SIST EN IEC 61189-2-805:2025

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA

This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-805: X/Y CTE Prüfung für dünne Basismaterialien mit TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces

L’IEC 61189-2-805:2024 définit la méthode à suivre pour la détermination du coefficient de dilatation thermique X/Y de matériaux isolants électriques minces par l’utilisation d’un analyseur thermomécanique (TMA, thermomechanical analyser). Cette méthode est applicable aux matériaux qui sont solides sur toute la plage de températures utilisée et qui conservent une rigidité suffisante sur toute la plage de températures, de telle sorte qu'une indentation irréversible du spécimen par la sonde de détection ne se produise pas.

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-805. del: Preskus X/Y CTE s termomehansko analizo (TMA) za tanke podložne materiale

Ta del standarda IEC 61189 opredeljuje metodo za določanje koeficienta toplotnega raztezka vzdolž osi X/Y električnih izolacijskih materialov s termomehansko analizo (TMA). Ta metoda se uporablja za materiale, ki ostanejo v trdnem stanju ter ohranijo zadostno togost pri vseh uporabljenih temperaturah, da ne prihaja do nepopravljivih zarez v preskušancu zaradi zaznavne sonde.

General Information

• Status: Published
• Public Enquiry End Date: 12-Jan-2022
• Publication Date: 03-Apr-2025
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 21-Mar-2025
• Due Date: 26-May-2025
• Completion Date: 04-Apr-2025
• Ref Project: EN IEC 61189-2-805:2024 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

Overview

SIST EN IEC 61189-2-805:2025 specifies standardized test methods for determining the X/Y coefficient of thermal expansion (CTE) of thin electrical insulating base materials using thermomechanical analysis (TMA). The standard is developed by the Slovenian Institute for Standardization (SIST) and aligns with the international IEC 61189 series, focusing particularly on materials used in electrical, printed board, and interconnection assemblies.

Measurement of CTE is critical for ensuring material integrity and reliability in printed circuit boards (PCBs) and other electronic assemblies. The test is designed for materials that remain solid and rigid across the applicable temperature range, avoiding any sample deformation by the TMA probe.

Key Topics

• Scope and Applicability

  • Applies to thin electrical insulating materials used in printed boards and interconnection structures.
  • Suitable for materials that avoid irreversible indentation during TMA testing.
  • Focuses on the X (machine direction) and Y (transverse direction) coefficients of thermal expansion.

• Test Specimen Preparation

  • Specifies sample dimensions and conditioning, ensuring repeatable and reliable results.
  • Requires removal of metallic cladding before analysis.

• Thermomechanical Analysis (TMA)

  • Utilizes a thermomechanical analyzer with precise dimensional detection capabilities.
  • Encompasses procedures such as temperature ramping, controlled atmospheric conditions, and tension application.

• Evaluation and Reporting

  • Guidance on interpreting TMA curves and calculating average and instantaneous CTE values.
  • Requires thorough documentation of test conditions and results, including temperature, humidity, material description, and observed expansion rates.

Applications

The methods outlined in SIST EN IEC 61189-2-805:2025 are essential for:

• Printed Circuit Board Manufacturing

  • Accurate measurement of CTE helps manufacturers select appropriate base materials, minimizing mechanical stresses during board operation and thermal cycling.

• Quality Assurance

  • Ensures reliability and performance of PCBs and assemblies in demanding environments by verifying thermal expansion characteristics.

• Material Development and Qualification

  • Supports R&D teams in evaluating alternative materials or new formulations for electronic substrates.

• Compliance and Certification

  • Provides a harmonized testing framework for regulatory compliance and compatibility with global supply chains.

Related Standards

For broader context and consistency in testing and materials characterization, consider the following related standards:

• IEC 61189 Series: Focused on test methods for electrical materials and assemblies, offering comprehensive reference for PCB and interconnection testing.
• IEC 60194-1:2021: Vocabulary standard for terms used in printed board and assembly technologies.
• IPC-TM-650, Test Method 2.4.24.5: Provides detailed procedures for glass transition temperature and thermal expansion measurements of high-density interconnection materials using TMA.

---

By following the protocols defined in SIST EN IEC 61189-2-805:2025, organizations can ensure precise, repeatable testing of thin base materials for electronic assemblies, supporting high product reliability and international market acceptance. The standard plays a vital role in quality assurance, materials R&D, and manufacturing process optimization within the electronics industry.

Standards Content (Sample)

SLOVENSKI STANDARD
01-maj-2025
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-805. del: Preskus X/Y CTE s termomehansko analizo (TMA)
za tanke podložne materiale
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-805: X/Y CTE Prüfung für dünne Basismaterialien mit TMA
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA
pour matériaux de base minces
Ta slovenski standard je istoveten z: EN IEC 61189-2-805:2024
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-2-805

NORME EUROPÉENNE
EUROPÄISCHE NORM May 2024
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-805: X/Y CTE
test for thin base materials by TMA
(IEC 61189-2-805:2024)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-805: Essai à faible CDT X/Y par TMA 805: X/Y CTE Prüfung für dünne Basismaterialien mit TMA
pour matériaux de base minces (IEC 61189-2-805:2024)
(IEC 61189-2-805:2024)
This European Standard was approved by CENELEC on 2024-05-23. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-805:2024 E

European foreword
The text of document 91/1755/CDV, future edition 1 of IEC 61189-2-805, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-805:2024.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2025-02-23
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2027-05-23
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-805:2024 was approved by CENELEC as a
European Standard without any modification.

IEC 61189-2-805 ®
Edition 1.0 2024-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-805: X/Y CTE test for thin base materials by TMA

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres

structures d’interconnexion et ensembles –

Partie 2-805: Essai à faible CDT X/Y par TMA pour matériaux de base minces

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-8700-2

– 2 – IEC 61189-2-805:2024 © IEC 2024
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test specimens . 5
4.1 Preparation . 5
4.2 Number . 5
4.3 Form . 5
4.4 Conditioning . 6
5 Apparatus and materials . 6
6 Procedure . 6
7 Evaluation . 7
7.1 General . 7
7.2 Calculation of coefficient of thermal expansion curve . 8
7.3 Calculation of instantaneous coefficient of thermal expansion curve
(optional) . 9
8 Report . 9
Bibliography . 10

Figure 1 – TMA expansion curves: first heat cycles and second heat cycles . 6
Figure 2 – TMA expansion curve . 7
Figure 3 – TMA expansion curve and instantaneous CTE curve . 8

IEC 61189-2-805:2024 © IEC 2024 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-805: X/Y CTE test for thin base materials by TMA

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to
...