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SIST EN 123400-800:2002

(Main)

Capability Detail Specification: Flexible printed boards without through connections

Capability Detail Specification: Flexible printed boards without through connections

Supersedes CECC 23 400-800:1990 * D97/081: CECC/SC 52 disbanded

Bauartspezifikation zur Anerkennung der Befähigung: Flexible Leiterplatten ohne Durchverbindungen

Spécification particulière d'agrément: Cartes imprimées souples sans connexions transversales

Capability Detail Specification: Flexible printed boards without through connections

General Information

Status
Withdrawn
Publication Date
30-Apr-2002
Withdrawal Date
21-Jul-2025
ICS
31.180 - Printed circuits and boards
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
22-Jul-2025
Due Date
14-Aug-2025
Completion Date
22-Jul-2025
Ref Project
EN 123400-800:1992 - Capability Detail Specification: Flexible printed boards without through connections

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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Capability Detail Specification: Flexible printed boards without through connectionsBauartspezifikation zur Anerkennung der Befähigung: Flexible Leiterplatten ohne DurchverbindungenSpécification particulière d'agrément: Cartes imprimées souples sans connexions transversalesCapability Detail Specification: Flexible printed boards without through connections31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je is
...

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