SIST CECC 23 600-801:2002

Capability Detail Specification: Flex-rigid multilayer printed boards with through connections

D97/081: CECC/SC 52 disbanded

Bauartspezifikation zur Anerkennung der Befähigung: Starr-flexible Mehrlagen-Leiterplatten mit Durchverbindungen

Spécification particulière d'agrément: Cartes imprimées multicouches flexorigides avec connexions transversales

Capability Detail Specification: Flex-rigid multilayer printed boards with through connections

General Information

• Status: Published
• Publication Date: 30-Apr-2002
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-May-2002
• Due Date: 01-May-2002
• Completion Date: 01-May-2002
• Ref Project: CECC 23 600-801:1998 - Capability Detail Specification: Flex-rigid multilayer printed boards with through connections

Overview

SIST CECC 23 600-801:2002 provides the capability detail specification for flex-rigid multilayer printed boards with through connections. Developed by the Slovenski inštitut za standardizacijo (SIST), this standard aligns with internationally recognized practices for the design, manufacture, and assessment of printed circuit boards (PCBs) that combine both flexible and rigid elements. By delineating essential requirements, it ensures high reliability and performance for electronics that demand integrated flex-rigid solutions.

Key Topics

• Flex-Rigid Multilayer PCB Design
  This standard defines requirements specific to printed circuit boards that integrate both flexible and rigid substrates, enabling advanced interconnection and reduced assembly complexity.

• Through Connections (Vias)
  Specifications for the quality and reliability of plated through holes, ensuring electrical continuity and mechanical integrity across multilayer structures.

• Capability Assessment
  Criteria for manufacturers to demonstrate their capability to consistently produce flex-rigid multilayer PCBs that meet stringent quality benchmarks.

• Conformance and Compliance
  Procedures for verifying compliance with the specification, supporting traceability and product assurance in electronics manufacturing.

Applications

SIST CECC 23 600-801:2002 is highly relevant for industries and professionals involved in:

• Aerospace & Defense
  Where high-density, lightweight, and reliable interconnections are critical for performance-sensitive systems.
• Medical Devices
  Supporting compact, flexible electronic assemblies required in diagnostic and implantable devices.
• Consumer Electronics
  Enabling sophisticated design solutions in smartphones, wearables, and compact computing products.
• Industrial Automation
  Facilitating robust circuit designs for harsh environments or space-constrained assemblies.

Flex-rigid multilayer printed boards allow designers to address complex three-dimensional packaging requirements, reduce interconnection failures, and integrate multiple functions within a single assembly.

Related Standards

For broader compliance and best practices, consider the following related standards:

• CECC 23 600-801:1998
  The international reference standard from which the SIST version is derived.
• IPC-6013
  Qualification and performance specification for flexible and rigid-flex printed boards.
• IEC 60194
  Terms and definitions for printed circuit boards and their assemblies.
• IPC-2223
  Design standard for flexible and rigid-flex printed boards.

Aligning practices with SIST CECC 23 600-801:2002 and these related standards helps companies ensure product quality, enhance reliability, and meet regulatory requirements in competitive electronics markets.

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For organizations seeking to verify PCB manufacturing capabilities or specify requirements for flex-rigid multilayer boards with through connections, adoption of SIST CECC 23 600-801:2002 provides a credible framework for quality assurance and international interoperability.

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Capability Detail Specification: Flex-rigid multilayer printed boards with through connectionsBauartspezifikation zur Anerkennung der Befähigung: Starr-flexible Mehrlagen-Leiterplatten mit DurchverbindungenSpécification particulière d'agrément: Cartes imprimées multicouches flexorigides avec connexions transversalesCapability Detail Specification: Flex-rigid multilayer printed boards with through connections31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:CECC 23 600-801:1998SIST CECC 23 600-801:2002en01-maj-2002SIST CECC 23 600-801:2002S
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