Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 6-2: Anschlussflächenbild - Beschreibung des Anschlussflächenbilds für die meisten oberflächenmontierbaren Bauelemente (SMD, en: surface mounted components)

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-2: Conception de la zone de report - Description de la zone de report pour les composants montés en surface (CMS) les plus courants

L’IEC 61188-6-2:2021 décrit les exigences de conception et d’utilisation relatives aux surfaces de brasage de la zone de report sur les cartes imprimées. Le présent document porte notamment sur la zone de report des composants montés en surface. Ces exigences se fondent sur les exigences relatives aux joints de brasure de l’IEC 61191-2:2017.

Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-2. del: Razmestitev priključkov - Opis razmestitve priključkov za najpogostejše elemente za površinsko montažo (SMD)

General Information

Status
Published
Publication Date
12-Sep-2021
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
18-Mar-2021
Due Date
23-May-2021
Completion Date
13-Sep-2021

Buy Standard

Standard
SIST EN IEC 61188-6-2:2021 - BARVE na PDF-str 20,21,25,26
English language
28 pages
sale 10% off
Preview
sale 10% off
Preview

e-Library read for
1 day

Standards Content (sample)

SLOVENSKI STANDARD
SIST EN IEC 61188-6-2:2021
01-oktober-2021

Plošče tiskanih vezij in sestavi plošč tiskanih vezij - Zasnova in uporaba - 6-2. del:

Razmestitev priključkov - Opis razmestitve priključkov za najpogostejše elemente
za površinsko montažo (SMD)

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern

design - Description of land pattern for the most common surface mounted components

(SMD)
Ta slovenski standard je istoveten z: EN IEC 61188-6-2:2021
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
SIST EN IEC 61188-6-2:2021 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 61188-6-2:2021
---------------------- Page: 2 ----------------------
SIST EN IEC 61188-6-2:2021
EUROPEAN STANDARD EN IEC 61188-6-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 31.180; 31.190
English Version
Circuit boards and circuit board assemblies - Design and use -
Part 6-2: Land pattern design - Description of land pattern for the
most common surface mounted components (SMD)
(IEC 61188-6-2:2021)

Cartes imprimées et cartes imprimées équipées - Leiterplatten und Flachbaugruppen - Konstruktion und

Conception et utilisation - Partie 6-2: Conception de la zone Anwendung - Teil 6-2: Anschlussflächenbild - Beschreibung

de report - Description de la zone de report pour les des Anschlussflächenbilds für die meisten

composants montés en surface (CMS) les plus courants oberflächenmontierbaren Bauelemente (SMD, en: surface

(IEC 61188-6-2:2021) mounted components)
(IEC 61188-6-2:2021)

This European Standard was approved by CENELEC on 2021-03-11. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 61188-6-2:2021 E
---------------------- Page: 3 ----------------------
SIST EN IEC 61188-6-2:2021
EN IEC 61188-6-2:2021 (E)
European foreword

The text of document 91/1637/CDV, future edition 1 of IEC 61188-6-2, prepared by IEC/TC 91

"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN IEC 61188-6-2:2021.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2021-12-11

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2024-03-11

document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 61188-6-2:2021 was approved by CENELEC as a

European Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards

indicated:
IEC 61188-5-1:2002 NOTE Harmonized as EN 61188-5-1:2002 (not modified)
IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2
IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3
IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4
IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5
IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6
IEC 61188-5-8 NOTE Harmonized as EN 61188-5-8
IEC 61191 (series) NOTE Harmonized as EN 61191 (series)
---------------------- Page: 4 ----------------------
SIST EN IEC 61188-6-2:2021
EN IEC 61188-6-2:2021 (E)
Annex ZA
(normative)
Normative references to international publications with their
corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),

the relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-2 - Printed boards design, manufacture and - -
assembly - Vocabulary - Part 2:
Common usage in electronic
technologies as well as printed board
and electronic assembly technologies
IEC 61188-6-1 - Circuit boards and circuit board EN IEC 61188-6-1 -
assemblies - Design and use - Part 6-1:
Land pattern design - Generic
requirements for land pattern on circuit
boards
IEC 61188-6-4 - Printed boards and printed board EN IEC 61188-6-4 -
assemblies - Design and use - Part 6-4:
Land pattern design - Generic
requirements for dimensional drawings
of surface mounted components (SMD)
from the viewpoint of land pattern
design
IEC 61191-2 2017 Printed board assemblies - Part 2: EN 61191-2 2017
Sectional specification - Requirements
for surface mount soldered assemblies
To be published. Stage at the time of publication: prEN IEC 61188-6-1:2020.
---------------------- Page: 5 ----------------------
SIST EN IEC 61188-6-2:2021
---------------------- Page: 6 ----------------------
SIST EN IEC 61188-6-2:2021
IEC 61188-6-2
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Circuit boards and circuit board assemblies – Design and use –
Part 6-2: Land pattern design – Description of land pattern for the most common
surface mounted components (SMD)
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 6-2: Conception de la zone de report – Description de la zone de report
pour les composants montés en surface (CMS) les plus courants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180; 31.190 ISBN 978-2-8322-9354-6

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 61188-6-2:2021
– 2 – IEC 61188-6-2:2021  IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 6

4 Kinds of target solder process ......................................................................................... 6

5 Land pattern determination .............................................................................................. 6

6 Requirements .................................................................................................................. 7

6.1 General requirements ............................................................................................. 7

6.2 The proposed land pattern dimension system ......................................................... 7

6.2.1 Land pattern design ......................................................................................... 7

6.2.2 Solder joint fillet design ................................................................................... 8

6.2.3 Courtyard excess ........................................................................................... 10

6.2.4 Rounding factor ............................................................................................. 10

6.2.5 Relationship between terminal classifications and class of land pattern ......... 10

6.2.6 Terminal types ............................................................................................... 10

6.3 Land pattern for wave soldering ............................................................................ 14

6.3.1 General ......................................................................................................... 14

6.3.2 Flat bottom terminals ..................................................................................... 14

6.3.3 Flat bottom and vertical side terminals ........................................................... 14

6.4 Land pattern for reflow soldering ........................................................................... 15

6.4.1 General ......................................................................................................... 15

6.4.2 Flat bottom terminals ..................................................................................... 15

6.4.3 Flat bottom and vertical side terminals ........................................................... 15

6.4.4 Remarks ........................................................................................................ 16

Annex A (informative) The relation between terminal type and component packages .......... 19

A.1 Flat bottom terminals ............................................................................................ 19

A.2 Flat bottom and vertical side terminals .................................................................. 19

Annex B (informative) Solder joint fillet designs for wave soldering ...................................... 22

Annex C (informative) Courtyard excess for reflow soldering ............................................... 23

C.1 Courtyard excess for flat bottom terminals to use the land pattern for reflow

soldering ............................................................................................................... 23

C.2 Courtyard excess for flat bottom and vertical side terminals to use the land

pattern for reflow soldering ................................................................................... 23

Bibliography .......................................................................................................................... 25

Figure 1 – Example of the dimensional relationship between the drawings of

components with rectangular terminals and the land pattern design ........................................ 9

Figure 2 – Definitions of dimensions of the flat bottom terminal types ................................... 11

Figure 3 – Definitions of dimensions of the flat bottom and vertical side terminal types ........ 14

Figure 4 – Solder touches image........................................................................................... 17

Figure 5 – Unacceptable conditions for overhangs ................................................................ 18

Table 1 – Relationship between terminal classifications and class of land pattern ................. 10

Table 2 – Conformity to the wave soldering of the terminal types .......................................... 14

---------------------- Page: 8 ----------------------
SIST EN IEC 61188-6-2:2021
IEC 61188-6-2:2021  IEC 2021 – 3 –
Table 3 – Land pattern dimensions for Flat bottom terminals soldered by reflow

soldering ............................................................................................................................... 15

Table 4 – Land pattern dimensions for flat bottom and vertical side terminals soldered

by reflow soldering ................................................................................................................ 16

Table A.1 – Terminal type classifications 1 – Flat bottom terminals ....................................... 19

Table A.2 – Terminal type classifications 2 – Flat bottom and vertical side terminals ............ 20

Table B.1 – Solder joint fillet design for wave soldering ........................................................ 22

Table C.1 – Courtyard excess for flat bottom terminals to use the land pattern for

reflow soldering .................................................................................................................... 23

Table C.2 – Courtyard excess for flat bottom and vertical side terminals to use the

land pattern for reflow soldering ............................................................................................ 24

---------------------- Page: 9 ----------------------
SIST EN IEC 61188-6-2:2021
– 4 – IEC 61188-6-2:2021  IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES –
DESIGN AND USE –
Part 6-2: Land pattern design – Description of land pattern
for the most common surface mounted components (SMD)
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 61188-6-2 has been prepared by IEC technical committee 91: Electronics assembly

technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1637/CDV 91/1657/RVC

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
---------------------- Page: 10 ----------------------
SIST EN IEC 61188-6-2:2021
IEC 61188-6-2:2021  IEC 2021 – 5 –

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 61188 series, published under the general title Circuit boards and

circuit board assemblies – Design and use, can be found on the IEC website.

Future documents in this series will carry the new general title as cited above. Titles of existing

documents in this series will be updated at the time of the next edition.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under webstore.iec.ch in the data related to the

specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates that it

contains colours which are considered to be useful for the correct understanding of its

contents. Users should therefore print this document using a colour printer.
---------------------- Page: 11 ----------------------
SIST EN IEC 61188-6-2:2021
– 6 – IEC 61188-6-2:2021  IEC 2021
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES –
DESIGN AND USE –
Part 6-2: Land pattern design – Description of land pattern
for the most common surface mounted components (SMD)
1 Scope

This part of IEC 61188 describes the requirements of design and use for soldering surfaces of

land pattern on circuit boards. This document includes land pattern for surface mounted

components. These requirements are based on the solder joint requirements of
IEC 61191-2:2017.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.

IEC 60194-2, Printed boards design, manufacture and assembly – Vocabulary – Part 2:

Common usage in electronic technologies as well as printed board and electronic assembly

technologies

IEC 61188-6-1, Circuit boards and circuit board assemblies – Design and use – Part 6-1: Land

pattern design – Generic requirements for land pattern on circuit boards

IEC 61188-6-4, Printed boards and printed board assemblies – Design and use – Part 6-4: Land

pattern design – Generic requirements for dimensional drawings of surface mounted

components (SMD) from the viewpoint of land pattern design

IEC 61191-2:2017, Printed board assemblies – Part 2: Sectional specification – Requirements

for surface mount soldered assemblies
3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 60194-2 and

IEC 61188-6-1 apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Kinds of target solder process

Typical soldering methods used in surface mount technology include, but are not limited to:

a) reflow soldering for all process types;
b) wave soldering of surface mounted component.
5 Land pattern determination

This standard discusses the following method of providing information on land patterns.

For each typical termination type, one land pattern for one termination will be determined by

formulas based on the termination dimensions (nominal value).
---------------------- Page: 12 ----------------------
SIST EN IEC 61188-6-2:2021
IEC 61188-6-2:2021  IEC 2021 – 7 –
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.