SIST EN 61188-5-1:2003

Printed boards and printed board assemblies - Design and use -- Part 5-1: Attachment (land/joint) considerations - Generic requirements

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung -- Teil 5-1: Betrachtungen zur Montage (Anschlußfläche/Verbindung) - Allgemeine Anforderungen

Cartes imprimées et cartes imprimées équipées - Conception et utilisation -- Partie 5-1: Considérations sur les liaisons pistes-soudures - Prescriptions génériques

Donne des informations sur les géométries des zones de report utilisées pour la fixation en surface des composants électroniques. Son intention est d'indiquer la taille, la forme et la tolérance appropriées des zones de report de montage en surface afin de garantir une surface suffisante pour le filet de soudure et de permettre également les inspections, les essais et les reprises de ces soudures.

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

General Information

• Status: Withdrawn
• Publication Date: 31-Mar-2003
• Withdrawal Date: 18-Apr-2024
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 02-Apr-2024
• Due Date: 25-Apr-2024
• Completion Date: 19-Apr-2024
• Ref Project: EN 61188-5-1:2002 - Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Relations

• Replaced By: SIST EN IEC 61188-6-1:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
• Effective Date: 07-Jun-2022
• Revised: SIST EN IEC 61188-6-1:2021 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
• Effective Date: 23-Mar-2021

Standards Content (Sample)

SLOVENSKI SIST EN 61188-5-1:2003

STANDARD
april 2003
Printed boards and printed board assemblies - Design and use - Part 5-1:
Attachment (land/joint) considerations - Generic requirements
ICS 31.180 Referenčna številka
SIST EN 61188-5-1:2003(en)
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

---------------------- Page: 1 ----------------------

NORME CEI
INTERNATIONALE IEC
61188-5-1
INTERNATIONAL
Première édition
STANDARD
First edition
2002-07
Cartes imprimées et cartes imprimées équipées –
Conception et utilisation –
Partie 5-1:
Considérations sur les liaisons pistes-soudures –
Prescriptions génériques
Printed boards and printed board assemblies –
Design and use –
Part 5-1:
Attachment (land/joint) considerations –
Generic requirements
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
CODE PRIX
XB
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue

---------------------- Page: 2 ----------------------

61188-5-1 © IEC:2002 – 3 –
CONTENTS
FOREWORD .11
1 Scope and object .15
2 Normative references.15
3 Terms and definitions.17
4 Design requirements .29
4.1 General .29
4.1.1 Classification .31
4.1.2 Land pattern determination.31
4.2 Dimensioning systems .33
4.2.1 Component tolerancing .35
4.2.2 Land tolerancing .43
4.2.3 Fabrication allowances .43
4.2.4 Assembly tolerancing .43
4.2.5 Dimension and tolerance analysis.45
4.3 Design producibility.61
4.3.1 SMT land pattern.63
4.3.2 Standard component selection .63
4.3.3 Circuit substrate development .63
4.3.4 Assembly considerations .63
4.3.5 Provision for automated test.63
4.3.6 Documentation for SMT.63
4.4 Environmental constraint.63
4.4.1 Moisture sensitive components.63
4.4.2 End-use environment considerations .65
4.5 Design rules.67
4.5.1 Component spacing .67
4.5.2 Single- and double-sided board assembly.71
4.5.3 Solder paste
...