SIST EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-804: Prüfverfahren für die Zeit bis zur Delaminierung – T260, T288, T300

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps de décollement interlaminaire - T260, T288, T300

L'IEC 61189-2-804:2023 définit une méthode d'essai pour déterminer le temps de décollement interlaminaire des matériaux de base et des cartes imprimées en utilisant un analyseur thermomécanique (TMA – thermomechanical analyser). Les températures utilisées pour cette évaluation sont généralement 260 °C, 288 °C et 300 °C, mais ne se limitent pas à ces valeurs.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-804. del: Preskus ugotavljanja razmerja čas-delaminacija - T260, T288, T300

Ta mednarodni standard določa preskusno metodo za ugotavljanje razmerja čas-delaminacija osnovnih materialov in tiskanih vezij s termomehanskim analizatorjem (TMA). Ocenjevanje se običajno izvaja pri temperaturah 260 °C, 288 °C in 300 °C, vendar ni omejeno na te vrednosti.

General Information

• Status: Published
• Public Enquiry End Date: 26-Jan-2022
• Publication Date: 14-Nov-2023
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 17-Oct-2023
• Due Date: 22-Dec-2023
• Completion Date: 15-Nov-2023
• Ref Project: EN IEC 61189-2-804:2023 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 61189-2-804:2023
01-december-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-804. del: Preskus ugotavljanja razmerja čas-delaminacija -
T260, T288, T300
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-804: Prüfverfahren für die Zeit bis zur Delaminierung – T260,
T288, T300
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps
de décollement interlaminaire - T260, T288, T300
Ta slovenski standard je istoveten z: EN IEC 61189-2-804:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
SIST EN IEC 61189-2-804:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN IEC 61189-2-804:2023

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SIST EN IEC 61189-2-804:2023


EUROPEAN STANDARD EN IEC 61189-2-804

NORME EUROPÉENNE

EUROPÄISCHE NORM October 2023
ICS 31.180

English Version
Test methods for electrical materials, printed board and other
interconnection structures and assemblies - Part 2-804: Test
methods for time to delamination - T260, T288, T300
(IEC 61189-2-804:2023)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-804: Méthodes d'essai pour le temps 804: Prüfverfahren für die Zeit bis zur Delaminierung -
de décollement interlaminaire - T260, T288, T300 T260, T288, T300
(IEC 61189-2-804:2023) (IEC 61189-2-804:2023)
This European Standard was approved by CENELEC on 2023-09-29. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN IEC 61189-2-804:2023 E

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SIST EN IEC 61189-2-804:2023
EN IEC 61189-2-804:2023 (E)
European foreword
The text of document 91/1874/FDIS, future edition 1 of IEC 61189-2-804, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-804:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-06-29
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-09-29
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-804:2023 was approved by CENELEC as a
European Standard without any modification.
2

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SIST EN IEC 61189-2-804:2023
EN IEC 61189-2-804:2023 (E)
Annex ZA
(normative)

Normative references to i
...

SLOVENSKI STANDARD
oSIST prEN IEC 61189-2-804:2022
01-januar-2022
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-804. del: Preskus ugotavljanja razmerja čas-delaminacija -
T260, T288, T300
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-804: Méthodes d'essai pour le temps
de décollement interlaminaire - T260, T288, T300
Ta slovenski standard je istoveten z: prEN IEC 61189-2-804:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
oSIST prEN IEC 61189-2-804:2022 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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oSIST prEN IEC 61189-2-804:2022

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oSIST prEN IEC 61189-2-804:2022

91/1761/CDV

COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61189-2-804 ED1
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2021-11-05 2022-01-28
SUPERSEDES DOCUMENTS:
91/1546/CD, 91/1613A/CC

IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Masahide Okamoto
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:


Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:

EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they
are aware and to provide supporting documentation.

TITLE:
Test methods for electrical materials, printed board and other interconnection structures and assemblies
- Part 2-804: Test methods for time to delamination - T260, T288, T300

PROPOSED STABILITY DATE: 2027

NOTE FROM TC/SC OFFICERS:


Copyright © 2021 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.

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oSIST prEN IEC 61189-2-804:2022
61189-2-804/Ed1/CD  IEC        – 2 – 91/1761/CDV
1
2 CONTENTS
3
4 FOREWORD . 3
5 1 Scope. 5
6 2 Normative references . 5
7 3 Terms and definitions . 5
8 4 Specimen Preparation . 5
9 5 Test Specimens . 5
10 6 Test Equipment . 6
11 7 Test Procedure. 6
12 8 Calculation . 6
13 9 Report . 7
14
15 Figure 1 – A typical plot for an epoxy material at an isothermal temperature of 260 °C . 6
16

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oSIST prEN IEC 61189-2-804:2022
61189-2-804/Ed1/CD  IEC        – 3 – 91/1761/CDV
17 INTERNATIONAL ELECTROTECHNICAL COMMISSION
18                                   ____________
19 Test methods for electrical materials, printed board and other interconnec
...