi atributi, ki so opredeljeni za določen element, upoštevajo kardinalnost standarda IEC 61182-2, razen če je v tem standardu navedena omejitev.

General Information

• Status: Published
• Public Enquiry End Date: 27-Feb-2010
• Publication Date: 07-Aug-2012
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 04-Jul-2012
• Due Date: 08-Sep-2012
• Completion Date: 08-Aug-2012
• Ref Project: EN 61182-2-2:2012 - Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2012
,]GHONLVVHVWDYLWLVNDQLKSORãþ3RGDWNLRL]GHORYDQMXLQSUHQRVPHWRGRORJLMH
GHO3RVDPH]QH]DKWHYH]DXYDMDQMHRSLVRYDQMDSRGDWNRYRL]GHODYLWLVNDQLK
YH]LM
Printed board assembly products - Manufacturing description data and transfer
methodology - Part 2-2: Sectional requirements for implementation of printed board
fabrication data description
Leiterplatten - Beschreibung und Transfer von Daten - Teil 2-2: Anforderungen für die
Anwendung von Dokumentationsdaten der Leiterplattenfertigung
Produits pour cartes imprimées équipées - Données descriptives de fabrication et
méthodologie de transfert -- Partie 2-2: Exigences intermédiaires pour la mise en oeuvre
de cartes imprimées - Description des données de fabrication
Ta slovenski standard je istoveten z: EN 61182-2-2:2012
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61182-2-2
NORME EUROPÉENNE
June 2012
EUROPÄISCHE NORM
ICS 31.180
English version
Printed board assembly products -
Manufacturing description data and transfer methodology -
Part 2-2: Sectional requirements for implementation
of printed board fabrication data description
(IEC 61182-2-2:2012)
Produits pour cartes imprimées équipées - Leiterplatten -
Données descriptives de fabrication Beschreibung und Transfer von Daten -
et méthodologie de transfert - Teil 2-2: Anforderungen für die
Partie 2-2: Exigences intermédiaires pour Anwendung von Dokumentationsdaten
la mise en oeuvre de cartes imprimées - der Leiterplattenfertigung
Description des données de fabrication (IEC 61182-2-2:2012)
(CEI 61182-2-2:2012)
This European Standard was approved by CENELEC on 2012-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61182-2-2:2012 E
Foreword
The text of document 91/1025/FDIS, future edition 1 of IEC 61182-2-2, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 61182-2-2:2012.
The following dates are fixed:
(dop) 2013-03-01
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2015-06-01
• latest date by which the national
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 61182-2-2:2012 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 61188-5-1 NOTE Harmonised as EN 61188-5-1.
IEC 61188-5-2 NOTE Harmonised as EN 61188-5-2.
IEC 61188-5-3 NOTE Harmonised as EN 61188-5-3.
IEC 61188-5-4 NOTE Harmonised as EN 61188-5-4.
IEC 61188-5-5 NOTE Harmonised as EN 61188-5-5.
IEC 61188-5-6 NOTE Harmonised as EN 61188-5-6.
IEC 61188-5-8 NOTE Harmonised as EN 61188-5-8.
ISO 10303-210 NOTE Harmonised as EN ISO 10303-210.

- 3 - EN 61182-2-2:2012
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions

IEC 61182-2 - Printed board assembly products - - -
Manufacturing description data and transfer
methodology -
Part 2: Generic requirements
IEC 61182-2-2 ®
Edition 1.0 2012-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Printed board assembly products – Manufacturing description data and transfer

methodology –
Part 2-2: Sectional requirements for implementation of printed board fabrication

data description
Produits pour cartes imprimées équipées – Données descriptives de fabrication

et méthodologie de transfert –

Partie 2-2: Exigences intermédiaires pour la mise en œuvre de cartes

imprimées – Description des données de fabrication

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.180 ISBN 978-2-88912-058-1

– 2 – 61182-2-2 © IEC:2012
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General principles . 7
4.1 Requirements . 7
4.2 Interpretation . 7
4.3 Categories and content . 8
5 General rules. 9
5.1 Overview . 9
5.2 File content descriptions . 10
5.3 Logistic descriptions . 10
5.4 File history descriptions . 10
5.4.1 General . 10
5.4.2 HistoryRecord use case – Initial design release . 11
5.4.3 Supply chain modifications . 12
5.4.4 OEM reviews modifications – HistoryRecord update . 14
5.5 BOM (board fabrication materials) . 14
5.6 AVL (board material suppliers) . 16
5.7 Documentation layers . 16
5.7.1 General . 16
5.7.2 Documentation layer restrictions . 16
5.7.3 Reference to documentation . 17
5.7.4 Step usage . 18
5.7.5 Set . 19
5.8 Design for excellence (Dfx) analysis . 19
5.8.1 General . 19
5.8.2 DfxMeasurement . 19
5.9 Miscellaneous image layers . 19
5.9.1 General . 19
5.9.2 Step usage . 20
5.10 Packages and land patterns . 20
5.10.1 General . 20
5.10.2 Step usage for component packages and land patterns . 20
5.10.3 Land pattern details . 21
5.11 Solder mask and legend layers . 21
5.11.1 General . 21
5.11.2 Solder mask details . 21
5.11.3 Legend details . 21
5.11.4 Step usage for solder mask and legend layers . 22
5.12 Drilling and routing (tooling) layers . 22
5.12.1 General . 22
5.12.2 Drilling details. 22
5.12.3 Routing details . 22
5.12.4 Step usage for drilling and routing . 23
5.13 Net list. 23

61182-2-2 © IEC:2012 – 3 –
5.13.1 General . 23
5.13.2 Step usage for net list . 24
5.14 Outer conductive layers . 24
5.14.1 General . 24
5.14.2 Outer conductive layer details . 24
5.14.3 Step usage for outer conductive layers . 24
5.15 Inner conductive layers . 25
5.15.1 Requirement . 25
5.15.2 Inner conductive layer details . 25
5.15.3 Step usage for inner conductive layers . 25
5.16 Board construction . 25
5.16.1 Requirement . 25
5.16.2 Board construction details . 26
5.16.3 Step usage for board construction . 26
6 Modeling . 26
6.1 General . 26
6.2 Information models .
...