SIST
SIST HD 307.3.2 S2:1998
(Main)Specification for solventless polymerisable resinous compounds used for electrical insulation -- Part 3: Specifications for individual materials -- Sheet 2: Quartz filled epoxy resinous compounds
Specification for solventless polymerisable resinous compounds used for electrical insulation -- Part 3: Specifications for individual materials -- Sheet 2: Quartz filled epoxy resinous compounds
Contains the requirements for quartz filled epoxy resinous compounds in the cured form.
Bestimmung für lösemittelfreie härtbare Reaktionsharzmassen für die Elektroisolierung -- Teil 3: Anforderungen an einzelne Werkstoffe -- Blatt 2: Mit Quarzmehl gefüllte Epoxidharzwerkstoffe
Spécification relative aux composés résineux polymérisables sans solvant utilisés comme isolants électriques -- Partie 3: Spécifications pour les matériaux particuliers -- Feuille 2: Composés résineux époxydes chargés de silice
Contient les prescriptions applicables aux composés résineux époxydes chargés de silice à l'état durci.
Specification for solventless polymerisable resinous compounds used for electrical insulation - Part 3: Specifications for individual materials - Sheet 2: Quartz filled epoxy resinous compounds (IEC 60455-3-2:1987 + IEC 60455-3-2:1987/A1:1994)
General Information
Status
Withdrawn
Publication Date
30-Sep-1998
Withdrawal Date
11-Mar-2009
Technical Committee
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
06-Mar-2009
Due Date
29-Mar-2009
Completion Date
12-Mar-2009
Relations
Effective Date
06-May-2014
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.