oSIST prEN IEC 61760-4:2025
(Main)Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Oberflächenmontagetechnik - Teil 4: Genormtes Verfahren zur Klassifikation, Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile
Technique du montage en surface - Partie 4: Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l’humidité
Tehnologija površinske montaže - 4. del: Razvrščanje, pakiranje, etiketiranje in ravnanje z napravami, občutljivimi na vlago
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Standards Content (Sample)
SLOVENSKI STANDARD
01-september-2025
Tehnologija površinske montaže - 4. del: Razvrščanje, pakiranje, etiketiranje in
ravnanje z napravami, občutljivimi na vlago
Surface mounting technology - Part 4: Classification, packaging, labelling and handling
of moisture sensitive devices
Oberflächenmontagetechnik - Teil 4: Genormtes Verfahren zur Klassifikation,
Verpackung, Kennzeichnung und Handhabung feuchteempfindlicher Bauteile
Technique du montage en surface - Partie 4: Classification, emballage, étiquetage et
manipulation des dispositifs sensibles à l’humidité
Ta slovenski standard je istoveten z: prEN IEC 61760-4:2025
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
91/2039/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 61760-4 ED2
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2025-06-27 2025-09-19
SUPERSEDES DOCUMENTS:
91/1986/CD, 91/2030/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Osamu IKEDA
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):
TC 40,TC 47,TC 86
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
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Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some
Countries” clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is
the final stage for submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of
moisture sensitive devices
PROPOSED STABILITY DATE: 2031
NOTE FROM TC/SC OFFICERS:
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IEC CDV 61760-4 © IEC 2025 2 91/2039/CDV
Link to Committee Draft for Vote (CDV) online document:
https://osd.iec.ch/#/editor/archive/1532b860-2fb0-010f-e063-1610000a6180/en/CCDV/1
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IEC CDV 61760-4 © IEC 2025 3 91/2039/CDV
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 General information . 10
4.1 Moisture sensitive devices . 10
4.2 moisture sensitivity level (3.2) (MSL) . 10
4.3 Relation to other environmental test methods (humidity tests) . 10
5 Assessment of moisture sensitivity . 11
5.1 Identification of non moisture sensitive devices . 11
5.2 Classification . 11
6 Test procedure . 12
6.1 General . 12
6.1.1 Structurally similar components . 12
6.1.2 Verification and validation tests . 12
6.1.3 Selection of applicable soak conditions and temperature profile . 12
6.2 Drying . 12
6.3 Moisture soak . 12
6.4 Temperature load. 13
6.4.1 Classification temperature profile . 13
6.4.2 Classification temperature profile for special devices . 14
6.4.3 Reflow . 14
6.5 Recovery . 15
6.6 Final measurements. 15
6.6.1 Requirements . 15
6.6.2 Visual inspection . 15
6.6.3 Electrical measurements . 15
6.6.4 Non-destructive inspection (if required) . 16
6.7 Classification . 16
6.8 Information to be given in the relevant specification . 16
7 Requirements to packaging and labelling . 16
7.1 Packaging process . 16
7.1.1 Drying of MSDs and carrier materials before being sealed in MBBs . 16
7.1.2 Evacuation and sealing . 17
7.2 Packaging material for dry pack . 17
7.2.1 Moisture barrier bag (MBB) . 17
7.2.2 Desiccant . 18
7.2.3 Humidity indicator . 20
7.3 Information to be given on labels . 20
8 Handling of moisture sensitive devices . 21
8.1 Storage . 21
8.1.1 Recommended storage conditions . 21
8.1.2 Shelf life . 21
IEC CDV 61760-4 © IEC 2025 4 91/2039/CDV
8.1.3 Floor life . 21
8.2 ESD . 22
8.3 Humidity indication. 22
8.3.1 Humidity indicator card (HIC) . 22
8.3.2 Moisture indicating desiccant . 22
8.4 Unpacking and re-packing. 22
9 Drying . 23
9.1 Drying options . 23
9.2 Methods . 24
9.2.1 General considerations for baking . 24
9.2.2 Bakeout times . 24
9.2.3 ESD protection . 25
9.2.4 Reuse of carriers . 25
9.2.5 Solderability limitations . 25
Annex A (informative) Moisture sensitivity of assemblies . 26
Annex B (informative) Mass/gain loss analysis . 27
Annex C (informative) Baking of devices . 28
C.1 Baking time and conditions . 28
C.2 Example of a baking process . 28
Annex D (normative) Moisture sensitivity labels . 29
D.1 Object . 29
D.2 Graphical symbols and labels . 29
D.2.1 Graphical symbol for moisture-sensitivity . 29
D.2.2 Moisture-sensitivity identification label (MSID) . 29
D.2.3 Moisture-sensitivity caution label (MSCL) . 29
Bibliography . 31
Figure 1 – Classification temperature profile . 13
Figure 2 – Examples of humidity indicator cards . 20
Figure C.1 – Baking process . 28
Figure D.1 – Standardized graphical symbol for use on equipment . 29
Figure D.2 – Alternative moisture sensitivity symbol (also in market use) . 29
Figure D.3 – MSID labels (examples) . 29
Table 1 – Moisture sensitivity levels . 11
Table 2 – Moisture soak conditions . 12
Table 3 – Parameters of the classification temperature profile . 13
Table 4 – Classification temperatures T . 14
c
Table 5 – MBB material properties . 18
Table 6 – Conditions for re-bake – Example for one type of plastic encapsulated
devices . 23
Table 7 – Conditions for baking prior to dry pack – Example for one type of plastic
encapsulated devices . 24
IEC CDV 61760-4 © IEC 2025 5 91/2039/CDV
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Surface mounting technology - Part 4: Classification, packaging, labelling
and handling of moisture sensitive devices ED2
FOREWORD
a) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC pu
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