SIST EN 62258-2:2006
(Main)Semiconductor die products -- Part 2: Exchange data formats
Semiconductor die products -- Part 2: Exchange data formats
This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to
– wafers,
– singulated bare die,
– die and wafers with attached connection structures,
– minimally or partially encapsulated die and wafers.
This standard specifies the data formats that may be used for the exchange of data covered by other parts in the IEC 62258 series as well as definitions of all parameters used according to the principles and methods of IEC 61360-1, IEC 61360-2 and IEC 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.
Halbleiter-Chip-Erzeugnisse -- Teil 2: Datenaustausch-Formate
Produits à puce de semi-conducteur -- Partie 2: Formats de données d'échange
This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.
Polprevodniški izdelki – 2. del: Izmenjava podatkovnih formatov (IEC 62258-2:2005)
General Information
Relations
Standards Content (Sample)
SLOVENSKI SIST EN 62258-2:2006
STANDARD
februar 2006
Polprevodniški izdelki – 2. del: Izmenjava podatkovnih formatov (IEC 62258-
2:2005)
Semiconductor die products – Part 2: Exchange data formats (IEC 62258-2:2005)
ICS 31.080.99; 31.200 Referenčna številka
SIST EN 62258-2:2006(en)
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
---------------------- Page: 1 ----------------------
EUROPEAN STANDARD EN 62258-2
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2005
ICS 31.080.99 Supersedes ES 59008-6-1:1999
English version
Semiconductor die products
Part 2: Exchange data formats
(IEC 62258-2:2005)
Produits de matrice de semi-conducteur Halbleiter-Chip-Erzeugnisse
Partie 2: Formats de données d'échange Teil 2: Datenaustausch-Formate
(CEI 62258-2:2005) (IEC 62258-2:2005)
This European Standard was approved by CENELEC on 2005-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62258-2:2005 E
---------------------- Page: 2 ----------------------
EN 62258-2:2005 - 2 -
Foreword
The text of document 47/1809/FDIS, future edition 1 of IEC 62258-2, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-2 on 2005-06-01.
This Part of EN 62258 should be read in conjunction with EN 62258-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62258-2:2005 was approved by CENELEC as a European
Standard without any modification.
__________
---------------------- Page: 3 ----------------------
- 3 - EN 62258-2:2005
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
1)
IEC 62258-1 - Semiconductor die products EN 62258-1 -
Part 1: Requirements for procurement
and use
IEC 61360-1 2002 Standard data element types with EN 61360-1 2002
associated classification scheme for
electric components
Part 1: Definitions - Principles and
methods
IEC 61360-2 2002 Part 2: EXPRESS dictionary schema EN 61360-2 2002
IEC 61360-4 1997 Part 4: IEC reference collection of EN 61360-4 1997
standard data element types, component
classes and terms
ISO 6093 1985 Information processing - Representation - -
of numerical values in character strings
for information interchange
ISO 8601 2004 Data elements and interchange formats - - -
Information interchange - Representation
of dates and times
ISO 10303-21 2002 Industrial automation systems and - -
integration - Product data representation
and exchange
Part 21: Implementation methods: Clear
text encoding of the exchange structure
1)
To be published.
---------------------- Page: 4 ----------------------
INTERNATIONAL IEC
STANDARD 62258-2
First edition
2005-06
Semiconductor die products –
Part 2:
Exchange data formats
IEC 2005 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XB
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
---------------------- Page: 5 ----------------------
– 2 – 62258-2 IEC:2005(E)
CONTENTS
FOREWORD.5
INTRODUCTION.7
1 Scope.8
2 Normative references.8
3 Terms and definitions .9
4 Requirements .9
5 Device Data eXchange format (DDX) file goals and usage.9
6 DDX file format and file format rules .10
7 DDX file content.10
7.1 DDX file content rules .10
7.2 DDX DEVICE block syntax.12
7.3 DDX data syntax.13
8 Definitions of DEVICE block parameters .14
8.1 BLOCK_CREATION_DATE Parameter.15
8.2 BLOCK_VERSION Parameter .15
8.3 VERSION Parameter .15
8.4 DEVICE_FORM Parameter .15
8.5 DEVICE_NAME Parameter .15
8.6 DIE_MASK_REVISION Parameter .16
8.7 MANUFACTURER Parameter .16
8.8 DIE_NAME Parameter .16
8.9 DIE_PACKAGED_PART_NAME Parameter.16
8.10 FUNCTION Parameter.16
8.11 DATA_SOURCE Parameter .17
8.12 DATA_VERSION Parameter .17
8.13 GEOMETRIC_UNITS Parameter.17
8.14 GEOMETRIC_VIEW Parameter .17
8.15 SIZE Parameter.18
8.16 THICKNESS Parameter .18
8.17 GEOMETRIC_ORIGIN Parameter .18
8.18 SIZE_TOLERANCE Parameter .20
8.19 THICKNESS_TOLERANCE Parameter.20
8.20 TERMINAL_COUNT Parameter .20
8.21 TERMINAL_TYPE_COUNT Parameter.21
8.22 CONNECTION_COUNT Parameter.21
8.23 TERMINAL_TYPE Parameter.21
8.24 TERMINAL Parameter .23
8.25 IC_TECHNOLOGY Parameter .26
8.26 DIE_SEMICONDUCTOR_MATERIAL Parameter .26
8.27 DIE_SUBSTRATE_MATERIAL Parameter.26
8.28 DIE_SUBSTRATE_CONNECTION Parameter .26
8.29 DIE_PASSIVATION_MATERIAL Parameter .27
8.30 DIE_TERMINAL_MATERIAL Parameter .27
8.31 DIE_BACK_DETAIL Parameter .28
---------------------- Page: 6 ----------------------
62258-2 IEC:2005(E) – 3 –
8.32 WAFER_SIZE Parameter.28
8.33 MAX_TEMP Parameter.28
8.34 POWER_RANGE Parameter.28
8.35 TEMPERATURE_RANGE Parameter .28
8.36 Simulator MODEL FILE Parameter.29
8.37 Simulator MODEL FILE DATE Parameter.29
8.38 Simulator NAME Parameter .29
8.39 Simulator VERSION Parameter.29
8.40 Simulator COMPLIANCE Parameter.30
8.41 DIE_DELIVERY_FORM Parameter .30
8.42 PACKING_CODE Parameter.30
8.43 BUMP_MATERIAL Parameter .30
8.44 BUMP_HEIGHT Parameter .30
8.45 BUMP_HEIGHT_TOLERANCE Parameter.31
8.46 MPD_PACKAGE_MATERIAL Parameter .31
8.47 MPD_PACKAGE_STYLE Parameter .31
8.48 MPD_DELIVERY_FORM Parameter.31
8.49 MPD_CONNECTION_TYPE Parameter.32
8.50 MPD_CONNECTION_MATERIAL Parameter.32
8.51 FIDUCIAL_TYPE Parameter .32
8.52 FIDUCIAL Parameter.33
8.53 WAFER_DIE_STEP_SIZE Parameter .35
8.54 WAFER_GROSS_DIE_COUNT Parameter.35
8.55 WAFER_INDEX Parameter.35
8.56 WAFER_RETICULE_STEP_SIZE Parameter .35
8.57 WAFER_RETICULE_GROSS_DIE_COUNT Parameter .36
9 DDX EXPRESS model schema .36
9.1 Type definitions .36
9.2 File structure .40
9.3 Device names.40
9.4 Device block.40
9.5 Die size .41
9.6 Bare or bumped die type.42
9.7 Bare die type .42
9.8 Bumped bare die type.42
9.9 Lead-frame die type.43
9.10 Minimally packaged device .43
9.11 Die delivery forms.43
9.12 Terminal types.44
9.13 Rectangular terminal.44
9.14 Circular terminal .44
9.15 Elliptic terminal .44
9.16 Polygonal terminal .45
9.17 Terminals .45
9.18 Simulation data.46
9.19 Fiducial type .46
9.20 Fiducial .46
9.21 Die and feature size.47
9.22 Position .47
---------------------- Page: 7 ----------------------
– 4 – 62258-2 IEC:2005(E)
9.23 Orientation .47
9.24 Date .48
9.25 Substrate connection .48
9.26 Wafer index.48
Annex A (informative) Example of a DDX DEVICE block.49
Annex B (informative) Example of DDX data in STEP Physical FILE (SPF) format.51
Annex C (informative) Typical CAD view from the DDX file block example given in
Annex A .53
Annex D (informative) Properties for simulation .54
Annex E (informative) TERMINAL and TERMINAL_TYPE graphical usage for CAD/CAM
systems .55
Annex F (informative) Cross-reference with IEC 61360-4.58
Annex G (informative) Notes on VERSION and NAME parameters.60
Annex H (informative) Notes on WAFER parameters .61
Annex I (informative) additional notes.63
Annex J (informative) DDX version history.64
Bibliography .66
Figure 1 – Relationship between geometric centre and geometric origin.19
Figure C.1 – CAD representation of DDX example from Annex A .53
Figure E.1 – Highlighting the MX and MY orientation properties .56
Figure E.2 – Highlighting the angular rotational orientation properties .57
Figure H.1 – Illustrating the WAFER parameters.62
Table 1 – Terminal shape types.22
Table 2 – Terminal shape coordinates .22
Table 3 – Terminal IO types .24
Table 4 – Substrate connection parameters.27
Table F.1 – Parameter list .58
Table J.1 – Parameter change history list .64
---------------------- Page: 8 ----------------------
62258-2 IEC:2005(E) – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 2: Exchange data formats
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62258-2 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1809/FDIS 47/1822/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This Part of IEC 62258 should be read in conjunction with IEC 62258-1.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
---------------------- Page: 9 ----------------------
– 6 – 62258-2 IEC:2005(E)
IEC 62258, as currently conceived, consists of the following parts, under the general title
Semiconductor die products
Part 1: Requirements for procurement and use
Part 2: Exchange data formats
Part 3: Recommendations for good practice in handling, packing and storage
Part 4: Questionnaire for die users and suppliers
Part 5: Requirements for information concerning electrical simulation
Part 6: Requirements for information concerning thermal simulation
Further parts may be added as required.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
---------------------- Page: 10 ----------------------
62258-2 IEC:2005(E) – 7 –
INTRODUCTION
th
This International Standard is based on the work carried out in the ESPRIT 4 Framework
project GOOD-DIE which resulted in the publication of the ES 59008 series of European
specifications. Organisations that helped prepare this standard included the ESPRIT GOOD-
DIE and ENCAST projects, the Die Products Consortium, and JEITA.
---------------------- Page: 11 ----------------------
– 8 – 62258-2 IEC:2005(E)
SEMICONDUCTOR DIE PRODUCTS –
Part 2: Exchange data formats
1 Scope
This part of IEC 62258 has been developed to facilitate the production, supply and use of
semiconductor die products, including but not limited to
– wafers,
– singulated bare die,
– die and wafers with attached connection structures,
– minimally or partially encapsulated die and wafers.
This standard specifies the data formats that may be used for the exchange of data covered by
other parts in the IEC 62258 series as well as definitions of all parameters used according to
the principles and methods of IEC 61360-1, IEC 61360-2 and IEC 61360-4. It introduces a
Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate
geometric data between the die manufacturer and the CAD/CAE user and formal information
models that allow data exchange in other formats such as STEP physical file format, fin
accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible
to permit usage beyond this initial scope.
This standard reflects the DDX data format: version 1.2.1.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
1
IEC 62258-1, Semiconductor die products – Part 1: Requirements for procurement and use
IEC 61360-1:2002, Standard data element types with associated classification scheme for
electric components – Part 1: Definitions – Principles and methods
IEC 61360-2:2002, Standard data element types with associated classification scheme for
electric components – Part 2: EXPRESS dictionary schema
IEC 61360-4:1997, Standard data element types with associated classification scheme for
electric components – Part 4: IEC reference collection of standard data element types,
component classes and terms
ISO 6093:1985, Information processing – Representation of numerical values in character
strings for information interchange
ISO 8601:2004, Data elements and interchange formats – Information interchange –
Representation of dates and times
ISO 10303-21:2002, Industrial automation systems and integration – Product data
representation and exchange – Part 21: Implementation methods: Clear text encoding of the
exchange structure
___________
1
To be published.
---------------------- Page: 12 ----------------------
62258-2 IEC:2005(E) – 9 –
3 Terms and definitions
For the purposes of this document, the definitions as given in IEC 62258-1 shall apply.
4 Requirements
Specific reference for Parameter Variables is made to the IEC 61360 Data Element Type (DET)
codes, which are defined in Part 4 of IEC 61360-4.
5 Device Data eXchange format (DDX) file goals and usage
To facilitate the transferral of data by electronic media from the device vendor to the end-user
for use within a CAD or CAE system, a data file format, Device Data eXchange, (DDX), shall be
used. This data file format has been deliberately kept flexible, to permit further enhancements
and additions for future use.
It is strongly recommended that Device Data eXchange files have the three letter DDX file
extension, and a Device Data eXchange file shall hereon be referred to as a DDX file.
5.1 Data that are to be transferred from a device vendor to a user shall be contained in a
single computer-readable DDX file, and the minimum contents of this file shall suffice a
geometric CAD/CAE software design system. The file shall be textually readable, to
permit simple manual verification.
5.2 The DDX file and its data contents shall be independent of both computer machine and
operating system.
5.3 The DDX file contents shall include mechanical and interconnectivity information, but
may additionally include electrical and functional data.
5.4 The DDX file may contain data for one or more devices and shall be capable of being
used as a library file by a CAD/CAE software design system. The file may contain one
or more sets of data for the same device type, each having different delivery forms,
such as bumped die, bare die, and Chip-Scale packaging.
5.5 The DDX file shall be capable of being simply or automatically generated, such as by
an ASCII text editor or a spreadsheet.
5.6 The DDX file shall be capable of referencing additional external files, such as
simulation and thermal model files.
5.7 All data shall be defined in such a
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.