SIST EN IEC 61189-2-803:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board

This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).

Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von Basismaterialien und Leiterplatten

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées

L'IEC 61189-2-803:2023 définit une méthode d'essai pour déterminer la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées en utilisant un analyseur thermomécanique (TMA - thermomechanical analyser).

Preskusne metode za električne materiale, tiskana vezja in druge povezovalne strukture in sestave - 2-803. del: Metode za preskušanje raztezanja po osi Z tankih podložnih materialov

Ta del standarda IEC 61189 določa preskusno metodo za ugotavljanje raztezanja po osi Z tankih podložnih materialov s termomehanskim analizatorjem (TMA).

General Information

• Status: Published
• Public Enquiry End Date: 26-Jan-2022
• Publication Date: 09-Oct-2023
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 20-Sep-2023
• Due Date: 25-Nov-2023
• Completion Date: 10-Oct-2023
• Ref Project: EN IEC 61189-2-803:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Overview

EN IEC 61189-2-803:2023 (also published as IEC 61189-2-803:2023) is a CLC-adopted test method standard that specifies how to measure the Z‑axis expansion of base materials and printed boards using a thermomechanical analyser (TMA). The method defines specimen preparation, TMA setup, temperature scanning, preconditioning, data points around the glass transition (Tg) and calculation of both coefficient of thermal expansion (CTE) and percentage Z‑axis expansion (notably between 50 °C and 260 °C).

Key topics and technical requirements

• Scope: Measurement of out‑of‑plane (Z‑axis) dimensional change of unclad laminate or printed circuit board specimens with no internal conductors.
• Specimens:
  • Typical size ≈ 6.35 mm × 6.35 mm, minimum thickness 0.51 mm.
  • Copper must be fully etched away; sample taken ≥ 25 mm from board edge.
  • Minimum of two specimens from random locations; edges smoothed without inducing stress.
• Preconditioning and environmental control:
  • Precondition 2 h ± 0.25 h at 105 °C ± 2 °C, then cool in a low‑humidity cabinet (<30 % RH at 23 °C).
• TMA apparatus and settings:
  • TMA capable of dimensional resolution ±0.001 mm.
  • Probe force between 1 mN and 100 mN.
  • Start temperature ≤ 30 °C; scan rate 10 °C/min (unless otherwise specified).
  • Continue scan up to 260 °C (or other soldering‑representative temperature).
• Data and calculations:
  • TMA output identifies points: A (near room temp), B and C (either side of Tg), D (soldering temp).
  • The standard defines how to calculate CTE below and above Tg from these points and how to compute percentage Z‑axis expansion across the 50–260 °C range.
• Reporting: Required items include test method reference, operator, date, material ID, initial thickness, lab conditions, scan rate, calculated Z‑axis expansion values, specimen configuration and any deviations.

Applications and users

This test method is practical for:

• PCB and laminate material manufacturers validating out‑of‑plane thermal behavior.
• Electronics assemblers and OEMs evaluating material suitability for soldering and reflow processes.
• Reliability, QA and failure‑analysis labs assessing dimensional stability during thermal cycling.
• Material selection teams comparing laminates by Z‑axis expansion, CTE, and Tg behaviour to avoid pad lift, delamination or solder joint stress.

Related standards

• Normative reference: IEC 60194-1 (Printed boards vocabulary, Part 1).
• Part of the IEC 61189 series of test methods for electrical materials and printed boards.

Keywords: EN IEC 61189-2-803:2023, Z‑axis expansion, thermomechanical analyser, TMA, printed boards, base materials, CTE, glass transition, Tg, soldering temperature, PCB testing, CLC.

Standards Content (Sample)

SLOVENSKI STANDARD
01-november-2023
Preskusne metode za električne materiale, tiskana vezja in druge povezovalne
strukture in sestave - 2-803. del: Metode za preskušanje raztezanja po osi Z tankih
podložnih materialov
Test methods for electrical materials, printed board and other interconnection structures
and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and
printed board
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen – Teil 2-803: Prüfverfahren für die Z-Achsen-Ausdehnung von
Basismaterialien und Leiterplatten
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la
dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
Ta slovenski standard je istoveten z: EN IEC 61189-2-803:2023
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61189-2-803

NORME EUROPÉENNE
EUROPÄISCHE NORM September 2023
ICS 31.180
English Version
Test methods for electrical materials, printed boards and other
interconnection structures and assemblies - Part 2-803: Test
methods for Z-axis expansion of base materials and printed
boards
(IEC 61189-2-803:2023)
Méthodes d'essai pour les matériaux électriques, les cartes Prüfverfahren für Elektromaterialien, Leiterplatten und
imprimées et autres structures d'interconnexion et andere Verbindungsstrukturen und Baugruppen - Teil 2-
ensembles - Partie 2-803: Méthodes d'essai pour la 803: Prüfverfahren für die Z-Achsen-Ausdehnung von
dilatation suivant l'axe Z des matériaux de base et des Basismaterialien und Leiterplatten
cartes imprimées (IEC 61189-2-803:2023)
(IEC 61189-2-803:2023)
This European Standard was approved by CENELEC on 2023-08-30. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61189-2-803:2023 E

European foreword
The text of document 91/1760/CDV, future edition 1 of IEC 61189-2-803, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61189-2-803:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-05-30
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-08-30
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61189-2-803:2023 was approved by CENELEC as a
European Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60194-1 -  Printed boards design, manufacture and - -
assembly - Vocabulary - Part 1: Common
usage in printed board and electronic
assembly technologies
IEC 61189-2-803 ®
Edition 1.0 2023-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 2-803: Test methods for Z-axis expansion of base materials and printed

boards
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux

de base et des cartes imprimées

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180  ISBN 978-2-8322-7264-0

– 2 – IEC 61189-2-803:2023 © IEC 2023
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Preparation of test specimens . 5
5 Test specimens . 5
6 Test apparatus . 6
7 Test procedure . 6
8 Calculation . 6
9 Report . 7
Bibliography . 8

Figure 1 – Example TMA data output . 6

IEC 61189-2-803:2023 © IEC 2023 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND
OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –

Part 2-803: Test methods for Z-axis expansion of base materials and
printed boards
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory wor
...