SIST CECC 23 600-801:2002

• Abstract:

  D97/081: CECC/SC 52 disbanded

• Status: Published
• Publication Date: 30-Apr-2002
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-May-2002
• Due Date: 01-May-2002
• Completion Date: 01-May-2002
• Ref Project: CECC 23 600-801:1998 - Capability Detail Specification: Flex-rigid multilayer printed boards with through connections

SIST CECC 23 600-801:2002 is a SIST standard for a Capability Detail Specification covering flex-rigid multilayer printed boards with through connections. It is presented as the Slovene adoption of CECC 23 600-801:1998 and is classified under Printed circuits and boards with ICS 31.180. In practice, it is a document for organizations that need to identify, specify, or compare this PCB construction type in a controlled way.

What does SIST CECC 23 600-801:2002 specify?

SIST CECC 23 600-801:2002 specifies a capability detail specification for flex-rigid multilayer printed boards with through connections. The wording in the title tells you the document is focused on the product type itself, not on a general PCB family.

The published record identifies the standard in several languages - English, German, and French - which helps users recognize the same document across catalogs and international procurement systems. It also links the Slovene standard to CECC 23 600-801:1998, which is useful when matching a local reference to the wider CECC designation.

What are the key requirements of SIST CECC 23 600-801:2002?

The available standard identification shows the subject area and the intended board construction, but not detailed technical clauses in the page record shown here. For a buyer or engineer, the practical value is that the standard name itself narrows the target product to flex-rigid multilayer printed boards with through connections.

A few terms in the title matter in practice:

• Flex-rigid - the board combines flexible and rigid sections, so it is used where a design needs both bending and mechanical support.
• Multilayer printed boards - the board contains multiple conductor layers, which matters for routing density and interconnection planning.
• Through connections - interlayer electrical connections pass through the board, so hole-making and layer-to-layer connection capability are part of the design context.
• Capability Detail Specification - the document type indicates a controlled specification used to describe capability for this product class.
• Printed circuits and boards - the standard sits in the PCB field, so it is relevant to PCB fabrication and procurement workflows.

For a reader, that means the standard is mainly a classification and specification reference for a particular PCB build-up. It is the kind of document you would use when aligning product identification, supplier discussion, or technical naming for this board type.

What terms does SIST CECC 23 600-801:2002 define?

Capability Detail Specification - A document type used to specify the capability-related details of a particular product class.

Flex-rigid - A construction that combines flexible and rigid parts in one printed board.

Multilayer printed boards - Printed boards made with more than one conductor layer.

Through connections - Electrical connections that pass through the board from one layer or side to another.

Printed circuits and boards - The broader technical field for printed circuit board products.

CECC 23 600-801:1998 - The CECC reference identified as equivalent to this Slovene standard.

Who uses SIST CECC 23 600-801:2002?

SIST CECC 23 600-801:2002 is relevant to people working with printed circuit board specification and identification. Typical users include PCB designers, PCB manufacturers, procurement teams, and quality personnel who need a shared term for a flex-rigid multilayer printed board with through connections.

It is especially useful when comparing supplier offers, writing internal product descriptions, or checking that a board type is named consistently across organizations. The classification under Printed circuits and boards also places it in the electronics manufacturing supply chain.

What changed in SIST CECC 23 600-801:2002 from the previous edition?

SIST CECC 23 600-801:2002 is identified as identical to CECC 23 600-801:1998. The Slovene standard therefore serves as the SIST version of that CECC reference.

What does the SIST CECC 23 600-801:2002 document contain?

The page presents the standard title in English, German, and French, which makes the document easy to recognize in multilingual environments. It also carries the system identification SIST CECC 23 600-801:2002 and the field classification ICS 31.180.

For practical use, this kind of presentation helps with cataloguing, database search, and cross-referencing between national and CECC references. The document record also shows that it belongs to the Printed circuits and boards domain, which is the main technical context for selecting and filing it.

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Capability Detail Specification: Flex-rigid multilayer printed boards with through connectionsBauartspezifikation zur Anerkennung der Befähigung: Starr-flexible Mehrlagen-Leiterplatten mit DurchverbindungenSpécification particulière d'agrément: Cartes imprimées multicouches flexorigides avec connexions transversalesCapability Detail Specification: Flex-rigid multilayer printed boards with through connections31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:CECC 23 600-801:1998SIST CECC 23 600-801:2002en01-maj-2002SIST CECC 23 600-801:2002S
...